XILINX XC3S2000-FGG676EGQ

Mfr. Part

XC3S2000-FGG676EGQ

Manufacturer

AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx. We provide authentic parts, fast service, and strong technical support so you get the best products and the best experience

Detailed Description

XC3S2000-FGG676EGQ is a Spartan-3 FPGA from AMD Xilinx. It is a low cost, SRAM based programmable logic device in a 676 ball fine pitch BGA package. It targets general purpose digital logic, signal processing, and interface bridging in cost sensitive designs. It offers configurable logic blocks with 4 input LUTs and flip flops, dedicated Block RAM, hardware multipliers, Digital Clock Managers for clock generation and alignment, and flexible SelectIO banks that support many industry I O standards. Configuration is volatile and is loaded at power up through JTAG or external serial and parallel PROMs. The device sits in the 2 million system gate class and is widely used in mature platforms. The listing shows Package or Case code 869 and Date code 11 plus which indicates production around 2011. Main category is Integrated Circuits and small classification is Specialized ICs. Current available quantity is 2200 units

Key Features

Spartan 3 architecture with rich logic resources and on chip memory

676 ball FGG package for high pin count and wide interface support

Configurable logic blocks with LUTs and flip flops

Dedicated Block RAM for data buffering and storage

Hardware multipliers for fast arithmetic

Digital Clock Managers for clock synthesis and phase alignment

SelectIO banks with support for LVCMOS LVTTL SSTL HSTL LVDS and 3.3 V PCI

JTAG boundary scan for test and programming

Multiple configuration modes including JTAG master serial slave serial and master parallel

Lead free RoHS compliant balls indicated by the G in FGG

Typical core voltage 1.2 V with bank voltages that support 1.5 V 1.8 V 2.5 V and 3.3 V standards

Strong ecosystem with legacy ISE design tools and mature IP cores

Key Advantages

Reprogrammable hardware that speeds development and simplifies updates

Lower cost than high end FPGA families while still providing strong capability

High pin count package that simplifies wide parallel buses and many I O connections

Broad I O standard support for easy system interfacing and bridging

Mature silicon with stable behavior and wide field history

Large community knowledge base and proven reference designs

Shorter time to market compared to custom ASIC solutions

Packaging

Type is Fine Pitch Ball Grid Array FGG

Ball count is 676 in a 26 by 26 grid with 1.0 mm pitch typical

Body size is about 27 mm by 27 mm with low profile height typical

Material is molded plastic BGA with lead free SnAgCu ball alloy

Pin configuration is banked I O with dedicated configuration pins power and ground distribution and user I O pins across multiple banks. Refer to the datasheet for exact pinout

Thermal behavior is improved by BGA ball conduction and solid ground and power planes. Use good board thermal design and heat spreading. Junction temperature limits depend on the device temperature grade

Electrical properties include a 1.2 V core supply auxiliary rails and bank rails that support common standards at 1.5 V 1.8 V 2.5 V and 3.3 V. Digital Controlled Impedance DCI is available in SelectIO for better signal integrity. ESD protection is integrated on I O pins

The listing shows Package or Case code 869 which can be a supplier code. Verify final packing format with Y IC if you need trays tape and reel or specific handling

Lifecycle

Status is mature and legacy. Many Spartan 3 part numbers are NRND or EOL at AMD Xilinx. The exact XC3S2000 FGG676 variants including this EGQ suffix are often limited in supply. The provided Date code 11 plus indicates older production

Close same family options for footprint and migration include XC3S2000 FGG676 other speed or temperature grades XC3S1500 FGG676 lower density and XC3S4000 FGG676 higher density. Some devices in the same package offer pin compatibility but bank features and resources differ. Always confirm pin compatibility and constraints in the datasheet

Newer generation alternatives with better performance and power include Spartan 3A XC3S2000A FGG676 Spartan 6 XC6SLX75 FGG676 XC6SLX100 FGG676 XC6SLX150 FGG676 and Artix 7 XC7A100T FGG676 XC7A200T FFGG676 new code variants. These are not drop in replacements. They require redesign and new tools

If you need an exact equivalent or a verified alternative for your board please contact our sales team via the Y IC website. We will check live inventory second sources and substitution feasibility for your requirements

Key Application Areas

Industrial control and automation including PLC expansion logic and motion control

Communications and networking for MAC bridging protocol glue logic packet filtering and LVDS links

Consumer and embedded systems for display timing controllers video scaling and interface conversion

Test and measurement instruments for pattern generation triggering and fast data capture

Medical and imaging systems for acquisition pipelines and processing acceleration

Automotive infotainment and driver assistance in non safety critical functions

Security and encryption acceleration using custom logic pipelines

Any design that needs flexible digital logic and fast I O in a cost aware platform

Datasheet

Y IC hosts the most authoritative datasheet and technical documents for this product. Download the datasheet from the current page to get exact resources pinout electrical limits configuration modes timing and thermal guidance. Use the datasheet to verify speed grade temperature grade and final packaging details for your build

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