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| Part Number: | BUL1102EFP |
|---|---|
| Manufacturer/Brand: | STMicroelectronics |
| Part of Description: | TRANS NPN 450V 4A TO220FP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.2705 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 450 V |
| Vce Saturation (Max) @ Ib, Ic | 1.5V @ 400mA, 2A |
| Transistor Type | NPN |
| Supplier Device Package | TO-220FP |
| Series | - |
| Power - Max | 30 W |
| Package / Case | TO-220-3 Full Pack |
| Package | Tube |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 150°C (TJ) |
| Mounting Type | Through Hole |
| Frequency - Transition | - |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 12 @ 2A, 5V |
| Current - Collector Cutoff (Max) | 100µA |
| Current - Collector (Ic) (Max) | 4 A |
| Base Product Number | BUL1102 |




The BUL1102EFP from STMicroelectronics is a high voltage, fast-switching NPN power transistor engineered for robust and reliable operation in demanding power electronics applications. Housed in the TO-220FP plastic package, the BUL1102EFP is tailored for use in electronic ballasts and converter circuits, where reliable switching of high voltages and currents is critical. Its advanced multi-epitaxial planar technology with a cellular emitter structure allows for enhanced switching speeds and a broad Reverse Biased Safe Operating Area (RBSOA), making it especially suitable for modern high-frequency lighting ballast topologies and similar applications.
At its core, the BUL1102EFP is designed to handle significant electrical and thermal stress. It boasts a maximum collector-emitter voltage (V_CEO) of 450 V and can conduct a collector current (I_C) up to 4 A. The device is rated for a maximum power dissipation of 30 W, enabling it to switch moderate to high power loads efficiently. Thermal stability is enhanced with the TO-220FP package, providing a thermal resistance junction-to-case suitable for most medium-power designs. Absolute maximum and recommended operating ratings ensure the transistor offers the necessary headroom for transient events and reliable long-term operation under standard application environments.
Engineers selecting the BUL1102EFP benefit from its high voltage capability and exceptional switching speed. The device’s architecture incorporates a planar edge termination and an increased intermediate layer. This results in a marked improvement in both ruggedness and dynamic response. Its intrinsic robustness enables the transistor to withstand elevated collector currents during breakdown events, a critical attribute in the absence of traditional protective circuits like Transil™ devices in lamp ballasts. Its switching behavior is characterized by low storage and fall times, fitting the needs of both resistive and inductive load environments. Safe operating area (SOA) curves, as provided in the documentation, give further insight into the reliable application envelope, while saturation voltage and current gain curves help inform drive and loss calculations for design optimization.
The BUL1102EFP is ideal for use in high-frequency electronic ballasts, especially for four-lamp configurations in both 120 V mains (push-pull) and 277 V mains (half-bridge current-fed) topologies. Its combination of high speed and voltage tolerance lends itself well to modern, efficient fluorescent lighting and other high-frequency converter applications. The device’s robust behavior during abnormal operating conditions adds an extra level of safety, reducing the need for secondary protection components and simplifying overall circuit design. By enhancing switching resilience in both start-up and fault modes, the BUL1102EFP contributes to longer system lifetimes and lower maintenance costs, both central evaluation criteria in professional lighting and power supply systems.
Mechanical compatibility and environmental compliance are fundamental for seamless integration into end products. The BUL1102EFP is supplied in the widely adopted TO-220FP package, which offers full isolation between the mounting tab and the internal die, substantially reducing the risk of assembly errors and facilitating thermal management strategies. Detailed mechanical drawings and package dimensions are readily available to support layout and assembly tasks. In terms of environmental responsibility, the BUL1102EFP aligns with STMicroelectronics’ ECOPACK® initiative, indicating that it can be selected in grades meeting stringent environmental and RoHS compliance requirements. This foresight ensures ease of qualification in global markets.
In engineering and procurement workflows, identifying suitable alternatives—or planning for second sourcing—is crucial. The BUL1102EFP’s combination of 450 V V_CEO, 4 A collector current, and TO-220FP insulation package should drive the initial search for equivalents. Replacement candidates should be evaluated on parameters such as breakdown voltage, current rating, gain, switching speed, and mechanical compatibility with the TO-220FP outline. When selecting substitutes, engineers should also assess RBSOA, SOA curves, and switching loss characteristics, as these influence application reliability in inductive or high-frequency switching contexts. Reviewing offerings from major transistor manufacturers that adhere to the same performance and packaging benchmarks can ensure seamless drop-in replacement or qualification in multisource designs.
The BUL1102EFP from STMicroelectronics stands out as a robust and high-performance NPN power transistor for high-voltage, high-speed switching applications, especially within electronic ballast and power converter markets. By combining advanced semiconductor technology, proven robustness, and environmental compliance—in a universally recognized package—it offers engineers and procurement specialists a reliable foundation for new and legacy designs. A thorough understanding of its electrical, thermal, mechanical, and application-specific strengths supports confident product selection and long-term system value.
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