ROCKCHP RK3368H

Mfr. Part

RK3368H

Manufacturer

ROCKCHP

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Detailed Description

RK3368H is a highly integrated 64-bit application processor SoC for multimedia and smart devices. It uses an octa-core ARM Cortex-A53 CPU (up to about 1.5 GHz), a PowerVR-class GPU, and hardware 4K video decode. It includes rich I/O for display, camera, storage, audio, and networking. Typical OS support includes Android and Linux. This device fits Integrated Circuits (ICs) in the Specialized ICs category.

Available stock 2100 pcs. Package/Case code 140007. Date code 1938+ (approx. 2019 week 38 or newer, subject to lot).

Key Features

64-bit octa-core ARM Cortex-A53 CPU, efficient multi-core performance

Integrated GPU (PowerVR G6110 class), OpenGL ES support for smooth UI

4K UHD hardware decode (H.265/H.264; VP9 on some variants); up to 60 fps playback

1080p video encode capability (model dependent)

Memory support: DDR3, DDR3L, LPDDR3; typical rates up to 1600 MHz

Display output: HDMI (up to 2.0 on supported boards), MIPI-DSI

Camera input: MIPI-CSI for imaging and vision

Storage: eMMC, NAND, SPI-NOR, SD/SDIO interfaces

Connectivity: USB 2.0 (USB 3.0 on some board designs), Ethernet MAC

Audio: I2S/PCM, SPDIF; audio codec interfacing

Security: secure boot and crypto accelerators (AES/SHA)

OS ecosystem: Android and Linux support, broad community resources

Key Advantages

Strong performance-per-watt for 4K media and responsive UI

High integration reduces BOM cost and board complexity

Flexible memory and I/O options to fit many designs

Mature platform with stable firmware and SDKs

Broad software ecosystem and community support

Cost-effective choice for volume deployments

Packaging

Type FCBGA (flip‑chip ball grid array), lead‑free, RoHS compliant

Package / Case 140007 (manufacturer reference code)

Materials Epoxy mold, copper substrate, SAC alloy solder balls

Approximate size Body typically in the 14 x 14 mm to 17 x 17 mm range (varies by revision); low profile suitable for compact boards

Pin configuration High‑density BGA with hundreds of balls; typical ball pitch ~0.8 mm to 0.65 mm; dedicated grids for core power, I/O banks, memory, high‑speed interfaces

Thermal characteristics Recommend heatsink or heat spreader for sustained 4K playback; thermal performance depends on PCB design and airflow. Typical consumer operating range 0°C to 85°C; industrial options may differ

Electrical properties Core voltage about 1.0–1.2 V; I/O rails commonly 1.8 V and 3.3 V; typical power 2–4 W during 4K playback with much lower idle; supports DVFS and multiple sleep states

Shipment form Trays are common for BGA SoCs; tape‑and‑reel may be available for smaller packages (confirm per lot)

Lifecycle

Status Mature and widely used; not officially announced as EOL at the time of writing

Availability Y-IC currently lists 2100 pcs in stock; lead times vary by lot and region

Recommended alternatives for similar use cases (not pin‑compatible)

- Rockchip RK3328 Quad A53, 4K decode, cost‑down for TV boxes

- Rockchip RK3399 2x A72 + 4x A53, stronger CPU/GPU, PCIe, USB 3.0

- Rockchip RK3566 Quad A55, modern 22 nm, low power, optional NPU (0.8 TOPS)

- Rockchip RK3568 Quad A55, more I/O, industrial focus

- Rockchip RK3588 4x A76 + 4x A55, 8K decode, high‑end performance

- Amlogic S905X3 Quad A55, 4K HDR, popular STB platform

- Amlogic S922X 2x A73 + 4x A53, higher performance media SoC

- Allwinner H6/H616 Quad A53, budget‑friendly 4K media SoCs

Need exact, pin‑compatible or drop‑in replacements Contact our sales team via the Y-IC website for model matching and the latest lifecycle updates

Key Application Areas

Android TV boxes and OTT set‑top boxes

Smart displays and digital signage players

Media streamers and home entertainment hubs

Interactive kiosks and point‑of‑sale terminals

Smart projectors and 4K playback devices

Thin clients and embedded Linux terminals

Education terminals and e‑learning devices

Datasheet

Y-IC hosts the most authoritative datasheet for RK3368H. Download it on this page now for complete electrical, mechanical, and interface specifications.

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