Microchip Technology M2GL090T-1FGG484

Mfr. Part

RoHS status ROHS3 compliant

Manufacturer

Microchip Technology

Micrel is part of Microchip Technology, and the IGLOO2 family is maintained by Microchip

Y-IC is a quality distributor of Microchip Technology. We stand behind the brand and will provide you with the best products, fast delivery, and professional service

Detailed Description

Flash-based FPGA for low power, instant-on, and secure operation

86316 logic elements or cells for flexible custom logic

2648064 total RAM bits for buffering and data handling

267 user I O pins in a 484-FPBGA package, 23 mm x 23 mm body size

Surface-mount BGA package for high-density designs

Operating junction temperature 0 to 85°C for commercial and industrial environments that do not require extended temperature

Supply voltage range 1.14 V to 2.625 V across supported rails

Tray packaging for safe shipping and assembly line handling

Part of the IGLOO2 family known for non-volatile configuration, deterministic startup, and strong reliability

Key Features

Flash-based non-volatile FPGA fabric no external configuration memory required

Instant-on behavior fast, deterministic startup after power is applied

Low power architecture optimized for control-plane and always-on tasks

86316 logic elements and 2.65 Mb of on-chip RAM for flexible designs

267 I O in a fine-pitch 484-ball BGA, enabling high pin count in compact area

Multiple clock resources and PLLs for robust timing and clock conditioning

Security-focused features for bitstream protection and design integrity

Broad I O standard support typical IGLOO2 banks support LVCMOS, LVTTL, LVDS and more

RoHS3 lead-free compliance for global environmental standards

Mature tool support through Microchip Libero SoC design suite

Key Advantages

True single-chip solution reduces BOM by removing external configuration memory

Instant-on startup simplifies system design and improves reliability

Lower static and dynamic power versus SRAM-based FPGAs in many use cases

Stable configuration across power cycles improves determinism and uptime

Long-term availability and lifecycle support from Microchip for industrial and defense customers

High pin count in compact BGA saves board space while maximizing connectivity

Wide supply range supports flexible power architectures

Proven ecosystem tools and IP lower design risk and speed time to market

Packaging

Type 484-FPBGA fine-pitch ball grid array also listed as 484-BGA

Body size 23 mm x 23 mm compact square footprint

Ball count 484 total balls with 267 user I O pins the remainder are power, ground, configuration, and dedicated pins

Mounting Surface mount suitable for automated reflow assembly

Material Lead-free plastic BGA construction with epoxy mold compound and organic substrate compliant with RoHS3

Pin configuration Uniform grid array optimized for signal integrity and power distribution consult the datasheet ball map for exact assignments

Thermal characteristics Junction temperature 0 to 85°C adequate PCB copper, vias, and airflow recommended for heat spreading and reliability

Electrical properties Supply voltage range 1.14 V to 2.625 V supports common FPGA rails and I O standards typical IGLOO2 banks support single-ended and differential standards with on-chip termination options where applicable

Lifecycle

Status Active and in production as of today not nearing discontinuation

Microchip maintains long-lifecycle support for IGLOO2 in industrial, communications, and defense markets

Equivalent or alternative models within the same family and package class

M2GL090T-2FGG484 same density with different speed grade

M2GL090 low-power and speed-grade variants in other packages for different board constraints for example FCS325

SmartFusion2 option M2S090T-1FGG484 adds an ARM Cortex-M3 microcontroller and is often pin-compatible in FGG484 for embedded control applications

Other IGLOO2 densities M2GL010, M2GL025, M2GL050, M2GL150 provide lower or higher logic resources and I O counts for right-sizing your design

Note Pin-for-pin compatibility and timing may vary by variant and package. If you need an exact equivalent or a drop-in replacement, contact our sales team via the Y-IC website for detailed guidance

Key Application Areas

Industrial control and automation control-plane logic, safety interlocks, protocol bridging

Communications and networking timing, packet handling, Ethernet MAC interfacing, SerDes-less control fabrics

Embedded systems requiring instant-on configuration power sequencing, reset controllers, system management

Test and measurement deterministic triggering, GPIO expansion, custom bus bridging

Power and energy systems smart inverters, protection, power-line communication control logic

Security-conscious designs bitstream protection, secure startup, tamper-resistance features

General-purpose FPGA tasks glue logic, parallel processing, data buffering, and sensor aggregation

Datasheet

Y-IC hosts the most authoritative datasheet for this product model on our website

We recommend downloading the datasheet on this page to get the latest ball maps, electrical limits, timing, and design guidelines

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