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| Part Number: | MPC8270CZUQLDA |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC MPU MPC82XX 333MHZ 480TBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $16.6664 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - I/O | 3.3V |
| USB | USB 2.0 (1) |
| Supplier Device Package | 480-TBGA (37.5x37.5) |
| Speed | 333MHz |
| Series | MPC82xx |
| Security Features | - |
| SATA | - |
| RAM Controllers | DRAM, SDRAM |
| Package / Case | 480-LBGA Exposed Pad |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C (TA) |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Mounting Type | Surface Mount |
| Graphics Acceleration | No |
| Ethernet | 10/100Mbps (3) |
| Display & Interface Controllers | - |
| Core Processor | PowerPC G2_LE |
| Co-Processors/DSP | Communications; RISC CPM |
| Base Product Number | MPC8270 |
| Additional Interfaces | I²C, SCC, SMC, SPI, UART, USART |




Engineers designing for robust networking or telecommunication systems frequently require high-performance, versatile embedded processors. The NXP MPC8270CZUQLDA is part of the MPC82xx family—a popular PowerQUICC II microprocessor series intended for integrated communications processing. Building on the PowerPC G2_LE core architecture, the MPC8270CZUQLDA offers a single, 32-bit core running at up to 333 MHz in a compact 480-ball TBGA package. While the series is now considered obsolete, its technical capabilities still stand out for legacy and ongoing industrial applications where proven reliability and multi-protocol communications are requirements.
At the heart of the MPC8270CZUQLDA is the PowerPC G2_LE architecture, a dual-issue integer core based on the EC603e microprocessor. The device integrates a system memory management unit (MMU) compliant with Power Architecture®, as well as separate 16 KB instruction and data caches utilizing a four-way set associative, LRU replacement strategy. The processor supports clock multipliers for both the core and the communication processor module (CPM), allowing for fine-grained trade-offs in power efficiency and performance.
The advanced communications processor module (CPM) uses a dedicated 32-bit RISC architecture, featuring 32 KB dual-port data and instruction RAM for high-speed data exchange between core and CPM. It supports direct memory access through serial DMA channels, enhancing data movement for networking operations. Glueless interfaces to various memory types, including SRAM, SDRAM, DRAM, EPROM, and Flash, simplify system board design and reduce the total number of external logic components.
In terms of connectivity, the MPC8270CZUQLDA is engineered for multi-protocol environments. Its three fast communications controllers (FCC) support up to three 10/100-Mbit Ethernet transceivers, interfacing through both standard MII and RMII. With four serial communications controllers (SCC) and one multichannel controller (MCC), the device manages up to 128 serial, full-duplex channels and can multiplex these for time-division multiplexed (TDM) or custom interfaces.
Other integration highlights include a USB 2.0 full/low speed controller supporting both host and slave modes, SPI, I2C, SMC, UART, and USART interfaces. The memory controller supports up to 12 memory banks with programmable chip selects and parity/ECC handling. PCI support up to 66 MHz, compliant with PCI Specification Revision 2.2, enables straightforward integration with peripheral I/O systems, and built-in DMA engines provide robust data streaming capabilities.
The MPC8270CZUQLDA operates within an industrial temperature range of -40°C to 105°C, ensuring reliability under harsh environmental conditions. Core and PLL supply voltages range from 1.45 to 1.60 V, while I/O operates at 3.135 to 3.465 V. The device incorporates ESD protection and is designed for applications requiring stringent reliability standards, with specific guidelines governing overshoot and undershoot voltage tolerances.
Absolute maximum ratings include a core voltage maximum of 2.25 V, I/O up to 4 V, and junction temperatures up to 120°C. For proper system operation, all voltages should remain within the recommended operating ranges, and unused inputs should be tied to a logic level to ensure correct functionality and minimize risk.
NXP offers the MPC8270CZUQLDA in a 480-ball TBGA package (37.5 x 37.5 mm), with options for both leaded and lead-free variants, accommodating diverse manufacturing standards. Its robust surface-mount form factor makes it suitable for high-vibration industrial and networking environments. Moisture Sensitivity Level rating is MSL 4 (72 hours), indicating the level of care required during reflow and handling. RoHS compliance is not supported for this model; procurement engineers should be aware of local regulations regarding hazardous substances in electronic assemblies. The device is REACH unaffected, with export control classification under ECCN 5A991B4B and harmonized tariff code 8542.31.0001.
The MPC8270CZUQLDA is optimized for embedded systems requiring sophisticated networking, telecommunications, and multi-protocol communications functionality. Its comprehensive protocol support—including HDLC, SDLC, UART, Ethernet, and USB—makes it ideal for gateway, switch, router, and industrial control applications.
When selecting the MPC8270CZUQLDA, engineers should consider system requirements for cache size, DMA features, and flexibility in serial and parallel interface designs. The ability to independently configure core and communication processor frequencies allows for tailored power and performance balance, which can be especially significant in modular designs or power-constrained installations. Glueless memory controller support, alongside robust DMA and streaming capabilities, simplify board layouts and help reduce BoM costs.
As the MPC8270CZUQLDA is classified as obsolete, engineers planning new developments or seeking long-term supply should evaluate alternate models within the PowerQUICC II family. The MPC8275 and MPC8280 provide similar architectures, with the MPC8280 offering additional high-end features such as UTOPIA II ports, more TDM interfaces, and enhanced inverse multiplexing ATM capabilities. These models share the software and development tools ecosystem of the MPC8270CZUQLDA, facilitating migration in legacy applications.
The NXP MPC8270CZUQLDA remains a technically compelling solution for embedded communications processing, distinguished by its rich protocol support, robust memory interfacing, and flexible architecture. Although the series is obsolete, its proven functionality and reliability continue to serve legacy installations and specific industrial applications. For engineers and procurement professionals, a careful review of application requirements and potential alternates within the PowerQUICC II family ensures optimal performance and future-ready supply chain management.
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MPC8270CZUQLDANXP USA Inc. |
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