Microchip Technology M2GL090T-FG676

Mfr. Part

M2GL090T-FG676

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 family flash-based FPGA. 86316 logic elements. 425 user I/O. 2,648,064 total RAM bits. 676-ball fine-pitch BGA package, 27 mm x 27 mm body. Commercial junction temperature 0°C to 85°C. Surface-mount. Multi-rail supply 1.14 V to 2.625 V. Series IGLOO2. Base product number M2GL090. RoHS non-compliant. Available quantity 2649 units. Category Integrated Circuits (ICs). Subcategory Embedded – FPGAs (Field Programmable Gate Array).

Key Features

Flash-based, nonvolatile FPGA for instant-on behavior

86316 logic elements for mid-density designs

425 I/O for rich peripheral connectivity

2.65 Mbits of embedded RAM for buffering and data handling

Wide supply range 1.14 V to 2.625 V for different rails and I/O banks

676-ball FBGA, 27 mm x 27 mm, for high pin-count in a compact footprint

Commercial temp grade 0°C to 85°C (TJ)

Surface-mount BGA for automated assembly

IGLOO2 family architecture focused on low power and reliability

Key Advantages

Nonvolatile, instant-on operation simplifies power-up sequencing

Lower static power than SRAM-based FPGAs

Robust security and reliability features common to IGLOO2 family

High I/O count enables complex interfaces and bridging

Mature ecosystem and long-term support from Microchip Technology

Y-IC provides fast delivery, genuine parts, and professional technical support

Packaging

Type: FBGA (Fine-Pitch Ball Grid Array)

Body size: 27 mm x 27 mm

Ball count: 676

Mounting: Surface-mount BGA

Supplier device package: 676-FBGA (27x27)

Case references: 676-FBGA (27x27), 676-BGA

Material: Organic substrate with solder ball interconnects

Tray packaging for shipment and handling

Pin configuration: 676-ball grid with banked I/O; up to 425 user I/O available

Thermal characteristics: Junction temperature range 0°C to 85°C; actual thermal resistance depends on board design, airflow, and heatsinking. Follow datasheet guidelines for power and thermal design.

Electrical properties: Multi-rail supply operation across 1.14 V to 2.625 V range; supports common FPGA I/O standards (bank-dependent). Refer to datasheet for exact rail assignments, I/O standards, and timing.

Lifecycle

Current status: Active in the IGLOO2 family based on publicly available information. No official end-of-life notice identified for this model at the time of writing.

RoHS status: Non-compliant. If you need a lead-free or RoHS-compliant variant, contact us for options.

Equivalent or alternative models: Availability and compatibility depend on package, pinout, temperature grade, and resource requirements. Close family alternatives typically include other IGLOO2 densities in similar packages (for example, M2GL060 and M2GL150 family variants). Pin-compatibility and feature parity vary. For a precise cross-reference and drop-in or near-drop-in replacements, please contact our sales team via the Y-IC website for a curated, detailed list tailored to your design.

Key Application Areas

Industrial control and automation

Communications and networking equipment

Motor control, drives, and power conversion

Interface bridging and protocol conversion

Embedded systems needing instant-on logic

Secure, reliable logic for aerospace and defense (application suitability depends on exact variant and qualifications)

Test and measurement, data acquisition, and high-I/O designs

Datasheet

Y-IC hosts the most authoritative datasheet for this product model on our website. We recommend downloading the datasheet from the current page to get complete electrical, timing, pinout, and thermal guidelines.

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