English
| Part Number: | AFE7681IABJ |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | ANALOG FRONT END |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 90+ | $3,142.4934 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply, Digital | - |
| Voltage - Supply, Analog | - |
| Supplier Device Package | 400-FCBGA (17x17) |
| Series | - |
| Package / Case | 400-BFBGA, FCBGA |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tray |
| Number of Channels | 4 |
| Number of Bits | 14 |
| Mounting Type | Surface Mount |
| Base Product Number | AFE7681 |




AFE7681IABJ
Luminary Micro / Texas Instruments. Y-IC is a quality distributor for Texas Instruments and we will provide you with the best products and the best service.
Quad-channel 14-bit analog front end IC for high-performance data acquisition and signal processing. Surface-mount device in a 400-FCBGA 17 mm x 17 mm package. RoHS3 compliant. Supplied in tray packaging. Base product number AFE7681.
4 independent analog channels for multi-channel acquisition
14-bit resolution for precise, high-fidelity signal capture
400-ball flip-chip BGA package, compact 17 mm x 17 mm footprint
Surface-mount design for high-density boards
RoHS3 compliant materials and manufacturing
Supplier device package 400-FCBGA (17x17)
Base product number AFE7681
Integrates multiple channels to cut board count and simplify system design
High resolution improves dynamic range and measurement accuracy
Dense BGA I/O supports complex analog, digital, power, and ground routing
Tray packaging supports automated pick-and-place and high-volume assembly
Backed by Texas Instruments documentation and ecosystem, with Y-IC support and supply
Type 400-FCBGA; compatible BFBGA/FCBGA family options
Size 17 mm x 17 mm body
Pin configuration 400 balls for high I/O density
Material flip-chip BGA on organic substrate
Mounting surface mount
Thermal wide BGA footprint aids heat spreading; use thermal vias, solid ground planes, and follow TI reflow profiles for reliable soldering
Electrical 14-bit analog front-end channels; design for clean power rails, low-noise layout, controlled impedance traces; ESD sensitive, use proper handling
No official notice of end-of-life or last-time-buy is indicated in the information provided. If you need confirmation on lifecycle status, please contact Y-IC sales via our website. Verified drop-in equivalents or alternates are not listed at this time. For compatible alternatives or cross-brand options, reach out to our team and we will recommend suitable models after reviewing your requirements.
Wireless infrastructure and software-defined radio front ends
Test and measurement instruments
Industrial data acquisition and control systems
Medical imaging and diagnostic equipment
Aerospace and defense signal processing
High-speed laboratory and instrumentation platforms
Y-IC hosts the most authoritative datasheet and technical resources for this model. Download the datasheet on this page to get pin maps, electrical specifications, layout guidelines, and application notes.
Get a Quote on Y-IC today. Limited Time Offer on in-stock units (current available quantity 1613). Learn More and send us your BOM for fast pricing, lead times, and technical support.
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