TI TLK10034

Mfr. Part

TLK10034

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

Quad lane high speed serial transceiver IC for 10G and other multi rate links

Main category Integrated Circuits ICs

Small classification Specialized ICs

Designed for backplanes and module interfaces such as XFI SFI XAUI and 10GBASE KR when configured per the datasheet

Integrates clock and data recovery equalization and transmit driver functions to simplify high speed board design

Optimized for low power and high signal integrity on lossy copper traces and cables

Date code 19 plus available for current production lots

Key Features

Four independent high speed SerDes channels

Multi rate operation in the 1G to 10G range depending on settings

Integrated CDR on each lane for clean data recovery

Programmable input equalization and output pre emphasis for channel tuning

Built in test PRBS generator checker eye monitoring and loopback modes

Reference clock support with on chip PLL

MDIO management interface common in Ethernet systems plus JTAG for test

Status and alarms for lock loss error counts and health monitoring

Low jitter design suitable for IEEE 802 3 10G links

ESD protection and proven TI high speed design practices

Key Advantages

Cuts component count by integrating key high speed functions

Improves margin on difficult backplanes and cables with adaptive equalization

Low power per lane reduces heat and enables dense line cards

Flexible lane configuration supports many system architectures

Strong diagnostics speed up bring up and production test

Backed by TI ecosystem documentation tools and long term support

Packaging

Package type BGA ball grid array for high speed signals

Material plastic molded package with organic substrate typical of TI BGAs

Size and ball pitch depend on the exact TI package for TLK10034 consult the mechanical drawings in the datasheet for precise dimensions

Pin configuration multi row BGA with differential TX and RX pairs reference clock pins power and ground pins MDIO management pins JTAG and control pins

Thermal characteristics low power architecture and package designed for heat spreading follow TI layout via in pad and thermal design guidance for best results

Electrical properties multiple supply rails for core analog and I O confirm exact voltages tolerances current and sequencing in the TLK10034 datasheet before design

Shipping form factor typically trays for BGA devices moisture sensitive handling recommended with dry pack labels JEDEC MSL per datasheet

Package case reference 869 as provided verify the exact TI package code on the datasheet and label

Tape and reel or custom packing available on request through Y-IC

Lifecycle

Industry use remains active in many mature 10G systems and not widely reported as near discontinuation based on public market knowledge

For the most accurate current lifecycle status Y-IC will confirm TI notices last time buy and last time ship on request

Equivalent or alternative models to consider depending on channel count and features

- TLK10031 single channel device for lower port count designs

- TLK10232 dual channel device for mid density designs

- TI retimers repeaters for signal conditioning only such as DS100BR family if a full transceiver is not required

If you need a pin compatible option or a different feature mix contact our sales team via the Y-IC website for tailored recommendations

Key Application Areas

10 Gigabit Ethernet backplanes and line cards

Data center switches and routers

Optical module interfaces XFI and SFI

Storage and server interconnects such as Fibre Channel and InfiniBand near 10G rates

Wireless infrastructure fronthaul backhaul and baseband links

Test and measurement high speed serial paths and pattern generation

Industrial networking requiring robust 10G links

Datasheet

Y-IC hosts the most authoritative TLK10034 datasheet on our product page

Download the datasheet here to get full electrical specifications pinout mechanical drawings and design guidelines

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