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| Part Number: | U1AFS250-FG256 |
|---|---|
| Manufacturer/Brand: | Micrel / Microchip Technology |
| Part of Description: | IC FPGA 114 I/O 256FBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $140.5099 |
| 200+ | $54.3759 |
| 500+ | $52.4655 |
| 1000+ | $51.5203 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 36864 |
| Supplier Device Package | 256-FPBGA (17x17) |
| Series | Fusion® |
| Package / Case | 256-LBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of I/O | 114 |
| Number of Gates | 250000 |
| Mounting Type | Surface Mount |
| Base Product Number | U1AFS250 |




U1AFS250-FG256
Micrel / Microchip Technology
Y-IC is a quality distributor of Microchip brands. We deliver genuine parts, fast service, and expert support.
Flash-based Fusion FPGA
250,000 system gates
114 user I/O
256-ball Fine-Pitch BGA body 17 mm x 17 mm
Core supply 1.425 V to 1.575 V
Total embedded RAM 36,864 bits
Commercial temperature 0 to 85 C (junction)
Surface-mount
RoHS non-compliant
Base product number U1AFS250
Series Fusion
Tray packaging
Nonvolatile flash FPGA instant-on startup
No external configuration memory required
114 I/O in a compact 256-ball package
250k system gates for medium-density designs
36,864 bits of on-chip RAM
Core voltage 1.425 V to 1.575 V
Commercial-grade 0 to 85 C TJ
Supplier device package 256-FPBGA 17 x 17 mm
Deterministic, fast power-up behavior
High reliability and strong SEU immunity compared to SRAM FPGAs
Low standby power for always-on systems
Secure, tamper-resistant configuration storage
Space-saving BGA footprint with ample I/O
Simplifies BOM and design by removing external config flash
Type 256-ball Fine-Pitch BGA FPBGA also referenced as LBGA by some sources
Body size 17 mm x 17 mm
Ball array 256 total with 114 user I/O balls remainder for power, ground, and dedicated signals
Material typical organic BGA substrate with solder balls note RoHS non-compliant variant may use leaded balls
Mounting surface-mount suitable for standard reflow
Thermal characteristics commercial-grade junction temperature 0 to 85 C BGA helps spread heat through PCB use ground planes and thermal vias for best results
Electrical properties core supply 1.425 to 1.575 V 250k system gates 36,864 RAM bits 114 I/O consult the datasheet for full I/O bank voltages, timing, and constraints
Status mature family non-RoHS variants can have limited availability in some regions
Not confirmed as imminently discontinued check with our sales team for the latest status
Alternatives and near equivalents functional, not pin-compatible
- Microchip SmartFusion2 M2S050 M2S090 M2S150
- Microchip IGLOO2 M2GL060 M2GL090
- Microchip PolarFire MPF200T MPF300T
- AMD Xilinx Artix-7 XC7A100T XC7A200T
- Intel Cyclone V 5CEFA2 5CEFA5
- Lattice ECP5 LFE5U-45 LFE5U-85 with BG256 options
If you need a drop-in or form-fit-function replacement contact our sales team via the Y-IC website for tailored guidance
Industrial control and factory automation
Power management and system supervision with instant-on control
Motor control and drive sequencing
Medical instrumentation and test equipment
Aerospace and defense systems needing reliable nonvolatile startup
Embedded glue logic, protocol bridging, and I/O expansion
Our website hosts the most authoritative datasheet for U1AFS250-FG256 Download it now on this page for complete specs, pinout, timing, and design guidelines
In stock quantity 2691 Act now Get a Quote on our website today Learn More and secure your allocation Limited Time Offer
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U1AFS250-FG256Microchip Technology |
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