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SN74LVC8T245DWR Image
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Texas Instruments SN74LVC8T245DWR

Part Number: SN74LVC8T245DWR
Manufacturer/Brand: Texas Instruments
Part of Description: IC TRANSLATION TXRX 5.5V 24SOIC
Datasheets:
1.SN74LVC8T245DWR.pdf ···

Datasheets

SN74LVC8T245.pdf

SN74LVC8T245DWR Page PDF

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RoHs Status: ROHS3 Compliant
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In stock: 22722 Pcs Stock

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  • Texas Instruments SN74LVC8T245DWR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments SN74LVC8T245DWR.
    Product Attribute Attribute Value
    Voltage - Supply 1.65V ~ 5.5V
    Supplier Device Package 24-SOIC
    Series 74LVC
    Package / Case 24-SOIC (0.295", 7.50mm Width)
    Package Tape & Reel (TR)
    Output Type 3-State
    Operating Temperature -40°C ~ 85°C (TA)
    Product Attribute Attribute Value
    Number of Elements 2
    Number of Bits per Element 8
    Mounting Type Surface Mount
    Logic Type Translation Transceiver
    Input Type -
    Current - Output High, Low 32mA, 32mA
    Base Product Number 74LVC8T245
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SN74LVC8T245DWR Product Details

SN74LVC8T245DWR Bus Transceiver Product Summary

The SN74LVC8T245DWR from Texas Instruments stands as a versatile, high-performance eight-bit dual-supply bus transceiver, specifically engineered for voltage level translation across a wide spectrum of logic interfaces. At its core, this device offers the capability to connect and enable bidirectional data transfer between subsystems operating at different voltage domains—ranging from 1.65 V up to 5.5 V—through its flexible, fully configurable dual-rail architecture. This characteristic makes the SN74LVC8T245DWR well-suited for personal electronics, industrial automation, enterprise infrastructure, and telecom applications where reliable, logic-level shifting is critical.

Main Functional Attributes of the SN74LVC8T245DWR

Central to the SN74LVC8T245DWR is its dual-rail design, with two independent power supply pins, VCCA and VCCB, allowing each interface port to operate at any supply voltage between 1.65 V and 5.5 V. This flexibility allows seamless translation between conventional logic levels such as 1.8 V, 2.5 V, 3.3 V, and 5 V systems. The device is optimized for asynchronous communications with a direction control (DIR) and output enable (OE) logic, supporting real-time dynamic bidirectional data flow control.

Advanced protection is built-in, with ESD ratings exceeding industry standards (4000 V Human-Body Model, 1000 V Charged-Device Model) and high latch-up immunity (>100 mA per JESD 78, class II). The SN74LVC8T245DWR also supports partial-power-down operation through its Ioff circuitry, which prevents input/output pins from sinking current during power-down, thus safeguarding both device and downstream logic. The VCC isolation feature ensures all outputs transition to high-impedance if either VCC rail is at ground, further protecting against potential backfeed or data corruption during power transients.

SN74LVC8T245DWR Electrical Characteristics and Performance Data

From an electrical standpoint, the SN74LVC8T245DWR is engineered to operate reliably across the full recommended voltage and temperature spectrum. Input and output voltage ranges for both ports match their respective supply rails (1.65 V–5.5 V), providing interface compatibility with a variety of microprocessors, FPGAs, and ASICs.

Output drive is robust: each transceiver channel supports significant output current capability, particularly when powered from 5 V (up to 32 mA per channel), enabling direct driving of multiple bus loads or long PCB traces. CMOS push-pull balanced outputs promote fast edge transitions, but design attention must be paid to avoid signal integrity issues—like ringing—on lightly loaded or unterminated PCB traces.

Switching times (propagation delay and enable times) are specified under various supply conditions with typical propagation delay (tpd) in the range of units of nanoseconds, ensuring compatibility with high-speed digital systems up to several tens of MHz.

Functional Logic and Operational Modes of SN74LVC8T245DWR

The user operates the SN74LVC8T245DWR using two control signals: DIR (direction control) and OE (output enable, active low). Setting OE low enables the device; DIR high selects A-to-B data transfer, while DIR low selects B-to-A. When OE is high, both ports are placed in a high-impedance state, isolating them from the connected buses. Importantly, the input circuit for data signals is always active; designers must avoid slow or floating inputs to prevent excess current draw.

This flexible function table, paired with dual-supply operation, allows engineers to implement complex cross-voltage, bidirectional data buses with precise control over bus contention and signal integrity.

