SPANSION S29GL064N90TF104

Mfr. Part

S29GL064N90TF104

Manufacturer

Spansion (Cypress Semiconductor)

Y-IC is a quality distributor for Spansion/Cypress. We supply original parts with reliable lead time, strong technical support, and guaranteed service.

Detailed Description

64‑Mbit parallel NOR Flash memory for code storage and XIP

3.0 V single-supply operation

90 ns random read access time

Top‑Boot block architecture in the GL‑N family

8‑bit or 16‑bit data bus operation

Asynchronous interface, CFI compliant, supports common flash command sets

Key Features

64 Mbit density configurable as 8M x 8 or 4M x 16

2.7 V to 3.6 V VCC single supply for read, program, and erase

90 ns max initial access, 25 ns page access typical on many variants

Sector architecture with Top Boot block layout

Advanced sector protection, hardware WP#, RESET# input, RY/BY# ready status

Program/Erase Suspend and Resume for fast interrupt handling

CFI compliant for easy auto-detection

Low power standby and deep power-down modes

100k erase/program endurance per sector typical, 20 years data retention typical

Key Advantages

True NOR XIP enables direct code execution with fast random read

Mature, widely designed-in platform for long-life embedded systems

Simple 3 V design reduces BOM and power management complexity

Robust protection features reduce accidental code corruption

Broad ecosystem support and proven reliability in the field

Packaging

Type and outline commonly shipped as 48‑pin TSOP I for GL‑N Top‑Boot variants

Body material molded epoxy, RoHS lead‑free options available

Typical 48‑TSOP I body size about 12 x 20 mm, height about 1.2 mm, lead pitch 0.5 mm

Pin configuration supports 8/16‑bit data bus with address pins, CE#, OE#, WE#, RESET#, WP#, RY/BY#

Electrical operating range VCC 2.7–3.6 V, read access 90 ns, standby current typically microamps, active read current typically tens of mA

Thermal characteristics typical θJA in free air roughly 60–90 °C/W depending on board and airflow

ESD protection implemented per industry standards

Listing details here

• Package or case code on listing 849 please confirm exact mechanical drawing with our sales team

• Data code 14+ indicates 2014 or newer lots available

• Available quantity on hand 1132 units at time of listing

Note The exact package code TF104 in your part string is commonly associated with Top‑Boot TSOP variants. Always check the mechanical drawing and pinout in the datasheet for your specific suffix before layout.

Lifecycle

Status Mature product family. Many suppliers steer new designs to newer GL‑S or GL‑T families with improved process

Availability Y-IC actively supports procurement for ongoing production and service needs

Recommended newer or pin‑compatible alternatives

• Infineon/Cypress S29GL064S90TFI04 GL‑S family, Top‑Boot, 90 ns, TSOP 48

• Infineon/Cypress S29GL064T family where uniform sector architecture is acceptable

• Macronix MX29GL640E(T/B) 90 ns series check exact suffix for Top or Bottom Boot and package

• Micron/ST M29W640G 3 V parallel NOR, TSOP 48, 90 ns class verify pinout

• Winbond W29GL064C family verify timing, boot layout, and package

Important Verify pin compatibility, boot block map, voltage, and timing before substitution. If you need a drop‑in equivalent or sourcing for legacy builds, contact Y-IC sales on our website and we will match the best option for your design and supply plan

Key Application Areas

MCU and DSP boot code storage and XIP execution

Industrial control, PLCs, HMIs, robotics

Networking and telecom systems boot memory and configuration storage

Printers, set‑top boxes, smart meters, point‑of‑sale terminals

Data storage for firmware, fonts, and calibration tables

Consumer and white goods embedded control

Legacy automotive service parts where applicable grade is met

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for S29GL064N90TF104 on this product page. Download the datasheet here to confirm package, pinout, AC timing, and all electrical limits before final design.

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