Microchip Technology M1A3P1000-2FGG144

Mfr. Part

M1A3P1000-2FGG144

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASIC3 flash-based FPGA

1,000,000 system gates and 97 user I O

147,456 total RAM bits

Commercial temperature range 0 to 85°C junction

Core supply 1.425 to 1.575 V

Package 144-FPBGA 13 x 13 mm and 144-LBGA footprint options

Surface-mount device

RoHS3 compliant

Supplier device package 144-FPBGA 13 x 13

Base product number M1A3P1000

Main category Integrated Circuits ICs

Small classification Embedded FPGAs Field Programmable Gate Array

Key Features

Flash-based nonvolatile FPGA fabric ProASIC3 series

Instant-on startup No external configuration memory required

1,000,000 system gates for mid-high density logic designs

147,456 RAM bits for distributed and block memory use

97 I O pins for flexible interfacing

Core voltage operation at 1.425 to 1.575 V

Commercial temperature 0 to 85°C TJ

144-ball fine pitch BGA 13 x 13 mm package

Surface-mount assembly compatible with standard SMT lines

RoHS3 compliance for lead-free manufacturing

Key Advantages

Nonvolatile technology enables fast boot and deterministic startup

No configuration ROM reduces BOM cost and board complexity

Lower static power compared to SRAM-based FPGAs in many use cases

Strong design security inherent to flash-based configuration storage

Mature ecosystem and long track record in industrial and embedded markets

Simple power architecture single core voltage range for core operation

Wide availability of development tools and IP within the ProASIC3 family

Packaging

Type 144-FPBGA fine pitch ball grid array

Size 13 x 13 mm body outline

Pin count 144 balls with 97 user I O available

Mounting Surface mount suitable for reflow soldering

Package options Listed as 144-FPBGA 13 x 13 and 144-LBGA footprint style

Shipping format Tray for secure handling during assembly

Thermal characteristics Junction temperature 0 to 85°C commercial operation

Compliance RoHS3 lead-free materials

Electrical properties Core supply 1.425 to 1.575 V, I O count 97, system gates 1,000,000, total RAM bits 147,456

Lifecycle

Status Mature and widely deployed in production designs. Not flagged as near discontinuation based on commonly available information. For the latest lifecycle status, contact Y-IC sales.

Equivalent or alternative models Within the ProASIC3 family, alternative densities and speed grades may fit similar roles. Examples include A3P060, A3P125, A3P250, A3P400, A3P600, A3P1000, A3P2000, and low-power variants in related families such as IGLOO and SmartFusion2 for designs needing integrated MCU or enhanced security. Speed grade variations and different packages may be available for A3P1000 devices.

Important note Pin compatibility, I O banking, and package ball maps vary by device and package. Verify mechanical and electrical compatibility in the datasheet. If you need pin-compatible or drop-in alternatives for 144-ball packages, contact our sales team on the Y-IC website to get a curated list for your design.

Key Application Areas

Industrial control and automation PLC, motor control, sensor fusion

Communications equipment baseband glue logic, protocol bridging, SERDES interfacing where applicable

Consumer and embedded systems custom peripherals, display and timing control

Test and measurement custom trigger logic, pattern generation, high-speed I O handling

Aerospace and defense nonvolatile instant-on logic where fast startup and reliability are important

IoT gateways and edge devices hardware acceleration, interface aggregation

Power systems and energy smart metering logic, inverter control, protection and monitoring

Datasheet

Y-IC hosts the most authoritative datasheet for M1A3P1000-2FGG144 on our product page. Download it now to get full electrical, timing, package ball map, and design guidelines. We recommend reviewing the datasheet before finalizing your design.

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