Microchip Technology M1A3PE3000-FG484

Mfr. Part

M1A3PE3000-FG484

Manufacturer

Micrel / Microchip Technology

Y-IC is a quality distributor for Microchip brand products. We deliver original parts, fast service, and trusted support.

Detailed Description

Flash-based, nonvolatile FPGA from the ProASIC3E family. 3,000,000 system gates with 341 user I/Os in a 484-ball fine-pitch BGA. Core supply 1.425 V to 1.575 V. On-chip SRAM totals 516,096 bits. Commercial temperature grade, 0°C to 85°C junction. Surface-mount, tray packaging. Part is RoHS non-compliant.

Key Features

Nonvolatile flash FPGA, instant-on, no external configuration memory

3M system gates, 341 I/Os for large designs and wide interfacing

516,096 bits of embedded SRAM for buffers and FIFOs

ProASIC3E architecture with fine-grained logic cells and global routing

Multiple clock conditioning and PLL support for flexible clocking

Single low-voltage core supply, simple power architecture

JTAG programming and in-system programmability

Security features typical of flash FPGAs (device lock, secure programming)

Commercial temperature operation 0°C to 85°C (TJ)

484-FPBGA package, 23 x 23 mm body, high pin count

Surface-mount compatible with standard leaded reflow

Key Advantages

Instant-on startup shortens system boot time and removes external config memory risks

Flash configuration is immune to SRAM configuration upsets and is stable across power cycles

Low static power versus many SRAM FPGAs, good for always-on designs

Mature, widely used family with proven tools and IP ecosystem

High I/O count supports broad interface coverage and parallel buses

Simple single-chip solution reduces BOM and board area

Packaging

Type: 484-FPBGA, fine-pitch ball grid array, surface-mount

Body size: 23 mm x 23 mm nominal

Material: Molded plastic over organic substrate (standard FPBGA construction)

Ball count and layout: 484 balls in matrix array; user I/Os up to 341; dedicated power, ground, clock, and configuration balls per datasheet ball map

Ball alloy: Leaded formulation (RoHS non-compliant), suitable for SnPb assembly; contact us for lead-free options if needed

Typical ball pitch: Industry-standard fine pitch for 484-BGA; refer to datasheet for exact pitch and ball map

Thermal characteristics: Commercial grade operation 0°C to 85°C junction; actual θJA/θJC depend on PCB, airflow, and heatsinking; follow datasheet and JEDEC reflow profiles

Electrical properties: Core supply 1.425 V to 1.575 V; I/O banks support common standards such as LVCMOS/LVTTL and other single-ended/differential standards per bank voltage; detailed bank voltages and drive strengths in datasheet

Lifecycle

Status: ProASIC3E is a mature, long-running family. As of the latest public information, this device remains available for new and sustaining designs. Always confirm current status with our sales team.

Not nearing discontinuation to our knowledge; Microchip maintains long-term support for many flash FPGA families

Equivalent or alternative models:

- Same family, similar resources and package: M1A3PE3000 in FG484 with different temperature grades or speed options (for example, industrial-temperature variants). Check exact ordering codes and availability with us.

- Same family, different packages or I/O counts: Other M1A3PE3xxx devices within ProASIC3E offer different I/O/packaging; migration usually straightforward with family tools

- Newer-generation functional alternatives (not pin-compatible): IGLOO2 (M2GL series) and SmartFusion2 (M2S series) devices from Microchip provide enhanced SERDES, DSP, and security. Evaluate for new designs if you need newer features.

For a precise, up-to-date cross list and pin-compatibility guidance, please contact our sales team via the Y-IC website. We will recommend the best-fit drop-in or redesign path.

Key Application Areas

Industrial control and automation, motor control, PLC expansion

Communications and networking line cards, bridging, glue logic

Consumer and commercial electronics requiring fast startup

Security and safety systems where nonvolatile configuration is preferred

Aerospace and defense COTS designs needing instant-on and configuration robustness

Power management and sequencing controllers

Interface aggregation, protocol conversion, and high-I/O parallel designs

Datasheet

Y-IC provides the most authoritative datasheet and technical documents for M1A3PE3000-FG484 on our product page. We recommend you download the datasheet from this page to get exact specifications, ball maps, timing, I/O standards, and design guidelines.

Request for Quotation Now

Get a Quote today on Y-IC! Limited Time Offer on selected inventory. Fast response, competitive pricing, and verified original parts. Click Get a Quote or Learn More on our website to secure your supply and technical support now.