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| Part Number: | LQG15HSR12J02D |
|---|---|
| Manufacturer/Brand: | Murata Electronics |
| Part of Description: | FIXED IND 120NH 200MA 1.3OHM SMD |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.01 |
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| Product Attribute | Attribute Value |
|---|---|
| Type | Multilayer |
| Tolerance | ±5% |
| Supplier Device Package | 0402 (1005 Metric) |
| Size / Dimension | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Shielding | Unshielded |
| Series | LQG15 |
| Ratings | - |
| Q @ Freq | 8 @ 100MHz |
| Package / Case | 0402 (1005 Metric) |
| Package | Tape & Reel (TR) |
| Operating Temperature | -55°C ~ 125°C |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Material - Core | Air |
| Inductance Frequency - Test | 100 MHz |
| Inductance | 120 nH |
| Height - Seated (Max) | 0.022" (0.55mm) |
| Frequency - Self Resonant | 600MHz |
| DC Resistance (DCR) | 1.3Ohm Max |
| Current Rating (Amps) | 200 mA |
| Current - Saturation (Isat) | - |
| Base Product Number | LQG15HS |




The Murata LQG15HSR12J02D is a fixed-value surface-mount chip inductor designed for high-density electronic circuits where size, performance, and reliability are critical. Belonging to Murata's recognized LQG15HS_02 series, the device features an inductance of 120 nH, maximum rated current of 200 mA, and maximum DC resistance of 1.30 Ω. With its ultra-compact 0402 (1005 metric) package, this inductor is ideally suited for modern applications requiring minimal footprint and low profile, without sacrificing essential passive performance parameters. It employs a multilayer unshielded construction, optimized for surface-mount reflow assembly in automated production lines.
The LQG15HSR12J02D inductor is intended for a wide range of electronic systems. Its reference specification explicitly supports use in power and consumer electronics, industrial control and automation equipment, and medical devices within certain regulatory classes (GHTF Class C, excluding implant/surgical/autoinjector applications; and Class A/B devices without critical human risk). Example engineering scenarios include: power filtering in renewable energy micro-inverters, RF matching networks in communication base stations, and noise suppression in consumer device signal lines or robotics controllers. The device is not recommended for use in applications directly related to human safety or mission-critical scenarios such as aerospace, aircraft, or disaster recovery systems, aligning with its specified reliability and design targets.
Engineers evaluating the LQG15HSR12J02D should closely examine its electrical performance. The inductor’s nominal inductance is 120 nH (nanohenry), suitable for radiofrequency (RF) and high-speed signal applications, with a maximum current rating of 200 mA safeguarding against overheating and ensuring stable inductance across dynamic loading. The device’s maximum DC resistance of 1.30 Ω allows for low quiescent circuit losses. Its multilayer ceramic construction ensures mechanical stability and repeatable electrical properties, while the absence of shielding provides a balance between component size and high-frequency characteristics ideal for densely packed PCBs.
The mechanical design of the LQG15HSR12J02D supports automated pick-and-place assembly, with an ultra-low typical unit mass of 0.001 g. A black direction identification marking assists in correct orientation during placement. The device is robust enough for standard glass-epoxy PCB attachment and withstands typical vibration and board flexing encountered in consumer and industrial environments when applied within specification.
The Murata LQG15HSR12J02D is specifically engineered for reflow soldering; it is not recommended for adhesive mounting without prior technical consultation. For robust soldering and longevity, Murata provides detailed guidance on land pattern dimensions, solder type and volumes, and thermal cycling considerations. Over-soldering can increase mechanical stress and risk electrical failure, so it is crucial to adhere to recommended thermoprofile limits—maintaining max preheat and cooling delta-T's of 150°C and 100°C respectively.
PCB layout strategies should minimize mechanical stress: position the component perpendicular to board warping, avoid critical areas like screw holes, and ensure careful separation line design to mitigate stress during depaneling. When assembling densely populated boards, ensure adequate heat-dissipation to prevent localized overheating, as neighboring components can raise the inductor's ambient operating temperature and affect long-term reliability. The LQG15HSR12J02D can be subjected to manual soldering for rework, but conditions must not exceed those used for reflow.
Murata identifies several application and engineering limitations relevant to safety and product reliability. The LQG15HSR12J02D should not be deployed in aerospace, transportation control, nuclear plant, or similar high-risk environments unless specifically requalified. Avoid exceeding rated temperature, current, or voltage to prevent failure modes such as wire breakage, overheating, or catastrophic electrical faults. Inrush currents significantly beyond rating can trigger thermal runaway and irreversible product damage.
When using cleaning agents after soldering, prioritize low-temperature processes and verify that no residuals remain, as these can degrade device reliability. If board-level resin encapsulation or conformal coatings are applied, engineers must evaluate for possible changes in electrical performance or mechanical stress-induced wire breakage, as some resins may cause corrosion or physical damage.
The LQG15HSR12J02D is delivered in compliant tape-and-reel packaging suitable for automated high-speed assembly. Attention is given to leader/trailer sections, traceability markings (including RoHS status), and robust packaging to support logistics and storage.
Operating environment limitations must be observed: avoid corrosive atmospheres (acid/alkali/chlorine/sulfur gases), conditions prone to dew formation, or direct liquid exposure. Improper handling, such as excessive board flex or use in high humidity or temperature cycling environments, may compromise both solder joints and inductor structure. Storage conditions should protect the device from these potential hazards, and stacking or transporting in ways that induce mechanical damage is prohibited.
When designing for continuity of supply or considering alternatives, engineers may evaluate other members of the Murata LQG15HS_02 series, ensuring equivalence in inductance, current capability, DC resistance, and package format. Equivalent models from the same manufacturer guarantee process compatibility, but cross-reference with other vendors—as long as parameters like 0402 size, multilayer construction, and ratings are met—can serve as viable replacements. Close attention should be paid to performance in critical circuits, especially RF sections or sensitive analog filtering applications, as even minor parameter variation can affect final system behavior.
The Murata LQG15HSR12J02D stands as a versatile, miniaturized surface-mount inductor positioned for use in advanced consumer, industrial, and certain medical electronics. Its mix of small form factor, reliable multilayer construction, and robust operational guidance make it a strong choice for engineers prioritizing performance in compact, high-density circuit designs. Careful adherence to Murata's application, assembly, and environmental recommendations is crucial for maximizing in-service reliability and ensuring compliance with end-product requirements. When selecting or substituting this device, a thorough understanding of core specifications and use limitations will support both technical success and long-term logistical continuity.
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