Samsung Electro-Mechanics CL31B682KHFNFNE

Overview of the CL31B682KHFNFNE Capacitor from Samsung Electro-Mechanics

The CL31B682KHFNFNE from Samsung Electro-Mechanics is a surface-mount multilayer ceramic capacitor (MLCC) designed for demanding electronic environments. Classified as a 6800 pF ±10% device with an X7R dielectric and rated at 630V, this MLCC comes in a compact 1206 (3216 metric) package. It offers engineers a versatile solution for high-voltage noise suppression, coupling, and bypass applications in both consumer and industrial-grade electronics.

Main Characteristics and Fundamental Technologies of the CL31B682KHFNFNE

The CL31B682KHFNFNE leverages Samsung’s advanced ceramic materials and manufacturing processes:

X7R dielectric provides a stable capacitance over a broad temperature range (−55°C to +125°C), meeting the requirements of both general-purpose and critical applications.

The device’s 630V rating addresses high-voltage environments, minimizing the risk of dielectric breakdown.

The 1206 package ensures compatibility with high-density automated surface-mount assembly, supporting miniaturized, space-efficient designs.

Constructed with nickel barrier terminations and tin (Sn) plating, it exhibits both mechanical ruggedness and solderability.

The MLCC structure effectively absorbs and reduces circuit noise, contributing to reliable signal integrity.

Improved DC bias performance and stable characteristics under bias, temperature, and time.

In-depth Electrical and Physical Specifications of the CL31B682KHFNFNE

Capacitance: 6800 pF, standard code “682”

Tolerance: ±10%

Rated Voltage: 630V DC

Dielectric Type: X7R (Class II, Temperature stable, ±15% from -55°C to +125°C)

EIA Case Code: 1206 / Metric 3216

Termination: Nickel barrier with tin (Sn) finish, suitable for lead-free soldering

Moisture Sensitivity Level (MSL): 1 (Unlimited), supporting standard assembly and storage requirements

Insulation resistance and dissipation factor have been optimized for low leakage and reliable long-term operation.

Reliability and Environmental Standards for the CL31B682KHFNFNE

The CL31B682KHFNFNE stands out for its robust qualification standards:

RoHS3 compliant, free from restricted hazardous substances

REACH unaffected, making it suitable for global deployment

Classified under ECCN EAR99, simplifying export control procedures

High reliability, capable of withstanding demanding environmental exposures

Excellent performance in board-bending and mechanical stress tests, reducing failure risk in real-world operation

Use Cases and Applications of the CL31B682KHFNFNE

Owing to its high rated voltage, excellent reliability, and compact form factor, the CL31B682KHFNFNE serves in numerous sectors:

Power electronics: Input/output filtering and DC-link decoupling in DC-DC converters, solar inverters, and power supplies

Industrial controls: Noise suppression and signal coupling in control modules and automation

Consumer electronics: Signal filtering in HD displays, PCs, gaming devices, smartphones, tablets

Network and communications: Base stations, high-speed network infrastructure, and data servers

Automotive and high-reliability: Application when qualified to automotive or industrial standards

Recommendations for Mounting, Soldering, and Handling the CL31B682KHFNFNE

To maximize performance and long-term reliability, observe the following during production:

Adhere to standard SMT assembly techniques, with a reflow profile suited for the tin-plated termination.

Avoid excessive mounting head pressure (>300g.f.) to prevent ceramic cracking.

Support PCBs during mounting and depaneling to mitigate board flexural stress.

Minimize the use of Sn-Zn-based solders; Sn-Ag-Cu (SAC) compositions are recommended.

Use proper land patterns as evaluated for 1206 package MLCCs to ensure optimal solder fillet and mechanical support.

Follow recommended reflow and wave soldering profiles to avoid thermal shock.

Packaging Methods and Storage Procedures for the CL31B682KHFNFNE

Samsung Electro-Mechanics provides robust tape-and-reel packaging for the CL31B682KHFNFNE, facilitating high-speed automated pick-and-place assembly:

Store at 0°C to 40°C and 0% to 70% RH, avoiding condensation and high humidity for prolonged product reliability.

Avoid corrosive atmospheres and exposure to direct sunlight during storage.

Maintain a shelf life within 6 months for optimal solderability; check solder performance for inventory exceeding this duration.

Alternative or Substitute Models Comparable to the CL31B682KHFNFNE

Engineers considering design alternate or multi-source strategies may evaluate the following:

Samsung Electro-Mechanics offers similar specification MLCCs in the same 1206 size and capacitance, with variants tailored for high bending strength, low acoustic noise, or low ESL for specialized applications.

Equivalent MLCCs with 6800pF, 630V, X7R dielectric in 1206 case sizes are available from other leading MLCC manufacturers. When evaluating equivalents, examine the following critical characteristics:

- Dielectric aging rate (Class II)

- DC bias capacitance change

- Termination structure and solderability

- Mechanical stress and thermal shock tolerance

- RoHS and REACH compliance

For applications with greater board flex or acoustic noise concerns, consider the High Bending Strength or Low Acoustic Noise MLCC series within the Samsung portfolio.

Conclusion

The CL31B682KHFNFNE from Samsung Electro-Mechanics is a high-voltage, surface-mount MLCC well-suited to engineers seeking dependable performance for noise suppression, filtering, and decoupling in advanced electronics. Its robust X7R dielectric, wide operating temperature range, RoHS compliance, and ease of assembly make it an attractive solution for both newly designed platforms and legacy system upgrades. When precise capacitance, mechanical integrity, and high-voltage resilience are required, the CL31B682KHFNFNE merits strong consideration. For those with special reliability needs, Samsung’s extended portfolio and the device’s cross-compatibility further enhance flexibility in modern electronic designs.