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| Part Number: | XC2VP2-7FFG672C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 204 I/O 672FCBGA |
| Datasheets: |
|
| RoHs Status: | Lead free / RoHS Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 40+ | $168.7054 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Breakdown | 672-FCBGA (27x27) |
| Total RAM Bits | 3168 |
| Standard Package | 40 |
| Shell Style | 1.425 V ~ 1.575 V |
| Series | Virtex®-II Pro |
| Polarization | 672-BBGA, FCBGA |
| Part Status | Active |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Number of Logic Elements/Cells | 352 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Standard Lead Time | 6 Weeks |
| Manufacturer Part Number | XC2VP2-7FFG672C |
| Description | IC FPGA 204 I/O 672FCBGA |
| Core Type | 221184 |
| Clock Rate | 204 |




XC2VP2-7FFG672C
AMD Xilinx
Y-IC is a quality distributor for AMD Xilinx. We provide trusted sourcing, genuine parts, fast delivery, and responsive support to ensure you get the best products and services.
Virtex-II Pro family FPGA for embedded and high-performance logic designs
Category: Integrated Circuits (ICs) | Classification: Embedded FPGAs (Field Programmable Gate Array)
204 user I/O, 672-ball FCBGA package, speed grade -7, commercial temp range
Surface-mount device, RoHS lead-free and fully compliant
Operating temperature (junction): 0°C to 85°C
Moisture Sensitivity Level: MSL 4 (72 hours floor life)
Manufacturer standard lead time: 6 weeks
Part status: Active
Available stock: 2610 units
204 user I/O for flexible interfacing
672-ball flip-chip BGA (FCBGA), body size 27 mm x 27 mm
Speed grade: -7 for faster timing performance
Core voltage range: 1.425 V to 1.575 V
Number of logic elements/cells: 352
Total RAM bits: 3168
Series: Virtex-II Pro
RoHS: Lead-free / RoHS Compliant
Mounting: Surface Mount
MSL 4 (72 Hours)
Typical FPGA capabilities: configurable logic blocks, block memory, clock management, banked I/O with many standards (e.g., LVTTL, LVCMOS, LVDS, SSTL, HSTL), JTAG support and flexible configuration options (see datasheet for details)
Compact, high-density package fits space-constrained boards
Broad I/O standard support simplifies mixed-signal and multi-voltage designs
Fast -7 speed grade helps meet tight timing on critical paths
Lead-free FCBGA improves thermal and electrical performance versus wire-bond packages
Active lifecycle and 6-week lead time make planning easier
Backed by Y-IC quality distribution and support
Type: FCBGA (Flip-Chip Ball Grid Array), 672 balls
Material: Flip-chip die on organic substrate; lead-free solder balls
Size: 27 mm x 27 mm body; low-profile BGA height
Pin configuration: 672-ball matrix with 204 user I/O; multiple I/O banks; dedicated configuration, power, and ground balls (see datasheet pinout)
Thermal characteristics: Junction temperature 0°C to 85°C; MSL 4 with 72-hour floor life; follow Pb-free reflow profile; use good thermal design (heat spreading via vias and copper planes)
Electrical properties: Core voltage 1.425 V to 1.575 V; I/O bank voltages depend on selected standards; ESD-sensitive—handle per JEDEC guidelines
Shipping: Tray packaging, standard pack quantity 40 units per tray; moisture barrier bag with desiccant and HIC
Status: Active and in production
Not currently nearing discontinuation based on available information
Equivalent or alternative models (verify pin-compatibility, timing, and temperature grades in the datasheet before use):
- XC2VP2-6FFG672C (same device, lower speed grade, commercial temp)
- XC2VP2-7FFG672I (same device and speed grade, industrial temp range)
- XC2VP2-6FFG672I (lower speed grade, industrial temp)
- XC2VP2-7FG676C (similar device in a closely related BGA package option—check pinout)
- XC2VP4-7FFG672C (larger Virtex-II Pro device if more resources are required—check compatibility)
If you need drop-in equivalents, extended temperature, or other packages, contact our sales team via our website for the latest availability and guidance
Communications infrastructure: switching, routing, baseband and protocol processing
Embedded computing and control: soft processors, custom accelerators
Industrial automation: motion control, machine vision, PLC/IPC expansion
Test and measurement: high-speed capture, pattern generation, instrumentation interfaces
Consumer and multimedia: video processing, interfaces, and glue logic
Aerospace and defense prototyping: rapid algorithm iteration and interface bridging
Medical devices: imaging pipelines, data acquisition, and control
Research and education: FPGA-based prototyping and hardware acceleration
Our website hosts the most authoritative and up-to-date datasheet for XC2VP2-7FFG672C. Download it on this page to get complete specifications, pinouts, configuration options, timing, and design guidelines.
Get a Quote on our website today. Learn More about availability and pricing. Limited Time Offer—lock in competitive prices and fast delivery with Y-IC.
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