Microchip Technology M2GL010TS-VFG400

Mfr. Part

M2GL010TS-VFG400

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 family flash-based FPGA, 10k logic elements (12,084 LE), 933,888 total RAM bits, 195 user I/O, 400-ball VFBGA package (17 x 17 mm). Supply voltage 1.14 V to 2.625 V. Surface-mount. Commercial junction temperature 0°C to 85°C. RoHS3 compliant. Base product number M2GL010. Supplied in trays. Quantity available: 2680 (subject to change).

Key Features

IGLOO2 series, non-volatile flash FPGA (instant-on, no external configuration memory)

12,084 logic elements/cells for mid-density designs

933,888 bits of embedded RAM for buffering and data storage

195 general-purpose I/O for flexible board-level connectivity

Wide supply range: 1.14 V to 2.625 V (supports common core and I/O standards)

400-ball VFBGA package, 17 x 17 mm footprint for high pin count in compact space

Commercial TJ range: 0°C to 85°C for standard ambient environments

RoHS3 compliant, lead-free manufacturing

Compatible with standard FPGA toolchains from Microchip (Libero SoC)

Base product: M2GL010, part of a scalable family for easy migration

Key Advantages

Instant-on and non-volatile architecture improves system reliability and simplifies power-up sequencing

Low static power and efficient flash-based fabric reduce total system power

High I/O count (195) supports broad interface needs without extra glue logic

Ample on-chip RAM reduces external memory dependencies and board complexity

Compact 17 x 17 mm BGA with 400 balls enables dense designs and short signal paths

Robust ecosystem and long-term support from Microchip for industrial longevity

RoHS3 compliance assists global regulatory acceptance

Packaging

Type: 400-ball VFBGA (Very Fine Pitch Ball Grid Array), also referenced as 400-LFBGA (Low-Profile Fine Pitch BGA)

Size: 17 mm x 17 mm body outline

Mounting: Surface-mount BGA, supplied in tray packaging

Ball/pin configuration: 20 x 20 grid (400 total), 195 user I/O available; power/ground/control balls distributed across the array

Materials: Molded plastic encapsulation with organic substrate; lead-free balls (RoHS3)

Thermal characteristics: Junction temperature 0°C to 85°C (commercial); use standard JEDEC reflow; follow Microchip thermal guidance for board design and heat dissipation

Electrical properties: Supply voltage range 1.14 V to 2.625 V; typical support for common I/O standards (e.g., LVCMOS/LVTTL/LVDS); consult datasheet for exact bank voltages and standards

Lifecycle

Current status: Active product, not nearing discontinuation based on the IGLOO2 family’s ongoing support

Equivalent/alternative models: Same M2GL010 density available in other packages and options for footprint or environment changes

- M2GL010 in VFG256 (256-ball VFBGA) for smaller footprint designs

- M2GL010 in FCS325 (325-ball fine-pitch BGA) for intermediate pin count

- M2GL010 in LFBGA/VFG400 variants with different height profiles and ball mappings

- Speed grades and temperature options may vary (commercial and industrial variants)

Note: Exact cross and pin compatibility depend on package ball-out, speed grade, and temperature range. For a perfect drop-in or best-fit substitute, please contact our sales team via the Y-IC website for detailed guidance.

Key Application Areas

Industrial control, motor drives, factory automation, PLC expansion

Smart energy, metering, power systems, and protection

Communications interfaces, bridging, protocol conversion

Embedded vision and image processing (moderate bandwidth)

IoT gateways, edge compute control, and sensor aggregation

Security-sensitive designs leveraging non-volatile, instant-on behavior

Medical electronics (non-life support), test and measurement instruments

Datasheet

Y-IC hosts the most authoritative datasheet for M2GL010TS-VFG400 on our product page. We recommend downloading it now to get full electrical specifications, bank voltages, timing, ball maps, and design guidelines.

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