XILINX XC17S30PI

Mfr. Part

XC17S30PI

Manufacturer

AMD Xilinx

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Detailed Description

XC17S30PI is a Xilinx legacy serial configuration memory used to load FPGA bitstreams at power-up. It is a nonvolatile serial PROM designed for older Xilinx families such as Spartan and XC4000. The PI suffix indicates an 8‑pin DIP through‑hole package. Description from source shows XILINX DIP8 and Package/Case noted as 834. DateCode 15+ indicates 2015 lot or later. This device suits repair, maintenance, and continued support of legacy systems. Main Category Integrated Circuits, Small Classification Specialized ICs. Current available quantity noted as 2160 units.

Key Features

Nonvolatile serial configuration memory for Xilinx legacy FPGAs

Simple serial interface for bitstream delivery at power-up

3.3V operation with CMOS low-power behavior

Cascade option via data-out to support larger designs or multiple devices

8-pin DIP footprint for easy socketing, prototyping, and field service

Compatible with standard Xilinx programming flows and tools of its era

Stable data retention for long-term system reliability

Key Advantages

Drop-in solution for boards designed around DIP-8 Xilinx serial PROMs

Reduces redesign effort in legacy equipment maintenance

Through-hole package aids manual assembly and quick replacement

Proven compatibility with older Spartan and XC4000 platforms

Clear, fixed configuration once programmed for predictable behavior

Packaging

Type DIP-8 through-hole package (PI)

Material Molded plastic body with plated leads

Size Standard DIP-8 footprint suitable for sockets and through-hole soldering

Pin configuration Typical pins include VCC, GND, CS/CE, CCLK, DIN, DOUT, OE/RESET, and one NC or function pin. Refer to the datasheet for exact pinout

Thermal characteristics DIP packages dissipate heat via leads and ambient air. Use normal spacing and airflow. For exact thermal resistance and limits, see the datasheet

Electrical properties 3.3V supply, CMOS nonvolatile memory, low standby current, active current during configuration. Logic-level compatible IO. Exact limits and timing in the datasheet

Package code 834 was provided; functional package is DIP-8 PI as described

DateCode 15+ indicates stock from 2015 lot or newer with proper storage and handling

Lifecycle

Status Legacy product with limited or discontinued production in many markets

Nearing discontinuation Yes. Availability may be constrained and lot-based

Equivalent or alternative models

- XC17S family variants for different capacities and package options such as XC17S10, XC17S20, XC17S50 and versions in DIP or SOIC

- Reprogrammable flash-based Xilinx PROMs XC18V series such as XC18V256, XC18V512, XC18V01, XC18V02 for 3.3V systems

- Xilinx Platform Flash XCF series including XCF01S, XCF02S, XCF04S, XCF08P for JTAG reprogramming and higher capacities

- Modern external SPI Flash memories for FPGAs supporting Master SPI, for example Winbond W25Q series, Micron MT25Q/MT25QL series, Infineon Cypress S25FL series, selected to match your FPGA’s configuration mode and bitstream size

If these do not match your exact requirements Contact our sales team via the Y-IC website for detailed cross-reference support, stock checks, and engineering guidance

Key Application Areas

Configuration storage for Xilinx Spartan and XC4000 FPGA-based systems

Legacy equipment repair and sustainment where 8-pin DIP PROMs are specified

Industrial control, communications, measurement, and test gear using older Xilinx devices

Training and labs covering classic FPGA configuration methods

Datasheet

Our website hosts the most authoritative datasheet for XC17S30PI. Download it on this page for exact pinout, timing, electrical limits, programming procedures, and application guidelines.

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