Texas Instruments AM3359BZCZD30

Mfr. Part

AM3359BZCZD30

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Sitara AM3359 ARM Cortex-A8 microprocessor, 300MHz, single-core 32-bit, integrated multimedia NEON SIMD, graphics acceleration, dual Ethernet, dual USB 2.0 with PHY, rich industrial interfaces, and secure features. Package is 324-ball BGA (15x15). RoHS3 compliant. Available quantity: 2530. Category: Integrated Circuits (ICs). Classification: Embedded – Microprocessors. Base Product Number: AM3359. Series: Sitara.

Key Features

Core processor: ARM Cortex-A8

Speed: 300MHz (D30 performance grade)

Architecture: 1 core, 32-bit, NEON SIMD for multimedia

Memory interfaces: LPDDR, DDR2, DDR3, DDR3L controllers

Graphics: On-chip graphics acceleration

Display and touch: LCD controller, touchscreen support

Ethernet: 10/100/1000Mbps x2 (per supplied spec)

USB: USB 2.0 with integrated PHY x2

Security: Cryptography engine, hardware random number generator

Additional interfaces: CAN, I2C, McASP (audio serial), SPI (McSPI), MMC/SD/SDIO, UART

I/O voltages: 1.8V and 3.3V

Operating temperature: TJ -40°C to +90°C

Mounting: Surface mount

Compliance: RoHS3 compliant

Series: TI Sitara AM335x family

Key Advantages

Balanced performance and power for cost-sensitive embedded designs

Rich peripheral set reduces external components and BOM cost

Integrated USB PHYs simplify layout and speed time to market

Hardware acceleration for graphics and multimedia improves UI responsiveness

Industrial interfaces (CAN, McASP, SPI, UART, SDIO) cover many application needs

Secure system design with crypto and RNG

Broad memory support (LPDDR/DDR2/DDR3/DDR3L) for flexible cost and capacity choices

Proven Sitara platform with long-term availability and large ecosystem

RoHS3 compliance supports global regulatory requirements

Packaging

Type: Tube (factory packaging)

Package/Case: 324-NFBGA (15x15); also noted 324-LFBGA

Supplier device package: 324-NFBGA (15x15)

Body size: 15mm x 15mm BGA

Pin/ball configuration: 324-ball grid array; refer to datasheet ball map for exact assignments

Mounting: Surface mount to PCB

Material and finish: Lead-free BGA, RoHS3 compliant

Thermal characteristics: Junction temperature (TJ) -40°C to +90°C; use proper PCB thermal design and airflow

Electrical properties: I/O rails at 1.8V and 3.3V; follow datasheet for core/supply rails and decoupling

Note: Confirm NFBGA vs LFBGA variant at order time to match your footprint

Lifecycle

Current status: Active and widely used in production designs

Not near discontinuation based on typical Sitara AM335x longevity

Recommended equivalents/alternatives (verify features, pinout, and performance needs):

- AM3359BZCZD60, AM3359BZCZD80, AM3359BZCZD100 (same family, higher speed grades)

- AM3358 (similar, feature set varies; commonly used alternative)

- AM3357, AM3356, AM3354, AM3352 (feature differences in graphics, PRU/industrial features, Ethernet)

For cross-family upgrades, TI Sitara AM437x series may be considered for higher performance (confirm compatibility)

If you need exact drop-in replacements or detailed migration guidance, contact our Y-IC sales team via our website for up-to-date options and lifecycle confirmation

Key Application Areas

Industrial HMI and operator panels

PLCs, factory gateways, and industrial networking

IoT edge devices and protocol converters

Building automation and smart energy controllers

Medical electronics and patient monitoring terminals

Test and measurement instruments

Retail and POS terminals, kiosks, and signage

Consumer embedded devices needing graphics and touch

Motor control and audio applications using McASP

Datasheet

Our website hosts the most authoritative datasheet for AM3359BZCZD30. Download it directly from this page to get complete electrical specs, ball maps, timing, and design guidelines.

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