Microchip Technology A3P060-VQ100I

Mfr. Part

A3P060-VQ100I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASIC3 flash-based FPGA for embedded logic applications. Density 60k gates, 71 user I/O, 18,432 RAM bits. Industrial temperature grade. 100-pin VQFP (14 x 14 mm) surface-mount package. Core supply 1.425–1.575 V. RoHS non-compliant. Single-chip, non-volatile architecture with instant-on and secure configuration. Series ProASIC3. Base product number A3P060. Main Category: Integrated Circuits (ICs). Small Classification: Embedded FPGAs

Key Features

Flash-based, non-volatile FPGA (no external configuration memory required)

Instant-on, live-at-power-up operation

60k system gates; 18,432 embedded RAM bits

71 user I/O in 100-pin VQFP package

Industrial temperature rating (-40°C to 100°C TJ)

Core supply 1.5 V nominal (1.425–1.575 V range)

JTAG programming and boundary scan support

Supported by Microchip Libero SoC design tools

Secure design storage using on-chip flash

Surface-mount package for standard SMT assembly

Key Advantages

No configuration delay at power-up for fast-start systems

Non-volatile configuration improves robustness in power-cycling environments

Lower power versus many SRAM-based FPGA options

Simple power architecture with a low-voltage core

Proven ProASIC3 platform with broad ecosystem and longevity

Easy prototyping and rework with familiar QFP form factor

Packaging

Type: 100-VQFP (Very Thin Quad Flat Package); also referenced as 100-TQFP; supplied in tray packaging

Material: Molded epoxy encapsulation with copper leadframe; matte-tin plated leads

Size: 14 x 14 mm body; low-profile QFP form factor for compact PCBs

Pin configuration: 100 leads on four sides; 71 pins available as user I/O; remaining pins for power, ground, JTAG, clocks, and configuration

Thermal characteristics: Junction temperature -40°C to 100°C (TJ). Heat primarily conducts through leads into the PCB; use copper pours and thermal vias for better dissipation

Electrical properties: Core supply 1.425–1.575 V; I/O banks support common LVCMOS/LVTTL standards per ProASIC3 guidelines; integrated ESD protection on I/O; RoHS non-compliant plating for this specific part

Supplier device package: 100-VQFP (14 x 14 mm)

Mounting: Surface Mount (SMT)

Lifecycle

Status: Mature and widely used. Not flagged for discontinuation at the time of writing, but lifecycle status can change; verify current availability

Equivalent or alternative models (examples):

- Same density, different package/temperature: A3P060-TQ144I, A3P060-VQ100T (commercial temp), A3P060-PQ208I

- Different densities in ProASIC3: A3P030, A3P125, A3P250 (choose package and temperature options to match your design)

- Low-power variants: ProASIC3L family parts with similar architecture and reduced power

- Related flash-based families: IGLOO AGL devices (low-power), SmartFusion (FPGA + ARM MCU) if integrated processing is required

If you need an exact drop-in alternative, RoHS-compliant options, or the latest lifecycle details, please contact our sales team via the Y-IC website for tailored guidance

Key Application Areas

Industrial control and automation (motor drives, PLC expansion, safety interlocks)

Interface bridging and glue logic between mixed protocols

Power sequencing and supervisory logic in complex systems

Embedded customization and hardware acceleration

Consumer and commercial electronics requiring instant-on logic

Medical and test instrumentation front-end control

Communications and networking subsystems (bridging, MAC/PHY interfacing, timing)

Aerospace and defense designs where configuration integrity and non-volatility are valued

Datasheet

Y-IC provides the most authoritative datasheet for A3P060-VQ100I on our product page. Visit the page and download the datasheet now for complete specifications, pinouts, timing, and design guidelines

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