DIALOG 338S0942-AO

Mfr. Part

338S0942-AO

Manufacturer

Dialog Semiconductor

Y-IC is a quality distributor of Dialog Semiconductor and we will provide the best products and services for your project

Detailed Description

338S0942-AO is a specialized integrated circuit used in high-volume consumer and mobile designs

Main category Integrated Circuits

Small classification Specialized ICs

Package BGA for dense layouts and high pin count

This model is OEM specific so exact functions and pinout are controlled by the original device maker

Use the datasheet on our website for exact electrical limits pinout and assembly guidance

Key Features

High integration to save board space

Compact BGA footprint for smartphone grade PCB density

Low power design typical of mobile ICs

Supports complex system power sequencing and control common in PMIC or controller roles

Compatible with standard lead free SMT and reflow processes

Industry aligned ESD and moisture handling for BGA devices

Key Advantages

Smaller PCB area and reduced BOM through high integration

Ball grid array gives strong electrical performance and better heat spreading

Reliable sourcing through Y-IC with 1127 units currently in stock

Fast logistics and technical support from Y-IC

Lower risk of counterfeit parts by buying from a trusted distributor

Packaging

Type BGA ball grid array

Package or Case 869 vendor code reference confirm details in the datasheet

Material Molded epoxy over BT or organic substrate with lead free SAC solder balls

Size Compact mobile footprint exact dimensions to be confirmed in the datasheet

Pin configuration High density ball matrix with multiple rows OEM specific pinout refer to the datasheet

Thermal characteristics Ball field helps spread heat use copper planes and thermal vias follow the recommended reflow profile to avoid warpage

Electrical properties Short interconnect paths reduce inductance and resistance high pin count supports multiple rails and control signals signal integrity depends on good PCB layout

Lifecycle

Public lifecycle status for this OEM specific part is not disclosed

Availability may vary by build cycles and regions Y-IC tracks stock and last time buy windows

No exact drop in equivalents are available for 338S custom series parts

If you need alternatives or a second source please contact our sales team via the Y-IC website for an engineering review and compatible options

Key Application Areas

Smartphone and tablet main boards for power management and system control

Portable consumer electronics wearables and multimedia devices

High density embedded systems needing compact PMIC or controller solutions

Datasheet

Y-IC hosts the most authoritative datasheet for 338S0942-AO on our website

Download it on this page for pinout guidelines electrical limits assembly notes and test information

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