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| Part Number: | BCP68T1G |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | TRANS NPN 20V 1A SOT223 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 5+ | $0.2852 |
| 50+ | $0.2232 |
| 150+ | $0.1967 |
| 1000+ | $0.1635 |
| 2000+ | $0.1487 |
| 5000+ | $0.1399 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 20 V |
| Vce Saturation (Max) @ Ib, Ic | 500mV @ 100mA, 1A |
| Transistor Type | NPN |
| Supplier Device Package | SOT-223 (TO-261) |
| Series | - |
| Power - Max | 1.5 W |
| Package / Case | TO-261-4, TO-261AA |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -65°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Frequency - Transition | 60MHz |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 85 @ 500mA, 1V |
| Current - Collector Cutoff (Max) | 10µA (ICBO) |
| Current - Collector (Ic) (Max) | 1 A |
| Base Product Number | BCP68 |




The onsemi BCP68T1G is a medium power NPN silicon epitaxial bipolar junction transistor (BJT) designed for demanding low voltage, high current applications. Delivered in a SOT-223 surface-mount package (TO-261) and with a 20V voltage rating, 1A collector current capability, and 1.5W power dissipation, the BCP68T1G addresses the needs of engineers who require robust thermal performance and reliable operation in compact board layouts. This part is especially suited to medium power applications where space constraints and efficient heat dissipation are key design considerations.
The BCP68T1G incorporates a selection of features tailored to both manufacturing and operational performance. As an NPN device, it is optimized for high current handling, with a maximum collector current rating of 1A and typical current-gain bandwidth product (fT) of 60MHz. Its SOT-223 packaging benefits customers in wave or reflow assembly processes, offering level mounting for optimal thermal conduction and visual inspection of joints, while the formed leads help absorb thermal stress during soldering to protect the semiconductor die. The BCP68T1G also meets RoHS compliance, is Pb-free and halogen/BFR-free, and offers a PNP complement in the BCP69T1 for designers needing push-pull stages. For automotive-grade reliability, select variants carry an S prefix, qualifying to AEC–Q101 and supporting PPAP requirements.
Engineers should note the recommended operating limits to ensure product reliability and robust circuit operation. The BCP68T1G can tolerate up to 20V collector-emitter voltage and a collector current of 1A, provided the junction temperature does not exceed prescribed thermal limits. Power dissipation reaches 1.5W when mounted on a standard glass epoxy PCB, although actual capability varies with thermal management in the design. Exceeding these maximum ratings risks permanent device damage or degraded lifespan. Safe operating area (SOA) curves are provided in the technical documentation to guide engineers in establishing sturdy designs under dynamic load conditions.
The BCP68T1G’s electrical characteristics at 25°C provide critical benchmarks for circuit design and device selection. Its DC current gain (hFE) is specified under standard test conditions, typically offering stable amplification for signal switching and low voltage applications. The transistor’s transition frequency (fT), measured at 60MHz, underlines its suitability for moderately fast switching and analog amplification. Capacitance measurements, both input and output, as well as base-emitter voltage characteristics across varying thermal conditions, support precision device modeling and simulation for mixed-signal designs. The saturation region characteristics and SOA plots empower users to predict performance margins under real load environments.
Mechanical compatibility is essential for procurement and production efficiency. The BCP68T1G’s JEDEC-standard SOT-223 (TO-261) case provides a profile conducive to medium power surface-mount applications, supporting automated assembly in high-volume manufacturing. Detailed dimensional drawings (CASE 318E) deliver precise measurements for integration into PCBs, with controlled tolerances for reliable fit and contact. Marking diagrams ensure traceability and correct device identification. Engineers benefit from multiple lead-forming options for compatibility with various circuit layouts and testing arrangements.
The onsemi BCP68T1G excels in application scenarios that demand medium power transfer, efficient thermal management, and space-optimized layouts. Typical engineering use cases include switching regulators, load drivers, low voltage signal amplification, and automotive or industrial control circuits. Its robust SOT-223 package, coupled with its current handling and bandwidth capabilities, allow for use in compact consumer electronics or power management subsystems. Design teams should pay particular attention to PCB heat spreading and solder joint quality to harness the device’s full thermal and electrical performance envelope.
In the course of product selection or supply chain planning, engineers may consider interchangeable or alternative parts to the onsemi BCP68T1G. The direct PNP complement is the BCP69T1, which matches essential mechanical and electrical requirements for mirrored circuit architectures. In addition, similar medium power NPN transistors in the SOT-223 footprint from other manufacturers may serve as potential replacements, provided their voltage, current, gain, and package specifications align with the original application. Careful evaluation of safe operating area, thermal properties, and package dimension tolerances is recommended when substituting the BCP68T1G in existing designs.
The onsemi BCP68T1G NPN silicon epitaxial transistor is a versatile choice for medium power, high current surface-mount designs where compactness, reliability, and efficient assembly are vital. Its favorable electrical characteristics, robust SOT-223 packaging, and broad compliance with environmental standards make it well-qualified for a range of applications, from consumer devices to automotive controls. Engineers and procurement specialists will find the BCP68T1G’s documentation comprehensive, supporting confident device selection, integration, and substitution planning for advanced electronic platforms.
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