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| Part Number: | FQD20N06TM |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | MOSFET N-CH 60V 16.8A DPAK |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $1.1092 |
| 10+ | $0.9389 |
| 30+ | $0.8444 |
| 100+ | $0.7399 |
| 500+ | $0.6455 |
| 1000+ | $0.624 |
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| Product Attribute | Attribute Value |
|---|---|
| Vgs(th) (Max) @ Id | 4V @ 250µA |
| Vgs (Max) | ±25V |
| Technology | MOSFET (Metal Oxide) |
| Supplier Device Package | TO-252AA |
| Series | QFET® |
| Rds On (Max) @ Id, Vgs | 63mOhm @ 8.4A, 10V |
| Power Dissipation (Max) | 2.5W (Ta), 38W (Tc) |
| Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Package | Tape & Reel (TR) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Input Capacitance (Ciss) (Max) @ Vds | 590 pF @ 25 V |
| Gate Charge (Qg) (Max) @ Vgs | 15 nC @ 10 V |
| FET Type | N-Channel |
| FET Feature | - |
| Drive Voltage (Max Rds On, Min Rds On) | 10V |
| Drain to Source Voltage (Vdss) | 60 V |
| Current - Continuous Drain (Id) @ 25°C | 16.8A (Tc) |
| Base Product Number | FQD20N06 |




The FQD20N06TM is a high-performance N-channel enhancement mode power MOSFET manufactured by ON Semiconductor (originally developed by Fairchild Semiconductor). Designed for demanding power switching applications, this device features a maximum drain-source voltage (V_DS) of 60V and a continuous drain current (I_D) up to 16.8A (with appropriate thermal conditions). Engineered for surface mount integration, the FQD20N06TM is packaged in the TO-252AA (DPAK) format, supporting efficient board assembly and robust thermal management. Its compact form factor and rugged design make it a reliable choice for switched-mode power supplies, DC motor drivers, audio amplifiers, and other high-current switching applications.
The FQD20N06TM delivers a compelling mix of voltage and current capacity that suits a broad range of industrial and consumer applications. Its maximum R_DS(on) is 63mΩ (measured at V_GS=10V, I_D=8.4A), enabling low conduction losses and high efficiency. The device exhibits a typical gate charge of only 11.5nC and a typical reverse transfer capacitance (Crss) of 25pF, making it well-suited for fast switching circuits. In terms of thermal handling, the FQD20N06TM can dissipate up to 38W when mounted on a suitable heatsink (T_C case), with a thermal resistance junction-to-case (R_θJC) consistently supporting high-reliability operation. The device is also rated for a pulsed avalanche current and is 100% avalanche tested, verifying its robustness under transient energy conditions.
The FQD20N06TM leverages ON Semiconductor’s (formerly Fairchild Semiconductor’s) proprietary planar stripe and DMOS technology. This advanced process yields lower on-state resistance and enhances switching performance compared to standard MOSFET architectures. It also provides high avalanche capability, critical for applications requiring reliable operation during power transients or energy surges, such as inductive load switching. Importantly, these features enable engineers to design more efficient, compact, and resilient systems, reducing energy loss and component stress under dynamic operating conditions.
Through its typical characteristics, the FQD20N06TM demonstrates reliable and efficient behavior critical for modern power design:
On-region and transfer characteristics show consistent R_DS(on) performance across varying drain currents and gate voltages, which simplifies gate drive requirements and improves predictability in automated systems.
Capacitance and gate charge characteristics support applications with high-frequency switching, such as flyback or buck converters, while fast switching waveforms minimize losses and electromagnetic interference.
The device maintains stable operation over temperature, with breakdown voltage and on-resistance showing manageable dependency, providing confidence for engineers designing for automotive, industrial, or outdoor environments.
The avalanche energy capability is particularly valuable in applications requiring handling of flyback events from inductive loads such as motors, relays, or transformer primaries.
Packaged in the industry-standard TO-252 (DPAK), the FQD20N06TM is optimized for surface mount assembly. This package offers a low-profile solution with effective heat transfer, making it ideal for designs with space or height constraints. Layout guidelines, consistent with the IPC7351A and JEDEC specifications, recommend board land patterns that maximize thermal dissipation and electrical performance. Engineers should ensure adequate copper area on the PCB for heatsinking to exploit the device’s maximum power dissipation capabilities. The mold design, lead configuration, and manufacturing tolerance guarantee compatibility with automated assembly processes common in high-volume production.
The FQD20N06TM adheres to stringent industry standards for environmental and quality compliance. It is fully RoHS3 compliant, verifying the exclusion of hazardous substances, and is characterized by a Moisture Sensitivity Level (MSL) rating of 1, indicating unlimited floor life in standard storage conditions. The device is unaffected by REACH regulations and classified as EAR99 for export control, simplifying international supply chain management. ON Semiconductor’s anti-counterfeiting measures and traceability guarantee that procurement teams can secure genuine, high-quality parts—an essential factor for long-term reliability in mission-critical systems.
While the FQD20N06TM is recognized for its blend of voltage, current, and efficiency parameters, there may be circumstances where product obsolescence or supply chain disruptions require engineers to consider alternatives. Equivalent models must match or exceed the 60V V_DS, 16.8A I_D, and low R_DS(on) specifications, ideally in the TO-252 package for form-factor compatibility. Some close alternatives may include other ON Semiconductor N-channel MOSFETs with the QFET® or similar DMOS structure, or products from reputable suppliers adhering to the same maximum ratings and qualification standards. Detailed datasheet cross-referencing is strongly recommended when evaluating replacements to ensure electrical, mechanical, and regulatory fit for purpose.
The FQD20N06TM N-channel power MOSFET from ON Semiconductor stands out for its combination of advanced technology, high reliability, and efficient switch performance in surface-mount power electronics applications. With its robust electrical ratings, proven thermal characteristics, and comprehensive compliance profile, this device empowers engineers to realize compact, reliable, and high-efficiency designs in industrial, automotive, and consumer systems. Awareness of equivalent models further secures design flexibility for procurement and risk management. The FQD20N06TM remains a relevant and trusted component in the evolving power management landscape.
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