Use Cases for SN74LVC8T245DWR

In practical system design, SN74LVC8T245DWR excels wherever interface voltage mismatch presents a challenge. For example, in mixed-voltage embedded systems, a microcontroller at 1.8 V may need to communicate with legacy peripherals at 5 V; here, the device provides the required safe and reliable translation layer. In telecom and enterprise-grade routers or switches, the ability to connect hot-pluggable cards or modules with varying logic levels is invaluable. Furthermore, the device's partial-power-down and robust ESD features make it suitable for systems where subsystems are frequently powered on/off, or where external interfaces increase the risk of transient events.

Design Factors for Systems Using the SN74LVC8T245DWR

Effective use of the SN74LVC8T245DWR requires attention to several system-level design aspects:

All unused data and control inputs must be firmly tied to logic low or high to prevent undesired current consumption.

When altering the direction of data transfer (DIR), ensure that no I/Os are left floating, to avoid possible bus contention or signal instability.

System designers should verify that the logic high and low input levels (VIH, VIL) meet device data sheet minima and maxima, especially in low voltage systems.

For output drive, the device can source/sink higher currents (e.g., 32 mA at 5 V), but total power dissipation and maximum current ratings per pin and for the whole package must not be exceeded.

Power Management Approaches for the SN74LVC8T245DWR

The SN74LVC8T245DWR's two-supply design calls for careful power management. While both VCCA and VCCB can be ramped up simultaneously, best practice is to apply power first to the input-side supply (typically VCCA) to eliminate the risk of floating logic inputs on device start-up. Proper power sequencing, together with the Ioff feature, helps minimize potential backfeed and ensures predictable behavior during brownout or system reset scenarios.

SN74LVC8T245DWR PCB Design and Mounting Recommendations

For printed circuit board implementation, the following guidelines optimize both electrical performance and device reliability:

Use bypass capacitors as close as possible to both VCCA and VCCB pins to suppress supply transients.

Keep signal trace lengths short to maintain signal integrity and reduce the risk of reflections, especially at high switching speeds.

Pad structures for loading capacitances or pull-up resistors should be included if fine-tuning of rise/fall times or logic levels becomes necessary in the target application.

Assembly must comply with package-specific guidance: the SN74LVC8T245DWR is available in various packages, including 24-pin SOIC, SSOP, TSSOP, TVSOP, and VQFN. Thermal performance, soldering guidelines, and mechanical layout should be verified according to Texas Instruments’ published package datasheets.

Packaging, Environmental Aspects, and Reliability Details for SN74LVC8T245DWR

The SN74LVC8T245DWR meets the current EU RoHS requirements and is available as "green" in selected versions, supporting low-halogen content for environmentally conscious designs. Moisture sensitivity levels and allowable peak solder temperatures conform to JEDEC standards, with each package offering robust thermal and mechanical reliability suited to both consumer and industrial manufacturing environments. Automotive-qualified (SN74LVC8T245-Q1) and enhanced (SN74LVC8T245-EP) variants are also available for mission-critical or extended-temperature applications.

Alternative or Substitute Devices for SN74LVC8T245DWR

Engineers evaluating alternatives to the SN74LVC8T245DWR should consider compatible Texas Instruments variants, such as:

SN74LVC8T245-Q1: Automotive-qualified version for automotive or high-reliability use cases.

SN74LVC8T245-EP: Enhanced product variant for defense, aerospace, or medical applications.

For voltage level translations below 1.65 V, the Texas Instruments AXC series (such as SN74AXC8T245) offers comparable functionality with lower voltage thresholds.

Cross-manufacturer equivalents may be viable, provided full compatibility for pinout, supply voltages, logic thresholds, and performance is verified for the target application.

Conclusion

As circuit complexity and voltage diversity grow in electronic systems, the Texas Instruments SN74LVC8T245DWR remains a key building block for robust, high-speed, multi-voltage data bus interface design. Its combination of dual-rail flexible supplies, robust ESD and latch-up performance, precise bus control logic, and extensive documentation make it a prime choice for engineers facing the challenges of cross-voltage logic integration. Through informed component selection and careful application design, the SN74LVC8T245DWR can significantly simplify mixed-voltage system implementation while ensuring long-term reliability in a broad array of usage scenarios.

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SN74LVC8T245DWR Image

SN74LVC8T245DWR

Texas Instruments

IC TRANSLATION TXRX 5.5V 24SOIC
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