MARVELL 88E111-BAB

Mfr. Part

88E111-BAB

Manufacturer

Martel Electronics

Y-IC is a quality distributor of Martel Electronics. We provide the best products, fast delivery, and dependable service.

Note: The description references “MARVELL BGA-117D.” If your design calls for a Marvell device, please verify the exact manufacturer with our sales team during RFQ to ensure a perfect match.

Detailed Description

Category: Integrated Circuits (ICs) > Specialized ICs

Product type: High-density specialized IC in a BGA-117D package (ball grid array with high I/O count)

Intended for embedded and communications hardware that needs many signals in a compact footprint

Optimized for space-limited designs that still require robust signal routing and reliable board-level assembly

Key Features

High I/O density BGA-117D package for complex designs

Compact footprint to save PCB area

Ball grid array layout for improved high-speed routing and signal integrity

Stable mechanical connection after reflow soldering for better long-term reliability

Suitable for automated SMT assembly processes

Typical ESD protection and power rails tailored to the device family (confirm specifics in the datasheet)

RoHS/lead-free options commonly available for modern BGA devices (confirm actual compliance on the datasheet and label)

Key Advantages

Space saving: 117-ball BGA packs more signals in less area than leaded packages

Performance oriented: BGA design supports cleaner high-speed traces and lower inductance

Assembly friendly: Works well with standard reflow SMT lines

Reliability: Strong solder joint array supports thermal cycling and vibration better than many leaded packages

Supply support: In-stock quantity listed as 2370 units (subject to prior sale); Y-IC can support production runs and scheduled deliveries

Service: Y-IC provides sourcing traceability, inspection, and technical coordination to reduce your risk

Packaging

Package type: BGA-117D (ball grid array, 117 balls)

Package/case code: 13347 (supplier reference code)

Construction material: Molded epoxy body with organic substrate (typical for BGA); lead-free SnAgCu solder balls are common for RoHS variants

Physical size: Exact body size, ball pitch, and ball map depend on the specific 88E111-BAB build; see the datasheet for mechanical drawings

Pin/ball configuration: 117-ball matrix; power, ground, high-speed I/O, and control balls arranged per the device ball map (refer to datasheet pinout/ballout)

Thermal characteristics: Junction-to-ambient and junction-to-case values depend on board stack-up, copper area, airflow, and mounting; see datasheet thermal data and apply your board conditions for accurate results

Electrical properties: Maximum ratings, I/O standards, ESD ratings, and per-ball current limits must be taken from the device datasheet; follow absolute maximum and recommended operating conditions

Shipping form: Typically supplied in trays for BGA packages; tape-and-reel may be available for certain revisions or on request. Moisture sensitivity (MSL) handling per labeling—follow bake and floor-life rules printed on the package label.

Lifecycle

Lifecycle status: Not confirmed nearing discontinuation based on the provided data

Because the description mentions “MARVELL BGA-117D” while the manufacturer field says “Martel Electronics,” please verify the exact target device during your RFQ

Equivalent or alternative models: Cross-references depend on the exact function (e.g., PHY, interface, controller). To avoid misselection, please contact our sales team via the Y-IC website with your electrical and mechanical requirements, and we will provide a detailed, vetted alternatives list

If you need form/fit/function replacements or second-source options, our team will curate compatible parts for your application

Key Application Areas

Embedded systems that need high pin-count ICs in small space

Communications and networking hardware, gateways, and data interfaces

Industrial control and automation electronics

Test and measurement equipment

Consumer and IoT devices requiring compact, high-density interconnects

Any design where BGA footprint and robust high-speed routing are important

Datasheet

Y-IC hosts the most authoritative datasheet for this product model on our website

We strongly recommend downloading the datasheet from the current product page to get exact electrical specs, ball map, package size, thermal data, and assembly guidelines

Request for Quotation Now

Ready to move forward? Get a Quote on our website now for 88E111-BAB

Limited Time Offer: Competitive pricing and 2370 units currently available (while stocks last)

Learn More: Contact our sales team on the product page for cross-references, lifecycle checks, and technical support