Texas Instruments TMS5702124DZWTQQ1

Mfr. Part

TMS5702124DZWTQQ1

Manufacturer

Texas Instruments (Luminary Micro/TI). Y-IC is a quality distributor of Texas Instruments. We provide genuine TI products and reliable service to help you design, source, and scale with confidence.

Detailed Description

Automotive-grade AEC‑Q100 ARM Cortex‑R4F microcontroller in a 337-ball NFBGA package. 2 MB embedded Flash, 192 KB SRAM, 64 KB EEPROM, 180 MHz CPU, 24-channel 12-bit ADC, rich automotive and industrial interfaces, and wide-temperature operation from −40°C to +125°C.

Key Features

Core: ARM Cortex‑R4F, 16/32‑bit, up to 180 MHz

Program memory: 2 MB Flash

SRAM: 192 KB

EEPROM: 64 KB

ADC: 24 channels, 12‑bit

I/O: 120 pins/balls available

Connectivity: CANbus, LINbus, UART/USART (SCI), SPI/MibSPI, external bus/memory interface (EBI/EMI), IC (per provided spec)

Peripherals: DMA, PWM, watchdog timer (WDT), power‑on reset (POR)

Oscillator: external

Supply voltage: 1.14 V to 3.6 V

Operating temperature: −40°C to +125°C (TA)

Series: Hercules TMS570 ARM Cortex‑R, Automotive, AEC‑Q100

Mounting: surface mount

Compliance: RoHS3 compliant

Key Advantages

Real-time performance for safety-critical control, enabled by the Cortex‑R4F at 180 MHz

Automotive reliability with AEC‑Q100 qualification and wide operating temperature range

Large on-chip Flash and RAM for complex applications and advanced control algorithms

Extensive vehicle and industrial communication buses (CAN, LIN, SPI/MibSPI, UART/SCI, EBI/EMI)

Built-in watchdog and POR for improved system resilience

24-channel 12‑bit ADC for precise sensing and control loops

Broad supply voltage support simplifies power design

Packaging

Type: Ball Grid Array (BGA), NFBGA/LFBGA variants indicated

Ball count: 337

Body size: approx. 16 × 16 (as specified for 337‑NFBGA 16×16; consult datasheet for exact dimensions and pitch)

Material: Molded plastic over organic laminate substrate (typical for BGA); lead‑free, RoHS3 compliant

Pin/ball configuration: 337-ball grid; detailed ball map and pinout are in the datasheet

Thermal characteristics: qualified for −40°C to +125°C ambient; refer to datasheet for θJA/θJC and recommended thermal design

Electrical properties (summary): 1.14–3.6 V supply, 180 MHz core clock, 2 MB Flash, 192 KB SRAM, 64 KB EEPROM, 24×12‑bit ADC, 120 I/O

Supplier device package: 337‑NFBGA (16×16)

Package/case options noted: 337‑NFBGA (16×16), 337‑LFBGA (per provided spec)

Shipment form: Tray

Lifecycle

Current status: Part of TI’s Hercules TMS570 automotive series. No public indication in our latest data that this model is nearing discontinuation. Availability can vary by region and time.

Equivalent or alternative models: A definitive list of drop‑in, pin‑compatible replacements is not provided in our current dataset. For precise, pin‑for‑pin and software‑compatible alternatives within the TMS570 family, please contact our sales team via the Y-IC website. Our team will recommend closest matches based on memory size, package, and interface requirements.

Key Application Areas

Automotive safety and control: body, chassis, gateway, powertrain, motor control

Industrial automation and drives: servo/motion control, PLC/RTU, field bus gateways

Robotics and mechatronics: high‑reliability real‑time control

Transportation and off‑highway equipment: CAN/LIN networked controllers

Energy and infrastructure: protection relays, monitoring with real‑time constraints

Any application needing deterministic real‑time performance and automotive‑grade reliability

Datasheet

Y-IC hosts the most authoritative datasheet for TMS5702124DZWTQQ1 on our product page. We recommend downloading it here to get exact pin maps, electrical limits, timing, thermal data, and design guidelines.

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