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| Part Number: | CL10B751KB8NNNC |
|---|---|
| Manufacturer/Brand: | Samsung Electro-Mechanics |
| Part of Description: | CAP CER 750PF 50V X7R 0603 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.1035 |
| 10+ | $0.0705 |
| 50+ | $0.0401 |
| 100+ | $0.0332 |
| 500+ | $0.0233 |
| 1000+ | $0.0193 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Rated | 50V |
| Tolerance | ±10% |
| Thickness (Max) | 0.035' (0.90mm) |
| Temperature Coefficient | X7R |
| Size / Dimension | 0.063' L x 0.031' W (1.60mm x 0.80mm) |
| Series | CL |
| Ratings | - |
| Package / Case | 0603 (1608 Metric) |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount, MLCC |
| Lead Style | - |
| Lead Spacing | - |
| Height - Seated (Max) | - |
| Features | - |
| Failure Rate | - |
| Capacitance | 750 pF |
| Applications | General Purpose |




The CL10B751KB8NNNC is a surface-mount multilayer ceramic capacitor (MLCC) manufactured by Samsung Electro-Mechanics, featuring a capacitance value of 750 picofarads (pF), a rated voltage of 50V, X7R temperature characteristic, and the popular 0603 (1608 metric) package. This model is part of Samsung’s broad lineup of general-purpose and reliability-focused MLCCs, engineered for wide applicability in noise suppression, coupling, and decoupling circuits. Its compact form factor and RoHS3 compliance make it ideal for modern, high-density electronic assemblies across consumer, industrial, and communications platforms.
The CL10B751KB8NNNC offers a nominal 750pF capacitance with a ±10% tolerance. Its X7R dielectric provides stable electrical performance across a wide temperature range (−55°C to +125°C) with a maximum capacitance change of ±15%. The 0603 (1.6 x 0.8mm) size delivers a balance between board real estate efficiency and ease of SMT handling.
Decoding the part number:
CL: Multilayer Ceramic Capacitor series
10: Case size (0603/1608 metric)
B: X7R dielectric
751: Capacitance value (750pF)
K: Tolerance (±10%)
B: Rated voltage (50V)
8NNNC: Internal and packaging codes, defining electrode type and packaging specification
This model's rated voltage makes it well-suited for general signal line filtering, power supply smoothing, and driver or interface line bypassing in low-voltage systems.
The construction of the CL10B751KB8NNNC consists of a ceramic body with alternating layers of ceramic dielectric and nickel electrode, terminated with copper and plated with tin for soldering reliability. Samsung’s process yields tight control over dimensions and electrical parameters, ensuring fit and function in automated assembly.
Reliability options within the CL series include:
Standard: For general consumer and commercial applications.
High Level I: Enhanced moisture and bending robustness for industrial and mission-critical uses.
High Level II: Reinforced performance for high-temperature/humidity outdoor or infrastructure environments.
The standard type, as represented by CL10B751KB8NNNC, is optimized for mainstream volume manufacturing.
The X7R dielectric ensures the CL10B751KB8NNNC provides stable capacitance under temperature fluctuations, suitable for environments with varying thermal profiles. The part features strong DC bias performance and low leakage typical of class II MLCCs.
Typical values and characteristics:
Dielectric: X7R (Class II)
Capacitance: 750pF
Rated voltage: 50V DC
Capacitance tolerance: ±10%
Temperature range: −55°C to +125°C (±15% capacitance deviation)
Dissipation factor (DF): Specified per class II, optimized for signal and power integrity applications
Insulation resistance: High, supporting low leakage requirements
The mechanical robustness of the 0603 package is sufficient for high-speed automated placement and reflow exposures.
