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| Part Number: | STM32L476ZET6 |
|---|---|
| Manufacturer/Brand: | STMicroelectronics |
| Part of Description: | IC MCU 32BIT 512KB FLASH 144LQFP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $73.9512 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | 1.71V ~ 3.6V |
| Supplier Device Package | 144-LQFP (20x20) |
| Speed | 80MHz |
| Series | STM32L4 |
| RAM Size | 128K x 8 |
| Program Memory Type | FLASH |
| Program Memory Size | 512KB (512K x 8) |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, PWM, WDT |
| Package / Case | 144-LQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Number of I/O | 114 |
| Mounting Type | Surface Mount |
| EEPROM Size | - |
| Data Converters | A/D 24x12b; D/A 2x12b |
| Core Size | 32-Bit Single-Core |
| Core Processor | ARM® Cortex®-M4 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART, USB OTG |
| Base Product Number | STM32L476 |




The STM32L476ZET6 microcontroller from STMicroelectronics is a member of the STM32L4 ultra-low-power family, designed to balance real-time performance and energy efficiency. It is implemented in a 144-pin LQFP (low-profile quad flat package), making it suitable for a wide range of high-density embedded applications, from portable instrumentation to industrial automation. Built around a 32-bit ARM® Cortex®-M4 core, STM32L476ZET6 delivers the flexibility and feature set required by engineers focused on demanding, low-consumption systems with substantial connectivity and analog interface requirements.
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At the heart of the STM32L476ZET6 lies the ARM Cortex-M4 core with floating-point unit (FPU), operating at up to 80 MHz. The core’s adaptive real-time accelerator (ART Accelerator) enables zero-wait-state execution from flash memory, translating to a performance benchmark of 100 DMIPS and 273.55 CoreMark (3.42 CoreMark/MHz at 80 MHz). Enhanced with advanced DSP instructions and a memory protection unit (MPU), the STM32L476ZET6 can efficiently execute complex control algorithms and digital signal processing tasks.
This core architecture, combined with an interconnect matrix, multiple clock sources, and a proprietary code readout protection, creates a robust environment optimized for both high control-loop performance and low-energy operation. Engineers can leverage a suite of on-chip debug and trace features, including SWD/JTAG support and an embedded trace macrocell, to accelerate firmware development and system validation.
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The STM32L476ZET6 provides a comprehensive and flexible memory architecture. Program memory includes up to 512 KB of embedded flash organized into two read-while-write banks, supporting real-time firmware management and field update scenarios. Complementing flash storage, the device integrates 128 KB of SRAM, with 32 KB offering hardware parity check for enhanced reliability in critical applications. Backup registers (32 x 32-bit) are available for data retention in low-power VBAT operation, and the flexible static memory controller (FSMC) allows interfacing with external SRAM, PSRAM, NOR, and NAND memories. This memory structure is engineered to support secure boot modes, firmware integrity, and efficient data processing for both signal analysis and control.
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A defining strength of the STM32L476ZET6 is its ultra-low-power design, suitable for battery-operated and energy-harvesting applications. Supply voltages from 1.71 V to 3.6 V are supported, with the FlexPowerControl technology offering fine-grained, dynamic power scaling. Current consumption is minimized across various modes: 30 nA in shutdown (with wakeup pins), 120 nA standby (with RTC), and an ultra-efficient 100 μA/MHz in run mode (with LDO), or as low as 39 μA/MHz when supplied via external SMPS. Wakeup from stop mode can be achieved in as little as 4 μs, ensuring responsiveness in intermittent operation scenarios. Brown-out reset and a comprehensive power supervision system make the STM32L476ZET6 robust against transient supply conditions, crucial for mission-critical and portable devices.
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With a highly integrated peripheral set, the STM32L476ZET6 streamlines system design for connectivity-rich applications. Key interface features include:
5x USART/LIN/IrDA/modem, 1x LPUART
3x I²C, SMBUS/PMBUS support (up to 1 Mbit/s), 3x SPI and 1x Quad-SPI
2x SAI for stereo audio
1x CAN (2.0B), SDMMC for secure digital and multimedia card support
USB 2.0 OTG FS with battery charging detection
SWPMI (single wire protocol master I/F), IR interface, LCD controller, and capacitive touch sensing controller (up to 24 channels)
The MCU also features up to 114 I/O pins (most 5V-tolerant, with independent supply down to 1.08V on up to 14 pins), multiple DMA channels, an advanced timer suite with motor-control support, watchdogs, and a 96-bit unique device ID for product-level traceability.
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For mixed-signal and sensor applications, the STM32L476ZET6 integrates rich analog functions:
Three 12-bit ADCs (up to 5 Msps) with hardware oversampling (up to 16-bit resolution)
Two 12-bit DAC channels with low-power sample-and-hold
Two ultra-low-power comparators and two operational amplifiers (with built-in programmable gain amplifier)
Temperature sensor, internal voltage reference, and VBAT monitoring
Touch sensing controller, supporting capacitive touchkeys, and rotary/linear sensors
A digital filter for sigma-delta modulators (DFSDM) is also included, enabling high-performance audio and precision current sensing in industrial or medical environments.
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The STM32L476ZET6 is delivered in a 144-LQFP (20 x 20 mm) package, ensuring a balance between IO count, PCB real estate, and assembly cost. The package is ECOPACK2 compliant (RoHS), and designed for mainstream solder reflow, with a moisture sensitivity level (MSL) of 3 (168 hours). Its 0.5 mm pitch and surface-mount profile make it compatible with both automated pick-and-place and manual assembly processes in volume and prototyping scenarios. Thermal management and PCB layout should consider the device’s dissipation characteristics for sustained operation across the full industrial temperature range (-40°C to +85°C).
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The electrical specification supports Vcc in the range 1.71V–3.6V, aligning with modern battery chemistries and regulated industrial/consumer supplies. Absolute maximum ratings uphold device integrity under typical field stresses, while current consumption presents among the industry’s best-in-class for the given processing and peripheral capability. The STM32L476ZET6 can sustain operation over a -40°C to +85°C ambient range, targeting robust deployment in both indoor and outdoor environments. ESD, EMC, I/O voltage, and analog parameter details reinforce suitability for both commercial and industrial applications with stringent reliability and compliance requirements.
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Within the STM32L4 family, several devices mirror or extend the capabilities of the STM32L476ZET6. These include STM32L476ZE, STM32L476ZG, STM32L476VE, and STM32L476QE, varying mainly by package, flash, and SRAM sizes. During selection, engineers should confirm the required peripheral availability and memory configuration, alongside validated pinouts and qualified temperature ranges. For migration or second sourcing, similar STM32L476xx models can be chosen based on footprint compatibility or extended feature sets (such as larger LCD drive or additional external memory options).
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The STMicroelectronics STM32L476ZET6 is a premier ultra-low-power microcontroller solution for engineers seeking a high-performance ARM Cortex-M4 core, deep analog and digital integration, and scalable memory—all in a large LQFP package. Its energy management features and comprehensive peripheral set make it a leading choice for applications ranging from portable instrumentation and wearables to industrial control and complex connected devices. By understanding its architecture and selecting the matching package and compatible models, engineers and procurement teams can optimize for design longevity, cost, and future upgradability in next-generation embedded systems.
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