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| Part Number: | FDMC86260 |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | MOSFET N CH 150V 5.4A POWER 33 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $1.2747 |
| 10+ | $1.2473 |
| 30+ | $1.2286 |
| 100+ | $1.2099 |
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| Product Attribute | Attribute Value |
|---|---|
| Vgs(th) (Max) @ Id | 4V @ 250µA |
| Vgs (Max) | ±20V |
| Technology | MOSFET (Metal Oxide) |
| Supplier Device Package | Power33 |
| Series | PowerTrench® |
| Rds On (Max) @ Id, Vgs | 34mOhm @ 5.4A, 10V |
| Power Dissipation (Max) | 2.3W (Ta), 54W (Tc) |
| Package / Case | 8-PowerWDFN |
| Package | Tape & Reel (TR) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Input Capacitance (Ciss) (Max) @ Vds | 1330 pF @ 75 V |
| Gate Charge (Qg) (Max) @ Vgs | 21 nC @ 10 V |
| FET Type | N-Channel |
| FET Feature | - |
| Drive Voltage (Max Rds On, Min Rds On) | 6V, 10V |
| Drain to Source Voltage (Vdss) | 150 V |
| Current - Continuous Drain (Id) @ 25°C | 5.4A (Ta), 16A (Tc) |
| Base Product Number | FDMC86260 |




The FDMC86260, manufactured by onsemi, is an advanced N-Channel MOSFET engineered primarily for high-performance power management and DC-DC conversion applications. Utilizing onsemi’s proprietary POWERTRENCH process with Shielded Gate technology, this device offers an optimal balance of high voltage tolerance, low on-resistance, and efficient switching, essential for modern compact power systems. Housed in a space-saving WDFN8 3.3 x 3.3 mm Surface Mount package, the FDMC86260 aims to deliver reliable operation in both thermal- and current-intensive environments, underlining its suitability for demanding engineering designs.
At the core of the FDMC86260 is onsemi’s advanced POWERTRENCH process, which incorporates Shielded Gate MOSFET technology. This process significantly lowers R_DS(on), resulting in reduced conduction losses and improved system efficiency. Key features of the FDMC86260 onsemi MOSFET include:
High breakdown voltage up to 150 V, supporting robust operation in high-voltage rails.
Maximum R_DS(on) values of 34 mΩ at V_GS = 10 V, I_D = 5.4 A, and 44 mΩ at V_GS = 6 V, I_D = 4.8 A.
100% Unclamped Inductive Load (UIL) testing ensures rugged reliability in switching events.
Compliance with the most recent RoHS and halide-free requirements.
Compact WDFN8 package (3.3 x 3.3 mm), optimized for surface mounting and high-density layouts.
Shielded Gate technology not only lowers on-resistance but also contributes to superior switching characteristics and improved electromagnetic interference (EMI) performance, which are crucial in tightly regulated power supply environments.
Performance-driven engineers will appreciate the detailed electrical profile of the FDMC86260 onsemi MOSFET. The component supports a continuous drain current of up to 5.4A at 25°C in free air, with thermal enhancements raising this limit to 16A when mounted to an appropriately designed PCB heat sink (case temperature control). The device also achieves a maximum power dissipation of 2.3W (ambient) and up to 54W (with proper case dissipation).
The switching and dynamic characteristics of the FDMC86260 onsemi MOSFET are optimized for efficient conversion:
Typical gate charge and capacitance values minimize losses during rapid switching cycles.
Transfer characteristics and on-region profiles allow for predictable, stable performance across a range of gate voltages and operating temperatures.
The device provides enhanced avalanche robustness, meeting the needs of applications exposed to high-stress transient voltages.
Thermal management is a pivotal concern for high-power MOSFETs, and the FDMC86260 onsemi addresses this with its low junction-to-ambient (θ_JA) and junction-to-case (θ_JC) thermal resistance specifications. When mounted on a 1 in², 2 oz copper pad on an FR-4 board, a thermal resistance of 53°C/W is achieved, allowing for reliable power delivery without excessive heating. For layouts with minimal copper, θ_JA increases to 125°C/W, highlighting the importance of proper PCB design for thermal performance.
The 8-pin WDFN package, measuring 3.3 x 3.3 x 0.75 mm with a lead pitch of 0.65 mm, offers a combination of mechanical stability, compactness, and excellent thermal transfer characteristics. Detailed mounting, footprint recommendations, and labeling conventions are provided to ensure seamless integration into automated assembly lines.
The FDMC86260 onsemi MOSFET finds its primary application in DC-DC conversion circuits, where high efficiency and reliable operation are crucial. Example engineering use cases include:
Synchronous buck or boost converters in telecom and industrial systems, where 150V voltage standoff is needed.
High-density power supply modules for servers or base stations, where thermal constraints require efficient switching and low conduction losses.
Load switching and protection circuits, demanding robust avalanche energy handling and predictable turn-on/turn-off profiles.
Engineers should consider the FDMC86260’s SOA (Safe Operating Area) curves and maximum ratings when designing for pulsed and continuous current environments, ensuring system reliability and compliance with application-specific derating policies.
The FDMC86260 onsemi MOSFET is fully compliant with RoHS3, is halide-free, and is not affected by REACH directives, making it suitable for global manufacturing and export. Its MSL 1 (Moisture Sensitivity Level) rating means unlimited floor life at ≤30°C/85% RH, facilitating straightforward handling and assembly in production environments. Additionally, the component is 100% UIL tested, reflecting its robustness against real-world transient events and enhancing field reliability.
While the FDMC86260 onsemi MOSFET stands out for its Shielded Gate technology and low R_DS(on), engineers may sometimes need alternatives for second-sourcing or performance trade-offs. Equivalent or replacement models should be evaluated based on the following key parameters:
N-channel configuration
Voltage rating ≥150V
R_DS(on) at 10V ≤34 mΩ
Comparable package (WDFN8 or similar)
Similar or higher current/thermal capability
In practice, leading manufacturers of power MOSFETs offer devices in similar footprints and with comparable electrical ratings. Selection should also consider application nuances such as switching frequency requirements, gate drive compatibility, and mechanical constraints.
The FDMC86260 onsemi N-Channel MOSFET provides a compelling blend of advanced process technology, robust electrical performance, and compliance with modern industry standards. Its integration of Shielded Gate POWERTRENCH process, combined with a space-efficient package and rigorous reliability screening, positions it as a preferred solution for DC-DC converters and power management in demanding environments. Product selection engineers and procurement managers can reliably specify the FDMC86260 onsemi MOSFET for next-generation designs, with a clear understanding of its strengths, recommended usage, and potential substitution paths.
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