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| Part Number: | S29GL256S90TFA010 |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC FLASH 256MBIT PARALLEL 56TSOP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.5268 |
| 200+ | $0.2042 |
| 500+ | $0.1971 |
| 910+ | $0.1942 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | 60ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NOR |
| Supplier Device Package | 56-TSOP |
| Series | GL-S |
| Package / Case | 56-TFSOP (0.724', 18.40mm Width) |
| Package | Tray |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Non-Volatile |
| Memory Size | 256Mbit |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel |
| Memory Format | FLASH |
| Base Product Number | S29GL256 |
| Access Time | 90 ns |




The Infineon S29GL256S90TFA010 is a 256Mbit (32MB), parallel NOR flash memory implemented using Infineon’s advanced 65nm MIRRORBIT™ Eclipse process technology. The device is part of the GL-S family, sharing a common silicon foundation with densities ranging from 128Mb to 1Gb. This solution is aimed at applications demanding fast random and page-mode asynchronous read access, robust data integrity, and sophisticated sector protection, all while maintaining minimal power consumption. The S29GL256S90TFA010 operates from a single 3.0V supply, features a 16-bit data bus, and is supplied in a space-saving 56-pin TSOP package, targeting industrial and automotive applications where reliability and longevity are paramount.
The S29GL256S90TFA010 implements a uniform sector architecture, dividing the 256Mb flash array into 256 sectors of 128KB each. All read and write operations are organized on word boundaries, with the 16-bit-wide data bus allowing efficient transfer cycles. The device's architecture includes several dedicated address spaces beyond the main flash array—support for ID/CFI, secure silicon region (SSR), lock register, persistent protection bits (PPB), password storage, and dynamic protection bits (DYB). These regions are overlaid into the visible address space as needed through specialized command sequences.
The memory supports asynchronous random and page-mode reads, with each page comprising 32 bytes aligned on the address boundary for optimized sequential access. Write operations leverage a 512-byte programming buffer, enabling data to be programmed in word increments up to the buffer’s maximum size before committing to the flash array. The use of an embedded algorithm controller (EAC) abstracts the complexity of program and erase sequences, making the device easy to integrate with minimal host CPU overhead.
The S29GL256S90TFA010 provides a set of distinguishing features for high-reliability embedded and code storage applications:
65nm MIRRORBIT™ Eclipse CMOS process, ensuring a balance of high density and low power consumption.
0V single supply operation for all functions (reads, programs, erases).
Versatile I/O (VIO) range of 1.65V to VCC, enabling flexible system interface compatibility.
Fast random read (90ns typical) and page-mode accesses (down to 15ns).
512-byte programming buffer for high-throughput write operations.
Advanced hardware ECC (error correction code) with automatic single-bit correction per page.
Suspend and resume functionality for both program and erase, supporting real-time system operation during long memory modifications.
Comprehensive status feedback: status register, ready/busy pin, and data polling.
Uniform 128KB sectors with both volatile and non-volatile (OTP) protection mechanisms.
CFI-compliance for universal driver support, and JEDEC-standard hardware identification.
Industrial and automotive grades available (–40°C to +85°C, and up to +105°C for enhanced temperature requirements).
Data retention of 20 years and maximum 100,000 program/erase cycles per sector.
Data integrity and security are critical in modern embedded systems, which depend on reliable storage of both code and configuration data. The S29GL256S90TFA010 addresses these requirements with multiple, layered protection mechanisms:
Persistent Protection Bits (PPB): Non-volatile sector-level locks, programmable to protect against unintended program/erase events, erasable only as a group.
Dynamic Protection Bits (DYB): Volatile sector-level locks, which can be set or cleared at runtime under software control.
PPB Lock: Volatile global lock for all PPB bits—configurable for password or persistent unlock management.
Secure Silicon Region (SSR): 1024 bytes of one-time-programmable (OTP) memory, split into factory-protected and customer-programmable segments, ideal for permanent device configuration or security data.
Password protection: A 64-bit hardware-programmed password can be required before altering PPB lock state, with irreversible OTP locking of the password for heightened physical security.
Write protect (WP#): Hardware write-protect pin, independently securing the top or bottom sector, depending on the device model.
Together, these features enable fine-grained, multi-level locking suitable for both initial manufacturing, field upgrades, and in-field lockdown scenarios required by high-assurance applications.
