Microchip Technology M2S050TS-VF400

Mfr. Part

M2S050TS-VF400

Manufacturer

Micrel / Microchip Technology

Y-IC is a quality distributor for Micrel / Microchip Technology. We focus on genuine parts, stable supply, and responsive service to deliver the best products and support to you.

Detailed Description

SmartFusion2 SoC with ARM Cortex-M3 CPU and embedded FPGA fabric

CPU speed 166 MHz

FPGA fabric about 50K logic modules

Flash 256 KB and SRAM 64 KB

Rich high-speed peripherals DDR, PCIe, SERDES

Connectivity CANbus, Ethernet, I2C, SPI, UART or USART, USB

Number of user I/O 207

Commercial temperature grade TJ 0 to 85°C

RoHS non-compliant variant

Base product number M2S050

Series SmartFusion2

Architecture MCU plus FPGA

Package case 400-ball VFBGA 17 x 17 mm and 400-ball LFBGA options

Supplier device package 400-VFBGA 17 x 17 mm

Packing method Tray

Available quantity 2512

Key Features

ARM Cortex-M3 core running at up to 166 MHz for real-time control

Embedded FPGA fabric around 50K logic modules for hardware acceleration and custom logic

Integrated high-speed interfaces DDR, PCIe, SERDES

Built-in connectivity CANbus, Ethernet, I2C, SPI, UART or USART, USB

256 KB embedded Flash and 64 KB SRAM for fast local storage

207 user I/O pins to connect sensors, actuators, and external devices

400-ball BGA footprint for high pin count and compact layout

SmartFusion2 series ecosystem and toolchain support

Key Advantages

Combines MCU and FPGA in one device for flexible hardware and software partitioning

Reduces board space, BOM count, and interconnect complexity versus separate MCU and FPGA

Enables deterministic control with hardware offload for time-critical tasks

Scales within SmartFusion2 family to match logic density and I/O needs

Broad protocol support simplifies system integration

Proven Microchip platform with wide industry adoption

Packaging

Type BGA package with 400 balls, available in VFBGA and LFBGA variants

Material Molded plastic BGA with solder balls

Size 17 mm x 17 mm body for the VF400 package

Pin configuration 400-ball grid, 207 user I/O pins, remaining balls are power, ground, and system signals

Thermal characteristics Commercial TJ range 0 to 85°C, BGA form factor aids thermal distribution when properly designed

Electrical properties CPU 166 MHz, FPGA fabric approximately 50K logic modules, embedded Flash 256 KB, SRAM 64 KB, high-speed interfaces DDR, PCIe, SERDES, connectivity CAN, Ethernet, I2C, SPI, UART or USART, USB

Packing method Tray for safe handling and automated assembly

Lifecycle

Status Active production based on current information and widely used in industry

Not indicated as nearing discontinuation

RoHS status This specific variant is RoHS non-compliant. RoHS-compliant versions may exist in the same family depending on ball alloy and package option

Equivalent or alternative models within SmartFusion2

- M2S025 family members lower logic density for cost and power savings

- M2S090 family members higher logic density for more complex designs

- M2S150 family members highest density in the family for maximum FPGA resources

- Other package options of M2S050 such as 400-LFBGA variants for layout flexibility

- Speed and temperature grades vary by suffix. Contact our sales team to confirm exact options and pin compatibility

Cross-family alternatives for similar SoC plus FPGA capability

- Microchip PolarFire SoC family MPFS series for higher performance and RISC-V CPU cores

- Xilinx Zynq-7000 family XC7Z010 and XC7Z020 for ARM Cortex-A9 plus programmable logic

- Intel Cyclone V SoC family for ARM-based SoC with FPGA fabric

- Note Cross-family alternatives are not pin compatible. Compare specs, power, and tools before selection

If you need a one-to-one drop-in or a detailed list of exact equivalent part numbers and package footprints, please contact our sales team via the Y-IC website for the latest, verified options

Key Application Areas

Industrial control and automation

Motor control and drives

Smart grid and power management

Communications and networking equipment

Embedded vision and hardware acceleration

Test and measurement instruments

Medical electronics where real-time control is essential

Secure gateways and protocol bridging

Robotics and unmanned systems

Datasheet

Y-IC hosts the most authoritative datasheet and documentation for M2S050TS-VF400 on our product page. We recommend downloading the datasheet from our website for full electrical and mechanical specifications, timing, and design guidelines.

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