Samsung Electro-Mechanics CL31B226KPHNNNE

CL31B226KPHNNNE Samsung Electro-Mechanics MLCC Product Summary

The CL31B226KPHNNNE from Samsung Electro-Mechanics is a multi-layer ceramic capacitor (MLCC) optimized for compact designs requiring high capacitance and moderate voltage tolerance. Featuring a nominal capacitance of 22 μF, a rated voltage of 10V, ±10% tolerance, and X7R dielectric, this surface-mount device utilizes the 1206 (3216 Metric) package, making it well-suited for modern, high-density printed circuit board layouts. Its physical and electrical properties target markets such as consumer electronics, industrial controls, and communications equipment, where reliable charge storage and stable performance across a broad temperature range are mission-critical.

CL31B226KPHNNNE Construction Details and Size Specifications

Samsung Electro-Mechanics engineers the CL31B226KPHNNNE as a standard 1206 MLCC. The device leverages a multi-layer sandwich structure of ceramic dielectric and metal electrodes, optimizing both volumetric efficiency and reliability under thermal and mechanical stresses. The MLCC’s glass epoxy-reinforced terminations provide robust adhesion and electrical contact when processed using standard SMT techniques. The recommended PCB substrate is a glass epoxy with a thickness of 1.6 mm, and the device is compatible with both copper and standard solder pad metallization. Adherence to these recommendations ensures maximum mechanical integrity during board assembly and operation.

CL31B226KPHNNNE Main Electrical Properties

The CL31B226KPHNNNE X7R MLCC offers several notable electrical characteristics:

Capacitance: 22 μF measured under specified test voltage and frequency, per EIA RS-198-1-F-2002.

Tolerance: ±10%, supporting moderate precision applications.

Dielectric: X7R, providing good thermal stability (capacitance change within ±15% from −55°C to +125°C).

Dissipation factor (DF): specified for Class II MLCCs, representing dielectric and electrode losses.

Insulation resistance: Ensured via high-quality dielectric formulation, measured after applying the rated DC voltage for one minute.

Capacitance aging: Typical of Class II dielectrics, requiring design allowances for a log(time) decrease, particularly post-heat treatment.

DC bias effect: Capacitance may decrease under applied DC voltage; include voltageand application-dependent derating in your design margin.

Impedance: Functions as a capacitor at low frequencies, transitioning through self-resonant frequency (SRF) and presenting inductive characteristics at higher frequencies. Both ESR and ESL factors should be evaluated for high-frequency or switching applications.

These properties necessitate careful assessments in demanding analog, power integrity, and frequency-dependent circuits to maintain expected circuit performance.

CL31B226KPHNNNE Reliability and Environmental Factors

Reliability testing of the CL31B226KPHNNNE addresses multiple stress factors: temperature cycling, humidity, applied voltage, and mechanical stress. It is qualified for continuous operation up to +125°C and is subjected to accelerated reliability tests as per industry standards. Careful derating of voltage and temperature is recommended for maximum longevity, with prime attention required when the application involves AC ripple, pulse currents, or switching transients.

Additionally, the component is sensitive to overvoltage events such as ESD or electrical overstress, which can precipitate dielectric breakdown or mechanical damage. For applications exposed to frequent surge or vibration, evaluation of specialized variants (e.g., soft-terminal MLCCs) may be necessary. Environmental practices include avoidance of corrosive atmospheres during storage and ensuring protection from direct sunlight, excessive humidity, or mechanical impacts.

CL31B226KPHNNNE Instructions for Soldering, Mounting, and Handling

To realize the full reliability of the CL31B226KPHNNNE, strict adherence to best practices in SMT assembly is essential. Recommended soldering method is reflow, with a peak temperature of 260°C (±5°C) for up to 30 seconds. Preheating the assemblies helps minimize thermal shocks and avoids ceramic cracking. The number of reflow cycles should ideally be limited to three to minimize cumulative thermal stress, especially for high-capacitance or ultra-small devices.

During placement, restrict mounting head pressure to a maximum of 300g.f., support the substrate when working with two-sided boards, and ensure pick-and-place tools are well-maintained to avoid component damage. Correct land pattern design is crucial for optimal solder fillet, balancing the risk between solder starvation (weak adhesion) and excessive solder (cracking due to mechanical stress).

Manual soldering and rework should use suitably fine tips, controlled temperatures, and rigorous preheating. Post-soldering cleaning processes, especially ultrasonic or high-pressure techniques, must be validated to prevent board or component damage. When inspecting or testing on finished assemblies, support the PCB adequately to prevent flexural stresses that crack MLCCs.

CL31B226KPHNNNE Packaging Methods and Storage Recommendations

The CL31B226KPHNNNE is available in standard taping and reel configurations adhering to the IEC 60286-3 standard for SMT automatic assembly. Packaging labels convey model, value, lot, and relevant traceability data. For storage, maintain an environment between 0–40°C and 0–70% RH. To prevent solderability degradation, observe a shelf-life limit of six months from delivery for unopened product. Excess exposure to humidity or corrosive gases can compromise outer terminations and device reliability; products kept beyond this window require solderability verification before use.

CL31B226KPHNNNE Circuit Integration and Application Advice

Incorporating the CL31B226KPHNNNE into an electronic design requires attention to several best-practice principles. For power supply decoupling and charge storage in DC-DC converters, account for X7R’s capacitance drop under DC bias and temperature. Applications sensitive to precise timing or minimal drift should consider Class I MLCCs for critical nodes. Where large inrush currents, surge, or ESD events are possible, include suitable protection circuits such as fuses or TVS diodes, as the MLCC is not inherently safety-rated for such usage.

Mechanical considerations—including PCB material selection, land pattern definition, and adequate strain relief—are essential. In high-density layouts or where board flexing may occur (e.g., connectors, screws, or heavy through-hole components), locate the MLCC away from cutouts and mechanical stress points where possible. The choice and handling of adhesives, conformal coatings, and cleaning agents need to respect chemical compatibility and ensure that neither degrade the MLCC’s electrical performance or induce mechanical stress.

CL31B226KPHNNNE Alternative and Replacement Model Options

For engineers seeking alternative sourcing or second-source qualification, the CL31B226KPHNNNE’s defining attributes are 22 μF capacitance, 10V rating, ±10% tolerance, X7R dielectric, and 1206 (3216 metric) package. When searching for equivalent MLCCs, look for:

Manufacturers producing AEC-Q200 qualified MLCCs in 1206 size

Same or better voltage and capacitance ratings

X7R (or similar X7R/X7S/X5R) dielectric for similar temperature characteristics

Matching tolerance and ESR profiles

Possible equivalents may come from other major MLCC vendors. Always review the supplier datasheet to confirm DC bias effect, SRF, ESR, and temperature ratings align with your application requirements, and, if applicable, require comparable reliability and test data.

Conclusion

: Evaluating CL31B226KPHNNNE for your application

The Samsung Electro-Mechanics CL31B226KPHNNNE MLCC offers a compelling balance of high capacitance, good thermal stability, and robust SMT compatibility for demanding electronic designs. Selecting this model requires careful adherence to mounting and handling recommendations, as well as attention to circuit derating, DC bias, temperature drift, and mechanical integrity. When evaluating alternatives, prioritize equivalent parameters and reliability records. For engineers and procurement specialists, the CL31B226KPHNNNE represents a cost-effective and versatile solution for mainstream decoupling and power supply stabilization duties, provided its operational constraints and handling guidelines are respected throughout the product lifecycle.