Microsemi Corporation A3P600L-1FG256I

Mfr. Part

A3P600L-1FG256I

Manufacturer

Microsemi (ProASIC3L series). Y-IC is a quality distributor for Microsemi. We provide genuine parts, fast delivery, and expert support to ensure you get the best products and services.

Detailed Description

Flash-based low-power FPGA, ProASIC3L family. 600k system gates, 177 user I/O, 110,592 total RAM bits. Package is 256-ball FBGA/LBGA, 17 x 17 mm. Core supply 1.14 V to 1.575 V. Industrial-grade operation with junction temperature -40°C to +100°C. Mounting type is surface-mount. RoHS status: non-compliant. Base product number A3P600L. Supplied in tray. Quantity available: 2663 units. Main category: Integrated Circuits (ICs). Sub-class: Embedded FPGAs (Field Programmable Gate Array).

Key Features

Non-volatile flash-based FPGA fabric (no external configuration memory; instant-on behavior)

ProASIC3L low-power architecture for reduced dynamic and static power

600,000 system gates for mid-density logic designs

177 user I/O pins for broad interfacing capability

110,592 bits of embedded SRAM for FIFOs, buffers, and scratch memory

Single-core supply 1.14 V to 1.575 V; multiple I/O standards supported (typical LVCMOS/LVTTL and others per bank)

Industrial-grade temperature operation (TJ -40°C to +100°C)

JTAG in-system programming; secure flash-based configuration storage

Robust against soft errors in configuration (flash fabric is immune to SEU in configuration)

Global clock networks, PLL support, and rich routing resources for timing closure

Compatible with Microsemi/Microchip development tools and IP cores

Key Advantages

Instant-on, single-chip solution eliminates external boot device and shortens start-up time

Flash configuration improves reliability versus SRAM-based FPGAs

Low power makes it suitable for battery-powered and thermally constrained systems

Secure, tamper-resistant configuration storage reduces risk of bitstream theft

Broad I/O and memory resources simplify integration of control, glue logic, and interfacing

Industrial temperature range and BGA packaging fit rugged applications

Mature ecosystem and long field history improve design confidence

Simple power architecture reduces BOM and board complexity

Packaging

Type: 256-ball FBGA/LBGA, fine-pitch ball grid array

Material: Molded plastic package with organic substrate; solder ball interconnects

Size: 17 mm x 17 mm body outline (Supplier Device Package: 256-FPBGA 17x17)

Pin configuration: 256-ball full array; 177 balls are user I/O; remaining balls are power, ground, clocks, configuration, and test

Thermal characteristics: Junction temperature range -40°C to +100°C; thermal performance depends on board design, airflow, and layer stack. Use thermal vias under the package and solid ground planes to improve heat spread. Consult datasheet for thermal resistance guidance.

Electrical properties: Core VCC 1.14 V to 1.575 V; I/O banks support common LVCMOS/LVTTL levels (bank-dependent). ESD protection integrated on I/O. Refer to datasheet for drive strength, I/O standards, and timing.

Mounting: Surface mount; reflow soldering per JEDEC guidelines. Supplied in tray for assembly.

Lifecycle

Status: Mature, widely deployed. Not flagged as last-time-buy in commonly available sources at the time of writing.

RoHS: This specific code is RoHS non-compliant. If you require lead-free/RoHS options, contact Y-IC for available compliant variants in the same family.

Equivalent/alternative models (same family and similar density):

- A3P600L with other speed grades (e.g., -2, -3) for different timing performance

- A3P600 (non-L) for standard power variant

- Other packages within the same density (e.g., 208-pin QFP or higher ball-count BGAs), availability varies

Cross-family alternatives (flash-based, similar logic range), depending on feature and power needs:

- IGLOO AGL600 series (low-power, flash FPGA)

- ProASIC3 A3P400L or A3P1000L (lower/higher density options in the same technology)

- SmartFusion/SmartFusion2 families if you need FPGA plus ARM MCU and advanced security

If you need a precise drop-in or RoHS-compliant match, or guidance on migration, please contact our sales team via the Y-IC website for detailed cross-reference and availability. We will provide a tailored list and technical comparison.

Key Application Areas

Industrial control and automation (motor control, PLC interfacing, deterministic I/O)

Power electronics and energy systems (bridge logic, protection and monitoring)

Communications and networking (protocol bridging, MAC/PHY glue, timing)

Aerospace and defense (control logic, secure configuration, SEU-resistant configuration)

Medical and instrumentation (sensor interfacing, data acquisition, timing control)

Automotive and transportation (embedded control, diagnostics, robust I/O)

Consumer and IoT devices needing instant-on, low-power programmable logic

Security and safety systems (tamper-resistant configuration, fast start-up)

Datasheet

Y-IC provides the most authoritative datasheet for A3P600L-1FG256I on our product page. We recommend downloading the datasheet now to get exact specifications, pinouts, timing, I/O standards, and thermal guidelines.

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