The device features a host interface controller (HIC) and embedded algorithm controller (EAC) that cooperatively manage all array accesses. The read process supports both random-access and high-speed page-mode operations. Subsequent accesses to the same 32-byte page yield fast page-mode read times, optimizing performance in code execution-in-place (XIP) and data logging scenarios.
Programming utilizes a 512-byte write buffer to collect multiple write words prior to launching the embedded program sequence. This design expedites data transfer and lowers write latency. Programming at the word level is also supported for maximum flexibility, though ECC is disabled for pages that are rewritten incrementally.
Erase operations can be invoked for individual sectors or the entire chip. Sectors may be erased in parallel, with suspend and resume commands enabling the host system to temporarily halt the operation and access other areas of the array as required. The device also supports blank checking of sectors to verify erase status.
Core program and erase operations in the S29GL256S90TFA010 are managed internally by the EAC, which abstracts command interpretation, sequence timing, error detection, and status indication from the host processor.
Status and operation monitoring are accessible through several methods:
Status Register: 16-bit register capturing completion, error, and suspension states for embedded algorithms.
Data Polling: DQ7, DQ6, DQ2, DQ3, DQ5, and DQ1 signal bits indicate progress, errors, and completion of ongoing embedded operations, readable at designated addresses.
Ready/Busy# (RY/BY#): Open-drain output signals device operation status, facilitating hardware-level integration and polling in time-critical systems.
Automatic ECC calculation and checking occur during every program and initial page read operation, with single-bit correction performed transparently. Programming a page more than once disables ECC for that page until the next erase.
The device also integrates command abort, error clear, and reset sequences, ensuring robust recovery and fault containment during abnormal operations or system resets.
The S29GL256S90TFA010 interface is designed for direct parallel connection to 16-bit system buses, with separate address and data lines. The versatile I/O (VIO) pin allows interface level selection (1.65V to VCC), promoting compatibility with a broad range of controllers.
Key timing characteristics include:
90ns random access (tACC) and as low as 15ns page-mode access (tPACC).
Page-mode read enabled on 32-byte boundary, ideal for software code fetches and array sequential reads.
Low active and standby currents, plus automatic sleep mode based on stable address detection.
Power-on and brownout detection features that ensure the device cannot be inadvertently programmed or erased during supply voltage transitions.
All inputs are CMOS/TTL-compatible. Output drive profiles and input noise margin allow reliable high-speed system operation in electrically noisy environments. The device is JEDEC JESD78C latchup compliant and operates over the industrial or automotive temperature range.
The S29GL256S90TFA010 is supplied in a 56-pin Thin Small Outline Package (TSOP), supporting high-density PCB layouts and surface-mount reflow processes. Other S29GL-S family variants support multiple FBGA options, allowing for flexible design migration across densities.
Reference footprints, JEDEC-compliant designs, and detailed pin assignments are provided to facilitate seamless hardware integration.
Reliability data for the S29GL256S90TFA010 shows sector erase endurance of 100,000 cycles, with 20-year data retention at recommended operating conditions. The available automotive (AEC-Q100) and enhanced industrial grades enable deployment in harsh environments, including extended temperature operation (up to +105°C), making the part suitable for both on-board vehicle and demanding industrial applications.
Engineers seeking equivalent or alternate models within the Infineon NOR flash portfolio can consider the following MIRRORBIT™ Eclipse-based options, which share similar control logic, pinouts, and operating modes:
S29GL128S: 128Mbit version (fewer sectors, otherwise functionally similar)
S29GL512S: 512Mbit version (twice the array size, same sector organization)
S29GL01GS: 1Gbit version (largest capacity in the GL-S family, identical command and interface compatibility)
All these models are pinout and command-set compatible, providing scalability for product lines with varying memory requirements.
The Infineon S29GL256S90TFA010 presents product selection engineers and procurement professionals with a robust, mature solution for embedded code and data storage. Its 256Mbit capacity, advanced protection mechanisms, flexible voltage and interface configurations, industry-standard packaging, and automotive qualification make it an ideal candidate for embedded, automotive, and deeply embedded industrial applications. With forward and backward compatibility across the S29GL-S portfolio, long-term support, and exceptional reliability, this device serves as a highly dependable building block for both new designs and ongoing product lifecycle management.
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