Microchip Technology APA1000-FG896I

Mfr. Part

APA1000-FG896I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASICPLUS APA1000 is a non-volatile, flash-based FPGA designed for instant-on operation and low power. This industrial-grade device provides 1,000,000 system gates, 642 user I/O, and 202,752 RAM bits in a high-density 896-ball FBGA package (31 x 31 mm). It runs from a single 2.3 V to 2.7 V supply, supports surface-mount assembly, and operates from -40°C to +85°C. Note: This specific variant is RoHS non-compliant, making it suitable for legacy designs that require leaded solder.

Key Features

1,000,000 system gates

642 user I/O pins

202,752 total RAM bits

Non-volatile flash-based FPGA (instant-on, no external configuration memory)

Supply voltage: 2.3 V to 2.7 V

Industrial temperature range: -40°C to +85°C (TA)

Package: 896-FBGA (31 x 31 mm), surface-mount

Series: ProASICPLUS

Base product number: APA1000

Device package: Tray

RoHS status: Non-compliant

Key Advantages

Instant-on startup (no configuration delay)

Non-volatile architecture simplifies BOM and boosts reliability

Single supply operation reduces power tree complexity

Low power compared to SRAM-based FPGAs

Robust in-system programmability via JTAG

Secure, configuration-locked design (flash cells retain logic without external memory)

Industrial temperature performance for demanding environments

Packaging

Type: FBGA (Fine-Pitch Ball Grid Array)

Material: Molded plastic over organic substrate; leaded solder balls (non-RoHS)

Size: 31 mm x 31 mm body (Supplier Device Package: 896-FBGA 31x31)

Pin configuration: 896 balls total; 642 user I/O balls; remaining balls for power, ground, clocks, and programming/JTAG

Mounting: Surface mount (SMT)

Thermal characteristics: Operates -40°C to +85°C (TA); thermal performance depends on PCB design and airflow; use standard BGA reflow profiles

Electrical properties: 2.3 V to 2.7 V supply; flash-based configuration; embedded RAM 202,752 bits; supports common I/O standards per datasheet

Lifecycle

Status: Mature/legacy device; non-RoHS variant suggests limited use in new designs. Availability can vary by region and date code.

Alternatives and equivalents (verify pinout, timing, voltages, and package before substitution):

- Microchip ProASIC3 family: A3P1000-FG896I (similar density, lower power, often RoHS-compliant)

- Microchip IGLOO family: AGL1000-FG896 options (low-power flash FPGA, RoHS-compliant; check package availability)

- Microchip SmartFusion2 family: M2Sxxx series (adds ARM Cortex-M3 and enhanced security; not drop-in)

- Other ProASICPLUS densities in FG896: APA750-FG896I, APA1500-FG896I (family-compatible; check I/O and ball map)

If you need form/fit/function guidance or current lifecycle status, please contact our sales team via the Y-IC website. We will help you confirm the best replacement path and availability.

Key Application Areas

Industrial control and automation (PLC, motor control, safety interlocks)

Communications and networking (bridge logic, protocol adaptation, SERDES-less interfacing where applicable)

Instrumentation and test equipment (custom timing, trigger logic, signal conditioning)

Medical devices (robust, instant-on control logic where non-volatility helps)

Aerospace/defense and transportation (deterministic startup, wide temp operation; confirm standards per project requirements)

Embedded systems glue logic, bus bridging, I/O expansion, secure configuration

Datasheet

Y-IC hosts the most authoritative datasheet for APA1000-FG896I on our product page. We strongly recommend downloading it now to review electrical specifications, ball maps, timing, I/O standards, and programming details.

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