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| Part Number: | XCV400E-6BG560C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 404 I/O 560MBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.71V ~ 1.89V |
| Total RAM Bits | 163840 |
| Supplier Device Package | 560-MBGA (42.5x42.5) |
| Series | Virtex®-E |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Package | Tray |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Number of Logic Elements/Cells | 10800 |
| Number of LABs/CLBs | 2400 |
| Number of I/O | 404 |
| Number of Gates | 569952 |
| Mounting Type | Surface Mount |
| Base Product Number | XCV400E |




XCV400E-6BG560C
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Virtex-E family FPGA. 404 user I/O. 560-ball BGA body 42.5 mm x 42.5 mm. Core supply 1.71–1.89 V. Commercial junction temperature 0–85°C. Surface-mount device. RoHS non-compliant legacy device. Base product number XCV400E. Ships in tray.
Virtex-E architecture for flexible, general-purpose FPGA designs
2400 CLBs, 10800 logic cells, about 570k system gates
Total block RAM 163,840 bits
404 I/O pins for wide interface coverage
Global clock resources for reliable timing
JTAG boundary scan and standard FPGA configuration modes
560-ball BGA package for high I/O density
Core voltage 1.8 V nominal, banked I/O supplies for multiple standards
Series Virtex-E, base product XCV400E
Proven, stable platform widely adopted in industrial and telecom systems
High I/O count and balanced logic-to-memory ratio for interface-heavy designs
Mature toolchain and broad ecosystem support for maintenance and sustainment
Exposed-pad BGA option improves heat transfer in dense boards
Lower core voltage helps reduce power versus older generations
Available from Y-IC with professional support and dependable supply
Type: Ball Grid Array, surface mount
Ball count and body: 560-ball array, 42.5 mm x 42.5 mm body, low-profile form factor
Material: Molded BGA as specified by supplier; some documentation references Low-Profile BGA with metal lid and exposed thermal pad
Pin configuration: 560-ball matrix with 404 user I/O, distributed power and ground, dedicated configuration and JTAG pins, global clock pins
Thermal characteristics: Commercial junction 0–85°C; exposed pad version enhances heat spreading into PCB; actual thermal performance depends on board copper area and airflow
Electrical properties: Core supply 1.71–1.89 V; I/O supplies per bank per chosen signaling standard; robust clocking resources; power consumption varies with design content and frequency
Delivery packaging: Tray for safe handling and assembly
Status: Mature legacy product, widely considered discontinued or near end-of-life. RoHS non-compliant indicates older generation with leaded materials.
Same-family options that may serve as near equivalents or alternatives, depending on package and speed grade requirements:
- XCV400E-7BG560C (faster speed grade, same family and ball count, verify pinout)
- XCV400E-6BG560I (industrial temp, same ball count, verify pinout)
- XCV300E-6BG560C or XCV500E-6BG560C (similar package within Virtex-E family, lower or higher capacity, verify pinout)
- Other XCV400E package variants such as XCV400E-6FG676C exist with different ball counts and footprints and are not pin-compatible
Modern alternatives for new designs (not pin-compatible, require redesign) include newer AMD Xilinx families such as Artix-7, Kintex-7, Virtex-5, Virtex-6, and Ultrascale series. Match by logic, RAM, I/O, and power targets.
For exact pin compatibility and availability, please contact our sales team through the Y-IC website. We will help you select the right drop-in or redesign path.
Telecom and networking equipment, backplane and line card logic
Industrial automation, motor control, PLC and HMI interface expansion
Test and measurement instruments, protocol adapters, pattern generators
Data acquisition, legacy imaging and signal processing pipelines
Aerospace and defense sustainment programs requiring form-fit-function continuity
Education and research prototyping using mature FPGA platforms
Y-IC hosts the most authoritative datasheet and technical documents for XCV400E-6BG560C on our product page. Download the datasheet here to get pinouts, timing, configuration methods, power guidance, and PCB layout recommendations.
Stock available now. Get a Quote on Y-IC for fast pricing, lead time, and logistics support. Learn More and secure your allocation today. Limited Time Offer for priority fulfillment and value-added services.
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