INFINEON 338S0626

Mfr. Part

338S0626

Manufacturer

Cypress Semiconductor (Infineon Technologies)

Y-IC is a quality distributor of this brand and we will provide you with the best products and services.

Detailed Description

Specialized integrated circuit for high-volume embedded and consumer designs, supplied in a BGA package. Category: Integrated Circuits (ICs). Classification: Specialized ICs. Typical use in compact boards needing high pin-count connectivity and stable performance. Current available quantity: 9183 units.

Key Features

BGA package for compact footprint and high I/O density

Optimized for embedded and consumer electronics

Stable operation and reliable interconnect for high-volume production

Designed for modern assembly lines with automated optical inspection and reflow

ESD-safe handling and manufacturing readiness

Backed by Infineon (Cypress) ecosystem and long-standing quality standards

Key Advantages

Space-saving BGA form factor enables smaller PCB designs

High ball-count potential supports complex interfaces

Good electrical integrity with short interconnects

Strong supply chain support through Infineon and quality distribution by Y-IC

Scalable for mass production with consistent yields

Packaging

Type: BGA (Ball Grid Array)

Package / Case: 869 (manufacturer case code)

Material: Molded epoxy over silicon die, BT resin or equivalent substrate, lead-free SAC solder balls

Size: Compact BGA footprint; exact dimensions depend on specific revision (see datasheet)

Pin configuration: Ball grid array; ball count and pitch specified in the datasheet

Thermal characteristics: Follow JEDEC guidelines; θJA and θJC depend on board layout, copper area, and airflow

Electrical properties: CMOS device; operating voltage, interface levels, and timing parameters are defined in the datasheet; observe signal integrity best practices

Compliance: Lead-free/RoHS status depends on manufacturing lot; confirm on the datasheet or with Y-IC

Handling: ESD precautions required; ship in moisture barrier packaging with desiccant and HIC where applicable

Lifecycle

Status: Active status not publicly confirmed; availability currently strong with 9183 units in stock at Y-IC

Discontinuation: No official notice of end-of-life found; lifecycle may evolve following Infineon’s acquisition of Cypress

Equivalents or alternatives: No publicly documented 1:1 drop-in replacement for 338S0626. Functional alternatives may exist depending on the target application, but they require engineering review and pinout comparison.

Recommendation: Contact Y-IC via our website for cross-reference support and the latest lifecycle updates. Our sales and technical teams can propose vetted alternatives where appropriate.

Key Application Areas

Smartphones and tablets

Consumer electronics and portable devices

IoT edge nodes and embedded modules

Communication interfaces and controllers

Industrial embedded boards needing compact, high-density interconnects

Datasheet

Our website provides the most authoritative datasheet for the current product model. For accurate specifications (pinout, electrical limits, timing, thermal data, mechanical drawings), download the datasheet on this page now.

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