AMD XCV400E-6BG560I

Mfr. Part

XCV400E-6BG560I

Manufacturer

AMD Xilinx. Y-IC is a quality distributor of AMD Xilinx products and we will provide you with the best products and services

Detailed Description

Virtex-E series SRAM-based FPGA for embedded designs

404 user I O in a 560 ball MBGA LBGA package size 42.5 mm x 42.5 mm

2400 CLBs and 10800 logic elements cells with 163840 total RAM bits

Speed grade 6 industrial temperature grade

Core supply 1.71 to 1.89 V typical 1.8 V

Operating junction temperature range minus 40 to plus 100 degrees C

Surface mount assembly supplied in tray packaging

RoHS non compliant leaded BGA balls

Base product number XCV400E main category Integrated Circuits ICs small classification Embedded FPGAs Field Programmable Gate Array

Key Features

404 user I O for broad interface coverage

2400 CLBs and 10800 logic cells for flexible logic construction

163840 bits of on chip block RAM for data buffering and FIFOs

Global low skew clock routing for reliable timing

Standard configuration options via JTAG slave serial and parallel SelectMAP workflows

Industrial temperature operation minus 40 to plus 100 degrees C

Proven Virtex E architecture with mature tool support

Key Advantages

High I O density enables complex connectivity on a single device

Stable 1.8 V core lowers power compared to older core voltages

BGA with exposed metal pad helps heat spread in compact boards

Mature platform with broad ecosystem and reference designs

Industrial grade reliability for harsh environments

In stock at Y IC quantity 2644 for fast delivery

Y IC provides sourcing support logistics and technical documents for smooth procurement

Packaging

Type 560 ball MBGA LBGA with exposed metal pad

Material organic BGA substrate with leaded solder balls RoHS non compliant

Size 42.5 mm x 42.5 mm body

Pin configuration 560 balls total with 404 user I O remaining balls for power ground configuration and clocks refer to datasheet for ball map

Mounting surface mount supplied in trays

Thermal characteristics junction minus 40 to plus 100 degrees C exposed pad assists heat conduction use solid ground planes thermal vias and airflow as needed

Electrical properties core supply 1.71 to 1.89 V typical 1.8 V I O bank levels and limits depend on configuration see datasheet

Lifecycle

Status legacy Virtex E generation availability may be limited and RoHS non compliant versions are often restricted for new designs

Discontinuation many Virtex E devices have moved to NRND or EOL status verify current status with our sales team

Equivalents alternatives

- Same family capacity options XCV300E XCV600E XCV1000E choose based on required logic cells I O count and memory package and pinouts differ

- Same device variants XCV400E available in other speed grades temperature ranges and packages within the Virtex E family pin to pin compatibility varies

- Newer families for fresh designs Spartan 3 Spartan 6 Artix 7 Kintex 7 pick based on logic capacity I O needs power and cost

For exact drop in or pin compatible replacements and the latest lifecycle status contact our sales team via Y IC dot com

Key Application Areas

Industrial control automation and PLC expansion

Motor drive motion control and power electronics coordination

Telecom and networking interface logic bridges and protocol adapters

Embedded system glue logic bus bridging and memory controllers

Imaging and DSP at moderate clock rates

Test and measurement instrumentation

Aerospace and defense systems requiring industrial temperature

Datasheet

Y IC hosts the most authoritative datasheet and technical materials for this product on our website. Download the datasheet on this page for full specifications pin maps configuration methods timing and design guidelines

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