Texas Instruments SN65LVDS310ZQCT

Mfr. Part

SN65LVDS310ZQCT

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Programmable 27‑bit serial‑to‑parallel receiver in 48‑ball MicroStar Junior VFBGA (4 x 4 mm). Function listed as Deserializer. Designed for LVDS high‑speed links with a 1.65 V to 1.95 V supply. Input type noted as CMOS and output type as LVDS in the provided parameters; the naming suggests a serial‑to‑parallel LVDS receiver. Please check the datasheet on our website to confirm signal direction and pin usage for your design. RoHS3 compliant. Surface‑mount. Supplier device package: 48‑BGA MicroStar Junior (4x4). Base product family: SN65L. Category: Integrated Circuits (ICs), Interface – Serializers/Deserializers.

Key Features

27 outputs for wide parallel data interfaces

405 Mbps data rate for fast links

1.65 V to 1.95 V single‑supply operation (low‑power 1.8 V domain)

LVDS output, CMOS input (per provided parameters)

Programmable 27‑bit format for flexible mapping

48‑ball MicroStar Junior VFBGA for compact, high‑density layouts

Industrial temperature range −40°C to +85°C (TA)

RoHS3 compliant, lead‑free manufacturing

Tape & Reel packaging for automated SMT assembly

Base family SN65L for ecosystem familiarity and easier design reuse

Key Advantages

High bandwidth with low EMI thanks to LVDS signaling

Low supply voltage reduces power and heat

Small 4 x 4 mm footprint saves PCB space

Programmability helps align with different bus widths and timing schemes

Robust high‑speed link performance for long traces and cables when used within LVDS best practices

Compatible with modern FPGA/ASIC I/O levels and 1.8 V logic systems

Packaging

Package type: 48‑ball MicroStar Junior VFBGA (TI code ZQC), 4 x 4 mm body

Delivery format: Tape & Reel (TR) for pick‑and‑place efficiency

Materials: Molded plastic over mold; lead‑free SAC solder balls; fully RoHS3 compliant

Size: 4 mm x 4 mm, ultra‑compact, fine‑pitch BGA (refer to datasheet for exact ball pitch and height)

Pin/ball configuration: 48 balls; includes power, ground, clock, data, control pins; see datasheet for full ball map and recommended PCB land pattern

Thermal characteristics: Ambient operating −40°C to +85°C; BGA aids heat spreading through PCB copper; follow TI layout and thermal guidance for best results

Electrical properties (from provided specs): Supply 1.65 V to 1.95 V; data rate up to 405 Mbps; input type CMOS; output type LVDS; 1 input channel; 27 outputs

Lifecycle

Status: Active based on current public information

Not indicated as nearing discontinuation in provided data

Exact drop‑in equivalents are not publicly confirmed. Alternative LVDS deserializers with similar bit‑width and speed may exist in TI’s LVDS/SerDes families, but selection depends on interface standard and pinout.

For precise cross‑references and form‑fit‑function alternatives, please contact our sales team via the Y-IC website. We will help you quickly identify compatible replacements.

Key Application Areas

High‑resolution display interfaces (flat panels, industrial HMI)

Camera and imaging data links (bridging parallel buses to serial LVDS and back)

FPGA/ASIC high‑speed I/O expansion and SerDes reception

Industrial automation and motion control data buses

Medical imaging and instrumentation

Automotive infotainment and driver information systems

Data acquisition systems and test equipment backplane links

Embedded systems requiring compact, low‑power high‑speed interfaces

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading it directly from this page to verify electrical specs, timing, ball map, and layout guidance.

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