Microsemi Corporation EX64-TQG100I

Mfr. Part

EX64-TQG100I

Manufacturer

Microsemi

Y-IC is a quality distributor for Microsemi. We provide genuine parts, fast delivery, and professional technical support to ensure you get the best products and services.

Detailed Description

Product type: Integrated Circuits (ICs)

Subcategory: Embedded – FPGAs (Field Programmable Gate Array)

Series: EX

Base product number: EX64

Function: FPGA with moderate logic capacity for glue logic, protocol bridging, and control tasks

I/O count: 56 user I/O

Logic elements/cells: 128

Approx. gate count: 3000

Package/case: 100-TQFP (14 x 14 mm) low-profile LQFP/TQFP form factor

Supplier device package: 100-TQFP (14 x 14 mm)

Mounting type: Surface mount

Operating temperature: -40°C to +85°C (industrial grade, TA)

Supply voltage: 2.3 V to 2.7 V

Description shorthand: IC FPGA 56 I/O 100TQFP

Pack type: Tray

Available quantity: 2536 units

Key Features

56 configurable I/O for flexible interfacing

128 logic elements/cells enabling compact designs

Approx. 3000 gates for moderate complexity applications

Industrial temperature range (-40°C to +85°C)

Low-voltage operation (2.3 V to 2.7 V)

100-pin TQFP/LQFP package with a 14 x 14 mm body for space-saving layouts

Surface-mount footprint for automated assembly

Part of Microsemi EX series for consistent tooling and ecosystem

Key Advantages

Balanced resources for control, timing, and interface logic without overdesign

Industrial-grade reliability for harsh environments

Small footprint helps reduce PCB size and cost

Low supply voltage supports lower power profiles

Tray packaging supports high-volume SMT manufacturing

Backed by Microsemi quality and Y-IC distribution assurance

Packaging

Type: 100-pin TQFP (also referenced as LQFP), low-profile plastic package

Body size: 14 x 14 mm nominal

Material: Epoxy molding compound over copper alloy leadframe (typical for TQFP)

Lead style: Gull-wing leads for surface mount

Pin configuration: 100 pins total, with 56 user I/O; remaining pins include power, ground, configuration, and dedicated functions

Lead pitch: Fine-pitch gull-wing (refer to datasheet for exact pitch and dimensions)

Orientation: Standard pin 1 marker for assembly alignment

Thermal characteristics: Industrial temperature rated; heat dissipated through PCB copper; use solid ground plane and thermal vias for best results; consult datasheet for thermal resistance values

Electrical properties: Supply 2.3 V to 2.7 V; I/O standards and bank voltages depend on device configuration; observe ESD handling precautions

Environmental: “TQG” often denotes RoHS-compliant (Green) lead finish; verify exact compliance in datasheet and orderable part data

Shipment format: Tray

Lifecycle

Status understanding: EX series devices are mature and may be considered legacy in some portfolios; availability can vary by region and date code

Nearing discontinuation: Check current PCNs and LTB notices; supply status can change. Y-IC can confirm the latest lifecycle information upon request.

Direct drop‑in equivalents: None officially confirmed in this response beyond same part in different temp/finish variants. For exact pin‑compatible alternatives, please verify via the datasheet and our sales team.

Potential alternatives to consider (verify compatibility carefully):

- Same device, different environmental grades or finishes (e.g., commercial temperature variants of EX64 in 100‑TQFP/LQFP, or “Green” plating options if available)

- Higher capacity within the EX family (e.g., EX128 in similar package for more logic; pin mapping may differ)

- Other Microsemi families (e.g., IGLOO/ProASIC for flash‑based FPGAs) as functional alternatives; these are not pin‑compatible and require redesign

If you need a confirmed cross-reference or drop-in replacement, contact our sales team via the Y-IC website for a curated list and availability updates.

Key Application Areas

Industrial control and automation (state machines, sequencing, safety interlocks)

Protocol bridging and glue logic between MCUs, sensors, and interfaces

Motor control support logic and timing control

Sensor aggregation and signal conditioning (digital side)

Communications interface adaptation (SPI, I2C, UART, simple bus bridging)

Test and measurement equipment (triggering, capture logic)

Power management coordination and supervisory logic

Consumer and embedded devices needing compact configurable logic

Datasheet

Y-IC hosts the most authoritative datasheet for EX64-TQG100I on our product page. We recommend downloading it now to get exact pinouts, dimensions, timing, electrical limits, and configuration details.

Request for Quotation Now

Get a Quote on Y-IC today for EX64-TQG100I

Learn More and download the datasheet on the product page

Limited Time Offer: Secure current stock while quantities last. Visit Y-IC now to request pricing and delivery.