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| Part Number: | XC7Z030-2FGG484E |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | XILINX BGA |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Data Code | 17+ |
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Product Attribute | Attribute Value |
|---|---|
| Lead Time | 2-3days after payment. |
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




XC7Z030-2FGG484E
AMD Xilinx. Y-IC is a quality distributor of AMD Xilinx and we supply genuine parts with the best products and services.
Zynq-7000 SoC that integrates a dual-core ARM Cortex-A9 processing system with 7-series FPGA programmable logic in one device. Speed grade -2 for higher performance. Package FGG484. Environmental grade E. Main Category Integrated Circuits (ICs). Small Classification Specialized ICs. Current stock 1405 units. Data code 17+.
Dual-core ARM Cortex-A9 application processor
7-series FPGA programmable logic for custom acceleration and interfaces
28 nm CMOS technology
Rich peripheral set typically including Ethernet, USB, SDIO, UART, SPI, I2C, CAN
High-performance memory interfaces (e.g., DDR3/DDR3L, LPDDR2) per device configuration
DSP slices, Block RAM, clock management resources in the PL
Secure boot support and hardware-based security features
Speed grade -2 for improved timing headroom
Broad tool support with Vivado Design Suite and Vitis software platform
Combines software flexibility with hardware acceleration in one chip, reducing BOM and board area
Shortens development time with a unified processor+FPGA platform
Scales across the Zynq-7000 family for performance and cost choices
Enables deterministic real-time tasks in PL while running rich OS on PS
Speed grade -2 offers higher achievable clocks and lower latency in performance-critical paths
Package type FGG484 fine-pitch Ball Grid Array (BGA)
Ball count 484, lead-free RoHS-compliant (G indicates “Green”)
Organic substrate with epoxy mold compound construction
Compact footprint suitable for high-density designs; see package drawings for dimensions
Pin configuration 484-ball grid optimized for high-speed interfaces and dense routing
Thermal characteristics require good PCB heat spreading and airflow as needed to keep junction temperatures in spec
Electrical properties follow Zynq-7000 power rails and sequencing; design with proper decoupling and noise control
Package / Case listing code 869
Status Active and widely used; not nearing discontinuation based on current market availability
Multiple XC7Z030 variants exist across speed grades, packages, and temperature grades within the same family
If you need pin-compatible or performance-equivalent alternatives, contact our sales team via the Y-IC website. We will provide a detailed cross-reference and suitable substitutes across Zynq-7000 devices and related AMD Xilinx families.
Industrial automation, motor control, and PLCs
Embedded vision, image processing, and AI acceleration at the edge
Communications and networking equipment
Software-defined radio and mixed-signal DSP
Automotive prototyping, ADAS evaluation, and gateways
Medical devices, scientific instrumentation, and test equipment
IoT gateways, smart infrastructure, and robotics
Our website hosts the most authoritative datasheet for XC7Z030-2FGG484E. Download it on this page to get full specifications, package drawings, pin tables, power guidance, and design best practices.
Get a Quote on Y-IC now. Learn More about pricing and lead time today. Limited Time Offer on in-stock quantity 1405—secure your parts while supplies last.
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XC7Z030-2FGG484EXILINX |
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