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| Part Number: | USB2601-NU-05 |
|---|---|
| Manufacturer/Brand: | Micrel / Microchip Technology |
| Part of Description: | IC INTERFACE SPECIALIZED 128TQFP |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 3.3V |
| Supplier Device Package | 128-TQFP (14x14) |
| Series | - |
| Package / Case | 128-TQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Interface | - |
| Base Product Number | USB2601 |
| Applications | Controller |




USB2601-NU-05
Micrel / Microchip Technology
Y-IC is a quality distributor of Micrel / Microchip Technology. We supply genuine parts and deliver the best products and services to every customer.
Specialized interface IC in the USB2601 family for USB controller applications. Operates at 3.3 V, housed in a 128-pin TQFP 14 x 14 mm package for surface-mount assembly. RoHS3 compliant. Packaged in trays for production use.
Base product number USB2601 family
Interface specialized IC for USB controller use
Single 3.3 V supply
128-pin TQFP body size 14 x 14 mm
Surface mount for standard SMT reflow
RoHS3 compliant
Supplier device package 128-TQFP 14 x 14
Factory packaging tray
High pin count for flexible I O mapping and external connections
Compact 14 x 14 mm footprint saves board space
Easy SMT assembly with widely supported TQFP package
Stable 3.3 V operation simplifies power design
Backed by Microchip ecosystem and support
Reliable sourcing through Y-IC with fast response and professional service
Type thin quad flat package TQFP
Material typical TQFP construction uses molded epoxy over a copper leadframe with matte tin plated leads refer to the datasheet for exact materials
Size 14 mm x 14 mm body nominal low profile height typical for TQFP
Pin configuration 128 fine pitch gull wing leads arranged on four sides see the datasheet pinout for exact mapping
Thermal characteristics low profile package dissipates heat through leads and PCB copper planes use solid ground copper and thermal vias follow the datasheet for thermal limits and reflow profile
Electrical properties operating supply 3.3 V digital logic interfaces consult the datasheet for absolute maximum ratings power consumption timing and I O protection details
Current status not flagged as nearing discontinuation on our listing
Availability may vary by region and demand
Equivalent or alternative models depend on required USB features port count and system constraints If you need pin compatible or functional alternatives please contact our sales team via the Y-IC website for a tailored list and cross recommendations
USB controller and USB interface functions in embedded systems
Consumer electronics and PC peripherals
Industrial controllers and instrumentation needing USB connectivity
Hubs and bridges within USB based designs
Networking equipment printers set top boxes and similar products
Y-IC provides the most authoritative datasheet for this product on our website We recommend downloading the datasheet directly from this page to get complete specifications pinout timing and design guidelines
Stock available now Quantity 2506
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USB2601-NU-05Microchip Technology |
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