INFINEON 338S0353

Mfr. Part

338S0353

Manufacturer

Cypress Semiconductor (Infineon Technologies)

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Detailed Description

Specialized IC from Infineon (Cypress) under Integrated Circuits (ICs) → Specialized ICs

Package type: BGA, 869-ball case

Designed for high-density interconnect and compact layouts

Full function, pin map, and limits are defined in the official datasheet for 338S0353

Key Features

High integration in a compact BGA package

869-ball array supports many signals and power rails in one device

Low profile and small footprint for dense PCB designs

BGA layout helps signal integrity at higher speeds

Manufacturing-friendly with standard BGA assembly and reflow

Environmental compliance options available; confirm per lot documentation

Key Advantages

Saves board space while increasing I/O density

Can consolidate multiple functions into one IC, reducing BOM and complexity

Improved routing and impedance control over leaded packages

Robust thermal path through solder balls into PCB planes

Backed by Infineon/Cypress ecosystem and Y-IC’s supply and support

Packaging

Type: BGA (Ball Grid Array)

Case: 869-ball configuration

Materials: Epoxy mold compound over silicon die; lead-free solder balls on most lots (verify on COC/COA)

Mechanical size: See datasheet mechanical drawing for body size and ball pitch

Pin/ball map: 869 positions; exact assignment and keep-outs are in the datasheet

Shipping: Tray or tape-and-reel depending on lot; ESD-safe packaging

Thermal notes: Use thermal vias and solid copper planes under power/ground balls; follow JEDEC J-STD-020 reflow profile

Electrical notes: Operating voltages, I/O levels, timing, leakage, ESD ratings, and test limits are specified in the datasheet; handle as ESD-sensitive

Lifecycle

Current status: Not publicly flagged as near end-of-life. Availability can vary because this is a specialized IC

Direct drop-in equivalents: None publicly listed

Alternatives: Possible family-related or functionally similar parts may exist, but require full pin/function and mechanical review

Next step: If you need an alternative or lifecycle confirmation, contact our sales team via the Y-IC website. We can help find compatible options or plan last-time buys

Key Application Areas

Smartphones, tablets, and other consumer devices with dense I/O needs

Embedded and IoT systems integrating custom control or interface logic

Communication equipment and modules where compact, high-pin-count ICs are required

Industrial electronics with strict space and interconnect requirements

Datasheet

Y-IC hosts the most authoritative datasheet for 338S0353 on the product page. Download it now for absolute maximum ratings, pin map, electrical specs, mechanical drawings, and assembly guidelines

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