Lattice Semiconductor Corporation LCMXO640E-4FN256C

Mfr. Part

LCMXO640E-4FN256C

Manufacturer

Lattice Semiconductor

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Detailed Description

Non-volatile MachXO FPGA with 640 logic cells and 80 CLBs

159 user IO pins

256 ball fine pitch BGA package 17 mm x 17 mm

Commercial temperature range 0 to 85 C junction

Core supply 1.14 V to 1.26 V typical 1.2 V

Surface mount design

Ideal for instant-on control logic interface bridging and board management

Key Features

640 logic elements cells

80 LABs CLBs

159 user IO pins

MachXO flash-based configuration non-volatile and instant-on

Low power core operation at about 1.2 V

Flexible IO supporting common standards such as LVCMOS LVTTL and differential LVDS where supported

JTAG and SPI programming interfaces

Robust clocking resources and global clock networks

Proven toolchain and IP ecosystem from Lattice

256 FPBGA compact footprint

Key Advantages

Boots fast instant-on for control and sequencing

Single-chip non-volatile architecture simplifies BOM and design

Wide IO capability for easy interfacing to sensors MCUs and legacy buses

Low power helps thermal and battery designs

Small package saves board space

Stable supply with broad market adoption and mature tools

Packaging

Package type 256 ball FPBGA fine pitch

Body size 17 mm x 17 mm low profile BGA

Material organic substrate with lead-free solder balls typical for BGA

Pin configuration 256 balls with up to 159 user IO pins remaining balls are power ground configuration and clock resources

Mounting surface mount reflow compatible

Shipment packaging tray

Thermal characteristics commercial operation 0 to 85 C junction follow datasheet guidance for thermal resistance and power dissipation

Electrical properties core supply 1.14 V to 1.26 V typical 1.2 V IO banks support common 1.8 V 2.5 V 3.3 V standards refer to datasheet for exact supported standards and limits

Lifecycle

Status active as of now and widely used in MachXO applications not announced as near end of life based on public information

Close equivalents in the same family for similar performance and density

- LCMXO640E-3FN256C same package higher speed grade commercial temp

- LCMXO640E-4FN256I same density industrial temperature range

- LCMXO640E-4FT256C same density flip-chip BGA variant where available

- LCMXO640E devices in other packages for pin count or footprint changes for example TN100 or TQFP options depending on availability

Newer alternatives for more features or lower power

- LCMXO2-640 devices MachXO2 family similar density wider package options improved power and features

- MachXO3L devices for higher performance security options and more modern tool support choose an appropriate density for your design

Pin-to-pin and drop-in compatibility varies across packages and families if you need an exact replacement or a vetted alternate contact our sales team via our website and we will recommend the best fit

Key Application Areas

Control logic and state machines

IO expansion and bus bridging SPI I2C UART GPIO

Power sequencing reset and board management

Sensor aggregation and glue logic

LED and simple display drivers

Industrial automation consumer electronics computing peripherals telecom and networking equipment

Datasheet

Our website hosts the most authoritative and current datasheet for LCMXO640E-4FN256C Download it on this page to get full electrical specifications pinouts timing and design guidelines

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