PHILIPS SEMICONDUCTORS/NXP 74ALVC164245DGG

Mfr. Part

74ALVC164245DGG

Manufacturer

PHILIPS SEMICONDUCTORS/NXP

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Detailed Description

16‑bit dual‑supply level‑translating bus transceiver with 3‑state outputs, ALVC family. Two independent 8‑bit sections allow bidirectional data transfer between low‑voltage and standard 3.3 V logic domains. High‑speed, low‑power CMOS design in a compact 48‑pin TSSOP (DGG) package.

Key Features

16‑bit bidirectional bus transceiver with 3‑state outputs

Dual‑supply level translation (separate VCCA and VCCB rails)

Two independent 8‑bit sections with separate DIR and OE control pins

Low‑voltage operation on A‑side; standard 3.3 V operation on B‑side

High‑speed switching and low dynamic power (ALVC family characteristics)

Inputs typically tolerant to higher voltages (family‑typical up to 5.5 V; confirm in datasheet)

Power‑down protection on inputs and 3‑state outputs when disabled (family‑typical)

Meets standard logic bus interface needs; TTL/CMOS compatible thresholds (family‑typical)

Key Advantages

Simple, reliable level shifting between 1.8 V/2.5 V/3.3 V logic domains

Reduces parts count versus discrete translators; cleaner design

Compact footprint saves PCB space (TSSOP‑48)

Flexible control with per‑section direction and output enable

Low power consumption helps thermal and battery‑powered designs

Broad ecosystem and cross‑vendor support simplifies sourcing

Packaging

Type: TSSOP‑48 (NXP package code DGG), gull‑wing leads, 0.5 mm lead pitch

Material: Molded epoxy encapsulation; copper alloy leadframe; matte tin lead finish

Approximate size: Body ~12.5 mm x ~6.1 mm x ~1.2 mm (typical for TSSOP‑48; verify exact in datasheet)

Pin configuration: 48 pins; two 8‑bit A‑ports and B‑ports; separate DIR1, DIR2 and OE1, OE2 control pins; dual VCC rails (VCCA, VCCB); GND pins distributed

Thermal characteristics: Low‑profile package; typical θJA in the ~80–100 °C/W range in still air (board and environment dependent; confirm in datasheet)

Electrical properties (package related): Lead inductance and capacitance optimized for fast edges; supports high‑speed logic signaling with controlled impedance layouts

Shipping: Tape‑and‑reel for automated assembly; moisture sensitivity per JEDEC (check datasheet/MSL label for exact level)

Lifecycle

Status: Active and widely supported by NXP/Nexperia families; not near discontinuation based on current market availability

Cross‑reference and alternatives (verify pinout, voltages, timing in datasheets):

- Texas Instruments SN74ALVC164245DL (SSOP‑48) and variants

- onsemi/Fairchild MC74ALVC164245 (TSSOP/SSOP packages)

- Nexperia 74ALVC164245DGG (same package code) and related package options

- Renesas/IDT 74ALVC164245 equivalents in similar packages

If you need exact drop‑in or different package options, contact our sales team via Y-IC.com for expert guidance and the latest lifecycle updates

Key Application Areas

Level shifting between 1.8 V/2.5 V logic and 3.3 V buses

CPU, MCU, DSP, and FPGA I/O expansion and bus bridging

Memory, peripheral, and backplane interfaces

Industrial control, instrumentation, and communications equipment

Consumer and mobile devices needing low‑power high‑speed bus transceivers

Datasheet

Y-IC provides the most authoritative datasheet for 74ALVC164245DGG on our product page. Download it now to get exact electrical ratings, pin maps, timing, MSL, and layout guidance.

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