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| Part Number: | BSP52T3G |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | TRANS NPN DARL 80V 1A SOT223 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 5+ | $0.2451 |
| 50+ | $0.1951 |
| 150+ | $0.1737 |
| 500+ | $0.1469 |
| 2500+ | $0.135 |
| 4000+ | $0.1278 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 80 V |
| Vce Saturation (Max) @ Ib, Ic | 1.3V @ 500µA, 500mA |
| Transistor Type | NPN - Darlington |
| Supplier Device Package | SOT-223 (TO-261) |
| Series | - |
| Power - Max | 800 mW |
| Package / Case | TO-261-4, TO-261AA |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -65°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Frequency - Transition | - |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 2000 @ 500mA, 10V |
| Current - Collector Cutoff (Max) | 10µA |
| Current - Collector (Ic) (Max) | 1 A |
| Base Product Number | BSP52 |




The BSP52T3G from onsemi is a medium-power surface-mount NPN Darlington transistor, designed primarily for switching applications demanding high current gain. Housed in the robust SOT-223 (TO-261) package, this device is rated for 80 V collector-emitter voltage and can handle continuous collector currents up to 1 A with a maximum power dissipation of 800 mW. With its small footprint and medium power handling, BSP52T3G offers an efficient balance between board space and electrical performance, positioning it as a versatile building block for engineers working on relay, solenoid, lamp drivers, and medium-load switching circuits.
The BSP52T3G is engineered for reliability and application flexibility, with several distinguishing features:
Darlington Configuration: The NPN Darlington design provides exceptionally high current gain, minimizing the required base drive and simplifying drive circuitry for switching loads.
Surface-Mount SOT-223 Package: Well-suited for automated assembly, this package supports both wave and reflow soldering processes. The lead design mitigates thermal stress during soldering, improving device longevity and performance reliability.
Power Capabilities: Balancing compact form factor and robust electrical ratings, BSP52T3G is tailored for applications with moderate power needs within compact layouts.
Automotive and Industrial Grade: AEC–Q101 qualified and PPAP capable (with S Prefix), making it appropriate for automotive and demanding industrial environments.
RoHS, Halogen, and Lead-Free Compliance: Fully compliant with current environmental standards for hazardous substances, allowing deployment in eco-sensitive applications.
Package Availability: Provided in 12 mm tape and reel format suitable for high-volume manufacturing.
Complementary Device: The PNP counterpart, BSP62T1, is available for designs requiring complementary switching transistors.
Designers evaluating BSP52T3G will benefit from its well-defined electrical parameters:
Maximum ratings are 80 V for collector-emitter voltage (V_CEO), 1 A for collector current (I_C), and 800 mW for total power dissipation.
The Darlington pair structure results in a high DC current gain, supporting efficient signal amplification even at low base currents.
Typical switching and saturation characteristics are optimized for fast, efficient operation in relay and lamp driver circuits, reducing losses and heat.
Key figures of merit—such as collector-emitter saturation voltage and base-emitter saturation voltage—remain low, supporting energy-efficient switching with minimal voltage overhead.
The device’s bandwidth and switching performance are suitable for a wide range of general-purpose driver and small power amplifier applications.
Thermal management is critical for reliable transistor operation, especially in medium power surface-mount packages like SOT-223. BSP52T3G’s rated performance assumes mounting on FR-4 printed circuit boards with appropriately sized copper pads for heat dissipation. The package is engineered with formed leads that absorb mechanical and thermal stresses during soldering, thereby reducing the risk of die fracture or performance degradation over the device lifetime.
Engineers should ensure adequate PCB thermal design—such as maximizing copper under and around the device—to fully utilize the 800 mW power dissipation rating. It's also essential to observe onsemi’s recommended footprint, as deviations can impact both mechanical stability and heat transfer.
The BSP52T3G finds extensive use across several switching and amplification roles in modern electronics. Sample applications include:
Print hammer drivers in high-speed printers where rapid and reliable actuation is paramount.
Relay and solenoid drivers in industrial controls, where high current gain minimizes controller output requirements.
Lamp drivers in automotive dashboards and industrial indicator circuits, exploiting high gain for direct microcontroller interfacing.
Any compact embedded system that benefits from a medium-power, surface-mount switch with robust electrical and thermal ratings.
The BSP52T3G is manufactured to meet stringent global standards for safety, environmental, and automotive quality:
RoHS-compliant, halogen-free, and lead-free, allowing deployment in compliant manufacturing worldwide.
S-prefix variants provide AEC–Q101 qualification and PPAP support, facilitating seamless adoption by automotive manufacturers and suppliers.
The transistor is designed, manufactured, and tested according to onsemi’s policies, ensuring traceability and high process consistency.
Evaluating alternatives is a crucial step for risk mitigation and dual-sourcing in production. For designs requiring similar performance in the NPN Darlington SOT-223 space, consider the following:
BSP52T1G: Nearly identical electrical and mechanical characteristics, differing mainly in order and packaging for supply chain flexibility.
SBSP52T1G: Suited for regions or production flows with specific sourcing channels, sharing the same core electrical properties.
Complementary device BSP62T1 (PNP): Offers equivalent ratings for situations requiring both NPN and PNP transistors within the same project or footprint.
When considering drop-in replacements, always validate thermal characteristics and pinout details to ensure mechanical compatibility.
: Choosing BSP52T3G with Confidence
The BSP52T3G from onsemi stands out as a reliable, cost-effective NPN Darlington transistor for medium power switching in surface-mount assemblies. Its combination of robust electrical ratings, compact SOT-223 package, compliance credentials, and availability in automotive-grade variants make it an excellent choice for engineers tasked with designing or sustaining relay, lamp, or solenoid drivers. Review of its feature set and industry positioning ensures that BSP52T3G can be confidently specified in new designs or as a replacement in legacy applications requiring high performance and reliability in compact form factors.
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