While the base CL10B751KB8NNNC unit serves as a standard type, Samsung offers specialized CL series MLCCs with enhancements tailored to application stress factors:
High Bending Strength: For assemblies exposed to board flexing or vibration (e.g., automotive, industrial power modules)
Low Acoustic Noise: Mitigates piezoelectric-induced audible noise in audio and display circuits
Low ESL: For high-speed, low-inductance power delivery, such as in processor decoupling
Land Side Capacitor (LSC): For ultra-thin designs, attachable between solder balls for height-critical modules
Molded Frame Capacitor (MFC): For extreme mechanical strength under high solder cycling and moisture challenges
The CL10B751KB8NNNC is deployed extensively in:
Mobile devices (smartphones, tablets, wearables): Power line filtering, decoupling for ICs/PMICs
Personal computing (laptops, PCs, SSDs): Bypass applications for memory and processor modules, EMI suppression
Displays and gaming consoles: Noise filtering on power and signal rails
DC-DC converters and power management: Input/output filtering to reduce ripple and impedance
Network equipment and base stations: Noise suppression in FPGA, DSP, and high-reliability signal chains
Industrial controls (PLCs, converters): Smoothing and protection of sensitive analog and digital lines
This model is fully RoHS3 compliant and “REACH unaffected,” confirming suitability in global and eco-sensitive markets. The moisture sensitivity level (MSL 1, unlimited floor life) permits standard SMT processing and inventory storage. For high-reliability applications, Samsung’s extended reliability variants offer enhanced endurance against humidity, mechanical shock, and temperature cycling as described in respective level designations.
Selection and deployment of the CL10B751KB8NNNC should consider the following:
PCB Land Pattern: Use recommended dimensions for consistent solder fillet and stress distribution.
Derating: Operating voltage should not exceed rated, with further derating advisable in high-stress (thermal, humidity, or pulse) scenarios.
Mechanical Placement: Avoid excessive pick-and-place pressure (>300gf) and bending during/depop after mounting, especially near cutouts and screw holes.
Reflow soldering: Follow recommended profiles (three cycles max, gradual cooling) to prevent cracking caused by thermal gradients.
Cleaning/Flux: Use low-halogen, non-acidic flux; avoid strong ultrasonic cleaning to prevent microcracks.
CL10B751KB8NNNC units are available in various carrier tape (cardboard and embossed) and reel sizes. Storage recommendations are:
Temperature: 0 to 40°C
Humidity: Below 70% RH
Recommended shelf life: Less than 6 months post-delivery; solderability should be checked if storing longer
Protection from corrosive atmospheres, direct sunlight, and mechanical shocks
Box packaging ensures damage-free transportation, with clear lot traceability and part detail labeling to streamline stockroom and SMT operations.
Engineers should account for class II MLCC characteristics:
Capacitance drift with time (aging) and applied DC/AC bias
Piezoelectric noise under AC signals in audio/precision circuits
Solder process parameters to prevent microcracking
Allow margin for environmental factors in applications prone to voltage surges or thermal extremes
Avoid using in safety-critical or high-reliability equipment (e.g., aerospace, medical, automotive) without consulting Samsung for specific application approval
When substituting or cross-referencing the CL10B751KB8NNNC, ensure close matching on:
Capacitance (750pF)
Rated voltage (50V)
Dielectric (X7R, Class II)
Size (0603 / 1608 metric)
Environmental certifications (RoHS3, REACH)
Potential equivalent MLCCs include:
Other Samsung CL10 series MLCCs with the same denomination, different reliability grades depending on application requirements
Yageo CC0603KRX7R9BB751
Murata GRM188R71H751KA01
TDK C1608X7R1H751K080AA
It is critical to confirm DC bias behavior, ESR, and other application-specific performance metrics before fully replacing the part.
The Samsung Electro-Mechanics CL10B751KB8NNNC stands out as a versatile, reliable MLCC solution for compact designs requiring robust 750pF, 50V X7R performance in a 0603 package. With a well-documented construction standard and global environmental compliance, it is optimized for large-scale, automated SMT environments yet flexible for use in specialized, ruggedized systems with the appropriate variant selection. Application engineers and sourcing professionals will benefit from understanding its characteristics, reliability options, and best-practice handling and mounting instructions to maximize lifetime performance and minimize board-level risks. When considering alternatives, always perform due diligence on electrical equivalency and operating condition suitability before substituting the CL10B751KB8NNNC in your design.
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