ST TDA2025B

Mfr. Part

TDA2025B

Manufacturer

STMicroelectronics

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Detailed Description

STMicroelectronics TDA2025B is a Specialized IC under the Integrated Circuits (ICs) category.

Package type is DIP for through-hole mounting. Package or case code noted as 607.

Current listing shows 1103 units available.

The exact electrical function, pinout, and ratings are defined by the official TDA2025B datasheet. Please review the datasheet for precise specifications, recommended operating conditions, and application guidance.

Key Features

Branded STMicroelectronics quality and reliability.

Through-hole DIP package for easy hand-soldering, prototyping, and maintenance.

Stable operation and robust design typical of ST’s TDA family devices.

Clear pin arrangement in dual-inline rows with standard 2.54 mm pitch (verify exact pin count in the datasheet).

Wide ecosystem of compatible peripherals and design references for TDA-series ICs.

Suitable for legacy boards or service replacements where DIP packages are required.

Key Advantages

Simple assembly and rework due to DIP format.

Good mechanical strength and socketability for field service.

Easier thermal management via large copper areas and wide lead contact.

Ideal for education, prototyping, and industrial repair scenarios where through-hole components are preferred.

Backed by Y-IC’s sourcing quality, traceability, and after-sales support.

Packaging

Type: DIP through-hole dual in-line package

Material: Molded plastic epoxy body with tin-plated copper leads

Case code: 607 as provided, confirm mechanical drawing in the datasheet

Size: Standard DIP footprint. Body width and length vary with pin count. Check datasheet for exact dimensions and tolerances

Pin configuration: Two parallel rows, 2.54 mm pitch, keyed by pin 1 marking. The exact pin count and function mapping are defined in the TDA2025B datasheet

Thermal characteristics: Heat dissipation primarily through leads and PCB copper area. If the device handles notable power, use generous copper planes and airflow. Refer to datasheet junction-to-ambient guidelines

Electrical properties: Operating voltage range, quiescent current, output characteristics, protections, and ESD levels are model-specific. See datasheet for absolute maximum ratings and recommended operating conditions

Lifecycle

TDA-series parts are mature. Availability may vary by region and time. TDA2025B could be legacy or NRND depending on ST’s current portfolio

If TDA2025B is limited or approaching discontinuation, consider these functionally similar families as potential alternatives. Always verify pinout, package, and performance against your design

- ST TDA2030A. Audio power amplifier, widely used, Pentawatt TO-220-5 package. Not pin-compatible with DIP

- ST TDA2003. Car radio audio amplifier, TO-220-5. Different package and pinout

- ST TDA2050. High-performance audio amplifier, TO-220-5, often NRND. Different package

- Texas Instruments LM1875. 20 W audio amplifier, TO-220-5. Different package

- ON Semiconductor TDA2822M. Dual low-power audio amplifier, DIP-8. Lower power and different function

- NJM2073. Dual power amplifier, DIP or SIP, low power. Different function

If a direct drop-in equivalent is required, contact our sales team via the Y-IC website. We will cross-reference by pinout, package, and performance and provide the most suitable alternatives

Key Application Areas

Legacy equipment maintenance and repair where DIP format is required

Education and prototyping boards using through-hole components

Consumer and industrial modules designed around ST TDA-series ICs

Audio, analog, or control circuits as defined by the TDA2025B datasheet

Hobbyist and DIY projects needing easy soldering and robust assembly

Datasheet

Y-IC hosts the most authoritative datasheet for TDA2025B on our product page. We recommend downloading it now to get exact electrical specs, pin descriptions, mechanical dimensions, and application notes

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