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| Part Number: | AD5316RBCPZ-RL7 |
|---|---|
| Manufacturer/Brand: | Analog Devices Inc. |
| Part of Description: | IC DAC 10BIT V-OUT 16LFCSP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $5.6146 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply, Digital | 2.7V ~ 5.5V |
| Voltage - Supply, Analog | 2.7V ~ 5.5V |
| Supplier Device Package | 16-LFCSP (3x3) |
| Settling Time | 7µs |
| Series | nanoDAC® |
| Reference Type | External, Internal |
| Package / Case | 16-WFQFN Exposed Pad, CSP |
| Package | Tape & Reel (TR) |
| Output Type | Voltage - Buffered |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C |
| Number of D/A Converters | 4 |
| Number of Bits | 10 |
| Mounting Type | Surface Mount |
| INL/DNL (LSB) | ±0.12, ±0.5 (Max) |
| Differential Output | No |
| Data Interface | I²C |
| Base Product Number | AD5316 |
| Architecture | String DAC |




The AD5316RBCPZ-RL7 from Analog Devices represents a high-precision, quad-channel, 10-bit digital-to-analog converter (DAC) designed for applications where space, reliability, and low power consumption are critical. As a member of the nanoDAC® family, the AD5316RBCPZ-RL7 leverages a monolithic architecture that integrates a low-drift 2.5 V on-chip reference and selectable gain, all in a compact 3 mm × 3 mm 16-lead LFCSP or TSSOP package. Optimized for industrial instrumentation, programmable attenuators, and automation systems, this device features a complete set of performance, control, and power management options tailored for modern analog output requirements.
At the heart of the AD5316RBCPZ-RL7 is its 10-bit resolution (1024 steps) and four buffered voltage output channels, enabling versatile, fine-grained control of analog signals with tight channel-to-channel matching. Key measurable advantages include:
Total Unadjusted Error (TUE): ±0.1% of FSR (max)
Offset Error: ±1.5 mV (max)
Gain Error: ±0.1% of FSR (max)
Low drift internal reference: 2 ppm/°C typical, 5 ppm/°C max
Glitch Impulse: 0.5 nV·s—minimizing disturbance on code transitions
Low current operation: 3.3 mW typical at 3 V
Additionally, the device supports high drive capability (up to 20 mA output per channel, constrained by thermal considerations and total channel aggregate), and user-selectable output ranges via the GAIN pin (0 to 2.5 V or 0 to 5 V spans).
The AD5316RBCPZ-RL7 implements a string-DAC architecture, each channel consisting of a resistor string network followed by a rail-to-rail output buffer. This approach guarantees monotonic output by design, essential for smooth analog signal generation. The internal reference is enabled by default and buffered for both internal DAC use and for driving external loads up to ±5 mA.
A power-on reset circuit ensures DAC outputs enter a safe, deterministic state at power-up, selectable between zero scale and midscale via the RSTSEL pin. Each channel features an independent power-down function, reducing standby current to as low as 4 μA, with selectable output terminations to ground for predictable system behavior during power-down states.
The device’s wide operating supply voltage range (2.7 V to 5.5 V) supports compatibility with diverse system voltages. Key electrical limits:
Output load capability: ≥1 kΩ in parallel with up to 2 nF capacitance
Output swing: rail-to-rail, subject to headroom/footroom determined by channel resistance
Settling time: 5 μs (typical) for a ¼ to ¾ full-scale code step
Power-on-reset time and wake-up (exit power-down): typically 2.5 μs at 5 V
AC timing, digital interface margins, and supply rejection characteristics are specified to ensure robust performance in noisy industrial environments and multi-device I2C bus configurations.
The AD5316RBCPZ-RL7 is offered in both a 16-lead LFCSP (3 mm × 3 mm) and 16-lead TSSOP package. Both package types provide clear pin mapping for analog outputs, I2C interface, reference input/output, gain selection, hardware reset, and power management. The LFCSP variant includes an exposed pad for optimal heat dissipation, which must be connected to ground.
The logical arrangement and robust pin design simplify PCB routing and support high-density system layouts.
Multi-level power-down modes are accessible via software, enabling granular shutdown of individual channels. The device allows the output to be tied to ground through defined resistors or left open during power-down, supporting applications requiring safe analog output states during standby or fault conditions.
Upon power cycle, or in response to the RESET pin or command, channels can be held at user-selectable output states until a valid write command is received, ensuring predictable recovery and safe operation in remote or critical systems.
The AD5316RBCPZ-RL7 employs a two-wire I2C-compatible interface supporting both standard (100 kHz) and fast (400 kHz) bus modes. Four unique I2C addresses are selectable via A1/A0 pins, facilitating multiple devices on a single bus without conflict.
The 24-bit input protocol (8-bit command/address, 16-bit data) provides flexible addressing, per-channel updates, and access to power-down/LDAC register control. Detailed timing compliance and glitch suppression features ensure reliable integration with industry-standard DSPs or microcontrollers, including direct hardware interfacing with ADSP-BF531 and similar processors.
For systems requiring galvanic isolation, the device’s reduced pin count and serial interface are advantageous for implementation with isolation devices such as the Analog Devices ADuM1400 iCoupler®.
Engineers must pay special attention to PCB layout to maximize performance. Recommended practices include:
Locating 10 μF (tantalum) and 0.1 μF (ceramic, low-ESR/ESL) supply decoupling very close to the package.
Connecting the LFCSP exposed paddle to the ground plane with thermal vias for optimal cooling, especially critical when several channels are sourcing significant current.
Placing the DAC and associated passive analog components on a dedicated analog plane to minimize digital noise coupling.
Following differential signal routing and ground return best practices, particularly in mixed-signal environments.
For precision applications, considering the effects of board-level soldering (preconditioning) on reference voltage, long-term drift, and thermal hysteresis, supported by data in the device’s specification.
In case of supply chain constraints or design legacy concerns, engineers should note the following:
The AD5316 model (without 'R') is not pin-to-pin or software compatible with the AD5316RBCPZ-RL7, and direct drop-in replacement is not feasible.
For applications with similar output resolution and voltage ranges but differing package or interface requirements, alternative multi-channel nanoDACs from Analog Devices—such as other AD53xx nanoDAC family members—may be considered. However, attention should be paid to variations in reference voltage integration, I2C address handling, and command protocol, as these details influence firmware and PCB compatibility.
When selecting equivalents, verify monotonicity, power-on-reset behavior, and thermal/power constraints according to system needs.
The AD5316RBCPZ-RL7 stands out as a highly integrated quad 10-bit DAC solution, precisely tailored for applications demanding compact size, precision voltage outputs, robust industrial operation, and flexible power management. Its combination of low drift, configurable output scaling, versatile I2C interface, and comprehensive operational features make it particularly suited to advanced control, instrumentation, and automation systems.
Selection engineers and procurement professionals are advised to carefully match system interface requirements, layout practices, and end-application reliability expectations to the detailed specifications and operational modes of the AD5316RBCPZ-RL7, ensuring it is leveraged to its full potential within their analog output architectures.
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AD5316RBCPZ-RL7Analog Devices Inc. |
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