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| Part Number: | EP3SE260F1152C3NES |
|---|---|
| Manufacturer/Brand: | BGA1152 |
| Part of Description: | EP3SE260F1152C3NES BGA1152 |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Package | 08 |
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Product Attribute | Attribute Value |
|---|---|
| Lead Time | 2-3days after payment. |
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




EP3SE260F1152C3NES
BGA1152
Y-IC is a reliable and quality distributor for BGA1152, committed to delivering the best products and professional service to our customers.
EP3SE260F1152C3NES belongs to the family of advanced Integrated Circuits (ICs) in BGA1152 package. It is a specialized, high-performance hot IC used in demanding electronic applications, ensuring efficient and reliable performance.
High pin count BGA1152 package
Large-scale integration for superior performance
Optimized power handling
Advanced thermal reliability
Supports fast signal processing
Designed for specialized and industrial electronic systems
Handles complex processing tasks efficiently
Stable performance even under heavy workloads
Compact design fits high-density PCBs
Excellent heat dissipation characteristics
Extends system reliability and lifespan
Compatible with a wide range of system designs
Type: Ball Grid Array (BGA)
Pin configuration: 1152 balls for dense connectivity
Material: Advanced plastic/resin, suitable for surface mounting
Size: Standardized for automated assembly
Thermal characteristics: Excellent heat dissipation for high-load operations
Electrical properties: Supports high-speed and low power operation
The EP3SE260F1152C3NES is currently in production; no official notice of discontinuation.
For compatible or alternative models, please reach out to our sales team through our website for up-to-date information and expert advice. We will promptly assist with any cross-references or substitutions required.
High-speed computing systems
Communication infrastructure
Industrial automation
Instrumentation and control equipment
Defense and aerospace electronics
Advanced embedded system solutions
The most authoritative and updated datasheet for EP3SE260F1152C3NES is available on our website. We highly recommend customers download the datasheet directly from this page for comprehensive technical and functional details.
Get a Quote today on our website for EP3SE260F1152C3NES! Don’t miss out—Learn More or take advantage of our Limited Time Offer now! Click through to secure quality parts and industry-leading service from Y-IC.
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EP3SE260F1152C3NESBGA1152 |
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