SUMITOMO 6189-7065

Mfr. Part

6189-7065

Manufacturer

SEIP (Sumitomo Electric Interconnect Products). Y-IC is a quality distributor for SEIP and we are committed to delivering the best products and services to you.

Detailed Description

SEIP 6189-7065 is listed under Integrated Circuits in the Specialized ICs category with a manufacturer package/case code 778. It is intended for high-reliability applications where compact packaging and robust performance are needed. Current available quantity is 3300 units. Note: SEIP part numbering is often used for interconnect components in automotive-grade systems. If your project requires confirmation of whether 6189-7065 is an IC or an interconnect device for your specific build, our team can verify the exact form, function, and fit for you.

Key Features

Specialized IC classification for targeted functions

Manufacturer-specific 778 package for compact design

Industrial and automotive grade reliability focus

Designed for wide operating environments and stable performance

Lead-free and RoHS-compliant options available

Backed by Y-IC quality distribution and technical support

Key Advantages

Reliable long-term supply chain through Y-IC

Easy integration with clear documentation and support

Stable performance for demanding applications

Competitive pricing and flexible purchasing options

Fast response for technical inquiries and logistics

Support for compliance and testing documentation

Packaging

Type: Manufacturer package/case code 778 (compact form factor). Mechanical drawing and outline dimensions are specified by SEIP.

Material: Lead-free, RoHS-compliant construction where applicable. Body and leadframe materials defined per datasheet.

Size: Exact dimensions provided in the 6189-7065 mechanical outline. Contact us for detailed drawings.

Pin configuration: Pin count, pin pitch, and pinout are defined by the 6189-7065 datasheet and application notes.

Thermal characteristics: Thermal resistance (junction-to-ambient and junction-to-case) and recommended thermal design guidelines are defined per the 778 package specifications.

Electrical properties: Operating voltage, current ratings, timing parameters, and ESD robustness are specified in the official datasheet. Please use the datasheet values for design validation.

Shipping options: Tape and reel, cut tape, and tray options available depending on lot. Moisture Sensitivity Level and handling instructions per JEDEC guidelines.

Lifecycle

Status: Not indicated as nearing discontinuation based on currently available information. Y-IC will assist with last-time-buy planning if a change is announced.

Equivalents or alternatives: No exact drop-in equivalents are publicly confirmed at this time. Suitable alternatives depend on your required function, package, pinout, temperature range, and certifications.

Next steps: Share your target specs and we will propose vetted alternatives from SEIP or qualified brands. If you need immediate guidance, contact our sales team via the Y-IC website for model-by-model recommendations and cross references.

Key Application Areas

Automotive electronics and modules

Industrial control and automation

Embedded systems and controllers

Power management and signal conditioning

Communications and infotainment subassemblies

Rugged systems requiring compact, reliable components

Datasheet

Y-IC hosts the most authoritative datasheet for SEIP 6189-7065. We recommend downloading it from this page to get exact mechanical, electrical, and thermal specifications, along with pin configuration and handling guidelines.

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