Microchip Technology M2GL060-FCS325

Mfr. Part

M2GL060-FCS325

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 flash-based FPGA with 56,520 logic elements, 1,869,824 total RAM bits, 200 user I/O, and 325-ball flip‑chip BGA package (11 x 11 mm). Main Category Integrated Circuits (ICs). Small Classification Embedded FPGAs (Field Programmable Gate Array). Base Product Number M2GL060. Surface-mount device. RoHS non-compliant. Series IGLOO2. Typical supply rails supported 1.14 V to 2.625 V. Commercial temperature range 0°C to 85°C (TJ). Package type Tray. Current stock quantity 2581 units.

Key Features

Nonvolatile flash-based FPGA for instant-on behavior

56,520 logic elements for mid-range designs

1,869,824 bits of embedded RAM for buffering and data processing

200 user I/O for flexible interfacing

Wide operating supply range 1.14 V to 2.625 V (multiple rails supported)

Commercial junction temperature 0°C to 85°C

325-ball FCBGA, 11 x 11 mm footprint, surface-mount

IGLOO2 architecture optimized for low power and reliability

Supports common single-ended and differential I/O standards (e.g., LVCMOS, LVDS)

Built-in clocking and PLL resources for timing control

Key Advantages

Instant-on nonvolatile technology eliminates external configuration memory and speeds system startup

Low power operation reduces heat and power budget

Robust, radiation-tolerant flash fabric offers strong SEU immunity compared to SRAM FPGAs

High I/O count in a compact BGA enables dense interconnect in space-limited designs

Mature IGLOO2 ecosystem with proven reliability and long-term availability

Simplifies system design and BOM by integrating memory and clock resources

Packaging

Type 325-FCBGA flip-chip ball grid array

Material organic BGA substrate with solder balls and molded encapsulation

Size 11 mm x 11 mm body outline

Pin configuration 325 balls total with 200 user I/O; remaining balls for power, ground, configuration, and dedicated functions; detailed ball map in the datasheet

Mounting surface-mount, reflow solder compatible

Thermal characteristics junction temperature 0°C to 85°C; follow datasheet thermal guidance for airflow and PCB layout

Electrical properties supply rails supported from 1.14 V to 2.625 V; I/O standards include common single-ended and differential types; actual current draw depends on design utilization

Compliance RoHS non-compliant

Shipping Tray packaging for safe handling and assembly

Lifecycle

Status Active and recommended for new designs based on current market information

Not nearing discontinuation to the best of our knowledge

Equivalent or alternative models Within the IGLOO2 family, close alternatives include:

- Same density in different packages M2GL060 in 484-ball FBGA and other BGA footprints

- Different densities M2GL010, M2GL025, M2GL090, M2GL150 for lower or higher logic capacity

- Speed and temperature variants of M2GL060 for performance or environmental needs

Pin-compatibility and exact replacement suitability can vary by package and speed grade. Contact Y-IC via our website for detailed cross-reference, availability, and best-fit recommendations.

Key Application Areas

Industrial control and automation, PLC/IO modules, motor control

Communications and networking equipment, protocol bridging, SERDES interfacing

Instrumentation, data acquisition, and embedded processing

Automotive non-safety systems, infotainment, and gateway modules

Security and access control, instant-on systems, tamper-resistant designs

Smart grid, power management, and energy monitoring

Medical electronics and portable devices where low power and instant-on matter

Aerospace and defense subsystems benefiting from nonvolatile FPGA fabrics

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading the M2GL060-FCS325 datasheet directly from this page on our website to get full specifications, ball maps, timing, electrical limits, and design guidelines.

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