Texas Instruments OMAP3525ECBBA

Mfr. Part

OMAP3525ECBBA

Manufacturer

Luminary Micro/Texas Instruments. Y-IC is a quality distributor of Texas Instruments products and we will provide you with the best products and services, backed by reliable supply and expert support.

Detailed Description

High-integration embedded microprocessor from the OMAP-35xx series. ARM Cortex-A8 at 600 MHz with NEON SIMD and a C64x+ DSP for multimedia and signal processing. Single-core, 32-bit architecture. Graphics acceleration and LCD controller included. Broad peripheral set: USB 1.x (3), USB 2.0 (1), HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART. LPDDR RAM controller. RoHS3 compliant. Industrial temperature range -40°C to 105°C (Tj). BGA package for surface-mount: 515-POP-FCBGA (12x12), also listed as 515-VFBGA/FCBGA. Supplier device package 515-POP-FCBGA (12x12). Base product number OMAP3525. Standard packing in trays. In-stock quantity: 2544 units.

Key Features

ARM Cortex-A8 core at 600 MHz with NEON SIMD

C64x+ DSP for signal processing and multimedia offload

Single core, 32-bit architecture

Graphics acceleration and integrated LCD controller

LPDDR memory controller with Package-on-Package (PoP) option

USB connectivity: USB 1.x (3) and USB 2.0 (1)

Rich interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

I/O voltages: 1.8 V and 3.0 V

Industrial temperature rating: -40°C to 105°C (Tj)

Surface-mount ball grid array, 515-ball, 12 x 12 mm

RoHS3 compliant

Series: OMAP-35xx

Key Advantages

Balanced performance with low power: ARM + NEON for general compute, DSP for real-time multimedia and signal tasks

High integration reduces external components and BOM cost

PoP memory stacking saves PCB space and simplifies layout

Mature ecosystem and software support (Linux and embedded frameworks)

Scalable family options to match performance and feature needs

Industrial temperature range for demanding environments

Broad peripheral set enables flexible system design without extra controllers

Packaging

Type: FCBGA with PoP capability (Package-on-Package) and VFBGA/FCBGA listings

Size: 12 mm x 12 mm body

Pin count and configuration: 515-ball grid array for robust high-speed interconnect

Material: Organic substrate with flip-chip die; designed for reliable solder interconnect; tray packing for handling

Mounting: Surface mount (SMT), compatible with standard BGA assembly processes

Thermal characteristics: Junction temperature -40°C to +105°C; use solid ground planes, adequate copper area, and airflow or heatsinking as needed for sustained high-load operation

Electrical properties: I/O operation at 1.8 V and 3.0 V rails; dynamic power management supported; follow datasheet rail sequencing and decoupling guidelines for core, I/O, and memory supplies

Lifecycle

Status: Mature product in the OMAP-35xx family. Availability varies by region and schedule. New design-ins should consider long-term supply planning.

Closest family equivalents and variants (pin-compatible or near-compatible, feature trade-offs):

- OMAP3503: ARM Cortex-A8, no DSP, no 3D graphics

- OMAP3515: ARM Cortex-A8 with 3D graphics, no DSP

- OMAP3525: ARM Cortex-A8 with DSP (this device), graphics per variant

- OMAP3530: ARM Cortex-A8 with DSP and 3D graphics (often drop-in within the same 515-ball family, check pinout and BOM)

Modern alternative platforms (not pin-compatible; require board and software changes):

- TI Sitara AM335x series (AM3352, AM3354, AM3358) for ARM Cortex-A8 with wide industrial support

- NXP i.MX35 or i.MX6ULL/i.MX6 series depending on performance and peripheral needs

- STMicroelectronics STM32MP1 series for Cortex-A7 with strong industrial ecosystem

If you need a fully equivalent or current-production replacement and detailed compatibility guidance, contact our sales team via the Y-IC website for up-to-date lifecycle status and substitution options.

Key Application Areas

Industrial HMI panels and control terminals

Medical devices and portable diagnostic instruments

Handheld data terminals, barcode and logistics tools

Consumer multimedia players and smart displays

Automotive infotainment and accessory modules

Robotics controllers and motor control with vision or audio processing

POS systems and kiosks

Gateways, building automation, and smart appliances

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for this product model. We recommend downloading the datasheet directly from this page for accurate specifications, pinouts, power rails, and design guidance.

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